Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
68-652000-11-RC Aries Electronics 68-652000-11-RC 62.0700
RFQ
ECAD 9670 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 68-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-653000-11-RC Aries Electronics 68-653000-11-RC 64.4900
RFQ
ECAD 9499 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 68-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-351000-11-RC Aries Electronics 24-351000-11-RC 22.6997
RFQ
ECAD 6958 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 24-3510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 - - 0.026" (0.65mm) Gold - Gold 10.0µin (0.25µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-307349-11-RC Aries Electronics 16-307349-11-RC -
RFQ
ECAD 7760 0.00000000 Aries Electronics Correct-A-Chip® 307349 Bulk Active - Through Hole - 16-3073 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) PLCC DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
800-3-6-1 TE Connectivity Deutsch Connectors 800-3-6-1 80.5872
RFQ
ECAD 5335 0.00000000 TE Connectivity Deutsch Connectors - Bag Active - - - 800 - - ROHS3 Compliant 1 (Unlimited) REACH Affected 0000.00.0000 1 - - - - - - - - - - - - - -
PA-TS1D6SM18-56 Logical Systems Inc. PA-TS1D6SM18-56 28.0000
RFQ
ECAD 3278 0.00000000 Logical Systems Inc. - Bulk Active - Through Hole - PA-TS1 Solder download RoHS Compliant Not Applicable 3A992A 8536.69.4040 1 - - 0.020" (0.50mm) - - - - TSOP DIP 56 - 0.100" (2.54mm) - 0.125" (3.18mm) -
PA-SOD6SM18-40 Logical Systems Inc. PA-SOD6SM18-40 20.0000
RFQ
ECAD 2079 0.00000000 Logical Systems Inc. - Bulk Active - Through Hole - PA-SOD Solder download RoHS Compliant Not Applicable 3A992A 8536.69.4040 1 - - 0.050" (1.27mm) - - - - SOIC DIP, 0.6" (15.24mm) Row Spacing 40 - 0.100" (2.54mm) - 0.125" (3.18mm) -
68-653000-10 Aries Electronics 68-653000-10 157.0867
RFQ
ECAD 6276 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 68-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
S894-13-007-25-050000 Mill-Max Manufacturing Corp. S894-13-007-25-050000 -
RFQ
ECAD 1 0.00000000 Mill-Max Manufacturing Corp. * Bulk Active - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.8000 1
PA-TS1D6SM18-40 Logical Systems Inc. PA-TS1D6SM18-40 20.0000
RFQ
ECAD 6154 0.00000000 Logical Systems Inc. - Bulk Active - Through Hole - PA-TS1 Solder download RoHS Compliant Not Applicable 3A992A 8536.69.4040 1 - - 0.020" (0.50mm) - - - - TSOP DIP 40 - 0.100" (2.54mm) - 0.125" (3.18mm) -
264-4493-09-0602J 3M 264-4493-09-0602J 49.5800
RFQ
ECAD 10 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 264 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 300.0µin (7.62µm) DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing 64 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
228-4817-09-0602J 3M 228-4817-09-0602J 28.0200
RFQ
ECAD 13 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole - 228 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing 28 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
800-12-6-1 TE Connectivity Deutsch Connectors 800-12-6-1 121.3348
RFQ
ECAD 2371 0.00000000 TE Connectivity Deutsch Connectors - Bag Active - - - 800 - - ROHS3 Compliant 1 (Unlimited) REACH Affected 0000.00.0000 1 - - - - - - - - - - - - - -
64-304121-00 Aries Electronics 64-304121-00 -
RFQ
ECAD 5790 0.00000000 Aries Electronics - Obsolete - Through Hole - Solder download RoHS non-compliant Not Applicable REACH Unaffected Q4124130 EAR99 8536.69.4040 1 - - 0.031" (0.80mm) - - Tin-Lead 200.0µin (5.08µm) TQFP QFP 64 - 0.031" (0.80mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
24-354W00-10 Aries Electronics 24-354W00-10 -
RFQ
ECAD 4015 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Tube Active 105°C Through Hole - 24-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 24 Beryllium Copper 0.050" (1.27mm) Brass -
10-666000-00 Aries Electronics 10-666000-00 14.1841
RFQ
ECAD 8968 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 10-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 10 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
96-160M65 Aries Electronics 96-160M65 -
RFQ
ECAD 4133 0.00000000 Aries Electronics Correct-A-Chip® 96-160M65 Bulk Active - Through Hole - 96-160M Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 160 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
220-3342-09-0602J 3M 220-3342-09-0602J 26.2600
RFQ
ECAD 101 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole Closed Frame 220 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 20 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
97-68340-P Aries Electronics 97-68340-P -
RFQ
ECAD 8555 0.00000000 Aries Electronics Correct-A-Chip® 68340 Bulk Discontinued at SIC 105°C Through Hole - 97-6834 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1572280 EAR99 8536.69.4040 30 - - 0.026" (0.65mm) Tin - Tin 200.0µin (5.08µm) QFP PGA 144 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-652000-10 Aries Electronics 28-652000-10 32.7565
RFQ
ECAD 6003 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 28-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected 28-652000-10-NDR EAR99 8536.69.4040 17 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
240-1280-19-0602J 3M 240-1280-19-0602J 45.2100
RFQ
ECAD 22 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole Closed Frame 240 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
14-354W00-10 Aries Electronics 14-354W00-10 -
RFQ
ECAD 7044 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Tube Active 105°C Through Hole - 14-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 14 Beryllium Copper 0.050" (1.27mm) Brass -
14-35W000-10 Aries Electronics 14-35W000-10 15.3500
RFQ
ECAD 5726 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 14-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 27 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-35W000-10 Aries Electronics 18-35W000-10 15.6419
RFQ
ECAD 4588 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 18-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
95-100I25 Aries Electronics 95-100I25 -
RFQ
ECAD 2165 0.00000000 Aries Electronics - Obsolete - Through Hole - Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 100 Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) FR4 Epoxy Glass
96-080M80 Aries Electronics 96-080M80 -
RFQ
ECAD 8561 0.00000000 Aries Electronics - Obsolete - Through Hole - Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.031" (0.80mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 80 Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) FR4 Epoxy Glass
1106396-14 Aries Electronics 1106396-14 8.9809
RFQ
ECAD 6984 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 14 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1106396-16 Aries Electronics 1106396-16 9.2111
RFQ
ECAD 4612 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 16 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1106396-20 Aries Electronics 1106396-20 9.7264
RFQ
ECAD 7415 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 20 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1106396-32 Aries Electronics 1106396-32 13.4155
RFQ
ECAD 7267 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 32 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse