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Socket Adapters(276)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
20-354W00-10 | - |  |
5689 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354W00 | Tube | Active | 105°C | Through Hole | - | 20-354W | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | DIP, 0.3" (7.62mm) Row Spacing | SOWIC | 20 | Beryllium Copper | 0.050" (1.27mm) | Brass | - | |||
 |
220-3342-19-0602J | 36.0200 | |
7373 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 220 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 20 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
28-651000-10 | 32.8712 | |
7418 | 0.00000000 | Aries Electronics | Correct-A-Chip® 651000 | Bulk | Active | - | Through Hole | - | 28-6510 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 17 | 1 A | - | - | 0.026" (0.65mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SSOP | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.145" (3.68mm) | FR4 Epoxy Glass | ||
 |
20-351000-10 | 23.7084 | |
3602 | 0.00000000 | Aries Electronics | Correct-A-Chip® 351000 | Bulk | Active | - | Through Hole | - | 20-3510 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 19 | - | - | 0.026" (0.65mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SSOP | DIP, 0.3" (7.62mm) Row Spacing | 20 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
|
52-505-110 | - | |
4811 | 0.00000000 | Aries Electronics | Correct-A-Chip® 505 | Bulk | Obsolete | - | Through Hole | - | Solder | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | PGA | 52 | - | 0.050" (1.27mm) | Brass | 0.150" (3.81mm) | FR4 Epoxy Glass | ||||
|
08-350000-10-HT | 16.3469 | |
2419 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Active | - | Through Hole | - | 08-3500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | Q5484707 | EAR99 | 8536.69.4040 | 48 | - | - | 0.050" (1.27mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 8 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | Polyimide (PI) | ||
|
20-555000-00 | 17.5400 | |
1934 | 0.00000000 | Aries Electronics | Correct-A-Chip® 555000 | Bulk | Active | 105°C | Surface Mount | - | 20-5550 | Solder | - | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.026" (0.65mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SSOP | SOWIC | 20 | - | 0.050" (1.27mm) | Brass | - | FR4 Epoxy Glass | |||
 |
20-350001-11-RC | 18.9582 | |
4055 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Tube | Active | - | Through Hole | - | 20-3500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A752 | EAR99 | 8536.69.4040 | 19 | - | - | 0.050" (1.27mm) | - | - | Tin | 200.0µin (5.08µm) | SOJ | DIP, 0.3" (7.62mm) Row Spacing | 20 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||
 |
32-650000-11-RC | 52.5620 | |
7983 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Tube | Active | - | Through Hole | - | 32-6500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 15 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOJ | DIP, 0.6" (15.24mm) Row Spacing | 32 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
 |
32-450001-11-RC | 111.5053 | |
3719 | 0.00000000 | Aries Electronics | Correct-A-Chip® 450001 | Tube | Active | - | Through Hole | - | 32-4500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A761 | EAR99 | 8536.69.4040 | 15 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOJ | DIP, 0.4" (10.16mm) Row Spacing | 32 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||
 |
214-3339-19-0602J | 31.9800 | |
7 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 214 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 14 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
224-5248-09-0602J | - | |
7944 | 0.00000000 | 3M | Textool™ | Box | Obsolete | -55°C ~ 125°C | Through Hole | - | 224 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 24 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
228-1277-29-0602J | - | |
4618 | 0.00000000 | 3M | Textool™ | Box | Obsolete | -55°C ~ 125°C | Through Hole | - | 228 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 28 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
228-1290-09-0602J | 31.1700 | |
6 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 228 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.4" (10.16mm) Row Spacing | DIP, 0.4" (10.16mm) Row Spacing | 28 | Beryllium Copper | 0.070" (1.78mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
228-1290-29-0602J | - | |
1665 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 228 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.4" (10.16mm) Row Spacing | DIP, 0.4" (10.16mm) Row Spacing | 28 | Beryllium Copper | 0.070" (1.78mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
232-1285-09-0602J | - | |
7501 | 0.00000000 | 3M | Textool™ | Box | Obsolete | -55°C ~ 125°C | Through Hole | Closed Frame | 232 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 32 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
232-1285-39-0602J | - | |
7028 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 232 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 32 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
240-1280-39-0602J | 27.0881 | |
8688 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 240 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 100 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 40 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
240-3639-09-0602J | - | |
5644 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 240 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 1.0" (25.40mm) Row Spacing | DIP, 1.0" (25.40mm) Row Spacing | 40 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
242-1281-29-0602J | - | |
5045 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 242 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 42 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
264-1300-09-0602J | - | |
6714 | 0.00000000 | 3M | Textool™ | Box | Obsolete | -55°C ~ 125°C | Through Hole | Closed Frame | 264 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.8" (20.32mm) Row Spacing | DIP, 0.8" (20.32mm) Row Spacing | 64 | Beryllium Copper | 0.070" (1.78mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
|
28-450001-11-RC | 85.2557 | |
7874 | 0.00000000 | Aries Electronics | Correct-A-Chip® 450001 | Bulk | Active | - | Through Hole | - | 28-4500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 14 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOJ | DIP, 0.4" (10.16mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
|
97-AQ132D-P | - | |
6013 | 0.00000000 | Aries Electronics | Correct-A-Chip® 97-AQ132D | Bulk | Discontinued at SIC | 105°C | Through Hole | - | 97-AQ13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.8000 | 42 | - | - | 0.025" (0.64mm) | Gold | - | Tin-Lead | 200.0µin (5.08µm) | PQFP | PGA | 132 | - | - | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
|
32-650000-10-P | - | |
7729 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Tube | Discontinued at SIC | - | Through Hole | - | 32-6500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | Q7343195 | EAR99 | 8536.69.4040 | 72 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | - | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 32 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | ||
|
1106396-36 | 14.6000 | |
2866 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1106396 | Bulk | Active | - | Through Hole | - | 1106396 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 36 | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | ||
|
1107254-08 | 8.9041 | |
2085 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1107254 | Bulk | Active | - | Through Hole | - | 1107254 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 8 | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | ||
|
1107254-40 | 15.8196 | |
7315 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1107254 | Bulk | Active | - | Through Hole | - | 1107254 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 40 | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | ||
|
14-350000-10-HT | 16.8918 | |
7294 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Active | - | Through Hole | - | 14-3500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 28 | - | - | 0.050" (1.27mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 14 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | Polyimide (PI) | |||
|
18-350000-10-HT | - | |
6888 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Active | - | Through Hole | - | 18-3500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 21 | - | - | 0.050" (1.27mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 18 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | Polyimide (PI) | |||
|
24-350000-10-HT | 15.1750 | |
2454 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Active | - | Through Hole | - | 24-3500 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 16 | - | - | 0.050" (1.27mm) | Tin | - | Tin-Lead | 200.0µin (5.08µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | Polyimide (PI) |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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