Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
1106396-40 Aries Electronics 1106396-40 15.8196
RFQ
ECAD 9396 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1107254-14 Aries Electronics 1107254-14 8.9809
RFQ
ECAD 5704 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 14 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1107254-18 Aries Electronics 1107254-18 9.7264
RFQ
ECAD 1441 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 18 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
20-350000-10-HT Aries Electronics 20-350000-10-HT 16.8918
RFQ
ECAD 7470 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
18-35W000-10-P Aries Electronics 18-35W000-10-P -
RFQ
ECAD 6435 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Discontinued at SIC - Through Hole - 18-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 144 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
14-354000-10 Aries Electronics 14-354000-10 22.5795
RFQ
ECAD 5643 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 14-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 14 Beryllium Copper 0.050" (1.27mm) Brass - -
18-354000-10 Aries Electronics 18-354000-10 -
RFQ
ECAD 8885 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 18-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 18 Beryllium Copper 0.050" (1.27mm) Brass - -
24-354000-20 Aries Electronics 24-354000-20 28.6007
RFQ
ECAD 2260 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass - -
32-354000-10 Aries Electronics 32-354000-10 -
RFQ
ECAD 5570 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 32-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 32 Beryllium Copper 0.100" (2.54mm) Brass - -
24-650000-10-P Aries Electronics 24-650000-10-P -
RFQ
ECAD 4087 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 24-650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 98 - - 0.050" (1.27mm) - - Tin-Lead - SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109522 Aries Electronics 1109522 14.0327
RFQ
ECAD 6436 0.00000000 Aries Electronics Correct-A-Chip® 1109522 Bulk Active - Through Hole - 1109522 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing JEDEC 8 Beryllium Copper - Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-652000-10-P Aries Electronics 32-652000-10-P -
RFQ
ECAD 9015 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Discontinued at SIC - Through Hole - 32-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-652000-10 Aries Electronics 84-652000-10 136.7750
RFQ
ECAD 1239 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-353000-10 Aries Electronics 20-353000-10 -
RFQ
ECAD 5555 0.00000000 Aries Electronics Correct-A-Chip® 353000 Bulk Active - Through Hole Socket Included 20-3530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead - PLCC DIP, 0.3" (7.62mm) Row Spacing 20 Phosphor Bronze 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-505-110-P Aries Electronics 68-505-110-P -
RFQ
ECAD 8963 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 68-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 72 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
84-505-110-P Aries Electronics 84-505-110-P -
RFQ
ECAD 3212 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Discontinued at SIC - Through Hole - 84-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 56 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 84 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
28-505-111 Aries Electronics 28-505-111 14.1462
RFQ
ECAD 1685 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 28-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 28 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
44-505-111 Aries Electronics 44-505-111 14.3039
RFQ
ECAD 8447 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 44-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 44 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
68-505-110-RC Aries Electronics 68-505-110-RC -
RFQ
ECAD 3667 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 68-505 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
20-651000-10 Aries Electronics 20-651000-10 32.8877
RFQ
ECAD 9926 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 20-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
32-655000-10-P Aries Electronics 32-655000-10-P -
RFQ
ECAD 3029 0.00000000 Aries Electronics Correct-A-Chip® 655000 Bulk Discontinued at SIC - Through Hole - 32-6550 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 72 - - 0.020" (0.50mm) Silver - Tin-Lead 200.0µin (5.08µm) TSOP DIP, 0.6" (15.24mm) Row Spacing 32 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
08-666000-00 Aries Electronics 08-666000-00 13.9379
RFQ
ECAD 1912 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 08-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 8 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
12-666000-00 Aries Electronics 12-666000-00 13.3109
RFQ
ECAD 8698 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 12-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 12 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
26-665000-00 Aries Electronics 26-665000-00 -
RFQ
ECAD 8744 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 26-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 26 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1109252 Aries Electronics 1109252 -
RFQ
ECAD 9936 0.00000000 Aries Electronics Correct-A-Chip® 1109252 Bulk Active - Through Hole - 1109252 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead - PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.070" (1.78mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-304538-10 Aries Electronics 68-304538-10 78.9650
RFQ
ECAD 7800 0.00000000 Aries Electronics Correct-A-Chip® 304538 Bulk Active - Through Hole - 68-3045 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
22-304504-18 Aries Electronics 22-304504-18 -
RFQ
ECAD 8679 0.00000000 Aries Electronics Correct-A-Chip® 304504 Bulk Active - Through Hole - 22-3045 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.4" (10.16mm) Row Spacing 22 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
97-80C251 Aries Electronics 97-80C251 -
RFQ
ECAD 3270 0.00000000 Aries Electronics - Bulk Active - - - 97-80C2 - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - - -
16-35W000-11-RC-P (220 UP) Aries Electronics 16-35W000-11-RC-P (220 UP) -
RFQ
ECAD 2855 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Discontinued at SIC - Through Hole - 16-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 220 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-35W000-11-RC Aries Electronics 28-35W000-11-RC 22.0264
RFQ
ECAD 9822 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 28-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 - - - - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 28 - 0.050" (1.27mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse