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Socket Adapters(276)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
20-354000-21-RC | 25.6063 |  |
5084 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 20-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 20 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | ||
|
24-354000-21-RC | 28.6007 | |
2305 | 0.00000000 | Aries Electronics | Correct-A-Chip® 354000 | Bulk | Active | - | Surface Mount | - | 24-3540 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | DIP, 0.3" (7.62mm) Row Spacing | SOIC | 24 | Beryllium Copper | 0.050" (1.27mm) | Brass | 0.089" (2.28mm) | - | ||
|
28-350002-11-RC-P | - | |
5357 | 0.00000000 | Aries Electronics | Correct-A-Chip® 350000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-3500 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 154 | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.3" (7.62mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
 |
LCQT-QFP0.5-40-1 | 9.9080 | |
1766 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | A868AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.020" (0.50mm) | - | - | Gold | Flash | Multiple Packages | QFP | 40 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | ||
 |
LCQT-QFP0.5-52 | 9.9080 | |
2982 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | A870AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.020" (0.50mm) | - | - | Gold | Flash | Multiple Packages | QFP | 52 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | ||
 |
LCQT-QFP0.65-80 | 9.9080 | |
8040 | 0.00000000 | Aries Electronics | Correct-A-Chip® | Tube | Active | -55°C ~ 125°C | Through Hole | - | LCQT-QF | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | A877AR | EAR99 | 8536.69.4040 | 17 | Polyester | UL94 V-0 | 0.026" (0.65mm) | - | - | Gold | Flash | Multiple Packages | QFP | 80 | - | 0.100" (2.54mm) | Brass | 0.236" (6.00mm) | FR4 Epoxy Glass | ||
|
24-650000-11-RC-P | - | |
3615 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 24-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 98 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 24 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
|
28-650000-11-RC-P | - | |
8101 | 0.00000000 | Aries Electronics | Correct-A-Chip® 650000 | Bulk | Discontinued at SIC | - | Through Hole | - | 28-650 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 84 | - | - | 0.050" (1.27mm) | Gold | - | Gold | 10.0µin (0.25µm) | SOIC | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
|
16-304633-18 | - | |
2618 | 0.00000000 | Aries Electronics | Correct-A-Chip® 304633 | Bulk | Active | 105°C | Through Hole | - | 16-3046 | Solder | - | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | DIP, 0.3" (7.62mm) Row Spacing | 16 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
|
28-651000-11-RC | - | |
9169 | 0.00000000 | Aries Electronics | Correct-A-Chip® 651000 | Tube | Obsolete | - | Through Hole | - | Solder | - | ROHS3 Compliant | Not Applicable | REACH Unaffected | A759 | EAR99 | 8536.69.4040 | 5 | 1 A | - | - | 0.026" (0.65mm) | - | - | Gold | 10.0µin (0.25µm) | SSOP | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.145" (3.68mm) | FR4 Epoxy Glass | ||
|
32-652000-10 | 30.2367 | |
6433 | 0.00000000 | Aries Electronics | Correct-A-Chip® 652000 | Bulk | Active | - | Through Hole | - | 32-6520 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | Q2805019 | EAR99 | 8536.69.4040 | 15 | 1 A | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | DIP, 0.6" (15.24mm) Row Spacing | 32 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |
 |
216-3340-19-0602J | 32.5200 | |
27 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 216 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 16 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
224-1275-29-0602J | 26.7900 | |
38 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 224 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 24 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
224-5248-19-0602J | - | |
9869 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 224 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 24 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | ||||
 |
228-1277-19-0602J | 38.8600 | |
4 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 228 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 28 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | ||||
 |
228-1277-39-0602J | 37.8300 | |
5714 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 228 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 28 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | ||||
 |
228-4817-19-0602J | - | |
4692 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 228 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.4" (10.16mm) Row Spacing | DIP, 0.4" (10.16mm) Row Spacing | 28 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | ||||
 |
232-1285-19-0602J | 32.6200 | |
12 | 0.00000000 | 3M | Textool™ | Tube | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 232 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 32 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
242-1281-19-0602J | - | |
9049 | 0.00000000 | 3M | Textool™ | Box | Obsolete | -55°C ~ 125°C | Through Hole | Closed Frame | Wire Wrap | download | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 42 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||||
 |
242-1293-09-0602J | 23.7717 | |
1129 | 0.00000000 | 3M | Textool™ | Tube | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 242 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 42 | Beryllium Copper | 0.070" (1.78mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
248-1282-29-0602J | 40.5200 | |
166 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 248 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.6" (15.24mm) Row Spacing | 48 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
 |
264-4493-19-0602J | 43.6000 | |
5 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | - | 264 | Wire Wrap | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.9" (22.86mm) Row Spacing | DIP, 0.9" (22.86mm) Row Spacing | 64 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.620" (15.75mm) | - | |||
 |
218-3341-09-0602J | - | |
5453 | 0.00000000 | 3M | Textool™ | Tube | Active | -55°C ~ 125°C | Through Hole | - | 218 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.3" (7.62mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 18 | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.130" (3.30mm) | - | |||
|
800-12-6-1-3007 | 150.1888 | |
7801 | 0.00000000 | TE Connectivity Deutsch Connectors | - | Bag | Active | - | - | - | 800 | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | 0000.00.0000 | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||||
|
800-37-6-1 | 212.4460 | |
7539 | 0.00000000 | TE Connectivity Deutsch Connectors | - | Bag | Active | - | - | - | 800 | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | 0000.00.0000 | 1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||||
 |
DX1036 | - | |
7802 | 0.00000000 | Xeltek Inc. | DX | Retail Package | Active | - | - | Closed Frame | Solder | - | 2578-DX1036 | EAR99 | 8536.69.4040 | 1 | - | - | 0.050" (1.27mm) | - | - | - | - | SOIC | SOIC | 32 | - | 0.050" (1.27mm) | - | - | - | ||||||
 |
MIKROE-230 | - | |
7681 | 0.00000000 | MikroElektronika | - | Bulk | Active | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1471-1151 | EAR99 | 8473.30.2000 | 1 | - | - | - | - | - | - | - | AT90PWM1 | DIP | 40 | - | - | - | - | - | |||
|
1110267-N | 114.9875 | |
7767 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1110267-N | Bulk | Active | - | Through Hole | - | 1110267 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | - | - | - | - | - | Tin-Lead | 200.0µin (5.08µm) | PLCC | DIP, 0.9" (22.86mm) Row Spacing | 68 | - | 0.100" (2.54mm) | Brass | - | FR4 Epoxy Glass | |||
|
20-35W000-10 | 16.0113 | |
3908 | 0.00000000 | Aries Electronics | Correct-A-Chip® 35W000 | Bulk | Active | - | Through Hole | - | 20-35W0 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 19 | - | - | 0.050" (1.27mm) | - | - | Tin-Lead | - | SOIC-W | DIP, 0.3" (7.62mm) Row Spacing | 20 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||
 |
290-1294-29-0602J | - | |
1056 | 0.00000000 | 3M | Textool™ | Box | Active | -55°C ~ 125°C | Through Hole | Closed Frame | 290 | Solder | download | RoHS Compliant | 1 (Unlimited) | EAR99 | 8536.69.4040 | 10 | 1 A | Polysulfone (PSU), Glass Filled | UL94 V-0 | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Gold | 30.0µin (0.76µm) | DIP, 0.9" (22.86mm) Row Spacing | DIP, 0.9" (22.86mm) Row Spacing | 90 | Beryllium Copper | 0.070" (1.78mm) | Beryllium Copper | 0.130" (3.30mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)