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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
1109342 Aries Electronics 1109342 88.8540
RFQ
ECAD 3355 0.00000000 Aries Electronics Correct-A-Chip® 1109342 Bulk Active 105°C Through Hole - 1109342 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1156143 EAR99 8536.69.4040 1 Polyphenylene Sulfide (PPS) UL94 V-0 - Tin 150.0µin (3.81µm) Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 Phosphor Bronze 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-450001-10 Aries Electronics 32-450001-10 60.7475
RFQ
ECAD 5891 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Active - Through Hole - 32-4500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A324 EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - - - SOJ DIP, 0.4" (10.16mm) Row Spacing 32 - 0.100" (2.54mm) - 0.125" (3.18mm) FR4 Epoxy Glass
08-665000-00 Aries Electronics 08-665000-00 16.7954
RFQ
ECAD 3246 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 08-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 8 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1107254-20 Aries Electronics 1107254-20 9.7264
RFQ
ECAD 3690 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 20 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
97-56001 Aries Electronics 97-56001 99.8618
RFQ
ECAD 6309 0.00000000 Aries Electronics Correct-A-Chip® 97-56001 Bulk Active - Through Hole - 97-5600 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) QFP PGA 169 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-652000-10 Aries Electronics 68-652000-10 108.8925
RFQ
ECAD 4945 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 68-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-352000-10 Aries Electronics 28-352000-10 -
RFQ
ECAD 7792 0.00000000 Aries Electronics Correct-A-Chip® 352000 Bulk Active - Through Hole - 28-3520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead - PLCC DIP, 0.3" (7.62mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
96-208M50 Aries Electronics 96-208M50 -
RFQ
ECAD 1019 0.00000000 Aries Electronics Correct-A-Chip® 96-208M50 Bulk Active - Through Hole - 96-208M Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 - - 0.020" (0.50mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 208 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
96-128M80 Aries Electronics 96-128M80 -
RFQ
ECAD 3623 0.00000000 Aries Electronics Correct-A-Chip® Obsolete 105°C Through Hole - Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 - - 0.031" (0.80mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 128 Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) FR4 Epoxy Glass
97-AQ132D Aries Electronics 97-AQ132D 99.6900
RFQ
ECAD 6430 0.00000000 Aries Electronics Correct-A-Chip® 97-AQ132D Bulk Active - Through Hole - 97-AQ13 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) PQFP PGA 132 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
26-665000-00 Aries Electronics 26-665000-00 -
RFQ
ECAD 8744 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 26-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 26 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
800-27-6-1 TE Connectivity Deutsch Connectors 800-27-6-1 18.9540
RFQ
ECAD 1965 0.00000000 TE Connectivity Deutsch Connectors - Bag Active - - - 800 - - ROHS3 Compliant 1 (Unlimited) REACH Affected 0000.00.0000 1 - - - - - - - - - - - - - -
24-35W000-10 Aries Electronics 24-35W000-10 16.1856
RFQ
ECAD 9519 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 24-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-350000-10-HT Aries Electronics 20-350000-10-HT 16.8918
RFQ
ECAD 7470 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
84-653000-10 Aries Electronics 84-653000-10 157.0867
RFQ
ECAD 2683 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 84-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-653000-10 Aries Electronics 28-653000-10 42.7500
RFQ
ECAD 138 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 28-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
56-184M65 Aries Electronics 56-184M65 -
RFQ
ECAD 5031 0.00000000 Aries Electronics - Obsolete - - - - - Not applicable 1 (Unlimited) REACH Unaffected A162 EAR99 8536.69.4040 1 - - - - - - - QFP PGA 184 - - - - -
95-132I25 Aries Electronics 95-132I25 -
RFQ
ECAD 1879 0.00000000 Aries Electronics Correct-A-Chip® 95-132I25 Bulk Active - Through Hole - 95-132I Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 132 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
214-3339-09-0602J 3M 214-3339-09-0602J 23.7800
RFQ
ECAD 16 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 214 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 14 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
216-3340-09-0602J 3M 216-3340-09-0602J 25.0900
RFQ
ECAD 128 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole Closed Frame 216 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 16 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
224-1275-09-0602J 3M 224-1275-09-0602J 22.4228
RFQ
ECAD 4114 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 224 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 24 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
16-354000-10 Aries Electronics 16-354000-10 23.3322
RFQ
ECAD 7528 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 16-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass - -
16-354000-20 Aries Electronics 16-354000-20 23.3322
RFQ
ECAD 2998 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 16-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass - -
LCQT-QFP0.8-32 Aries Electronics LCQT-QFP0.8-32 10.6353
RFQ
ECAD 6452 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A866AR EAR99 8536.69.4040 15 Polyester UL94 V-0 0.031" (0.80mm) - - Gold Flash Multiple Packages QFP 32 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
LCQT-QFP0.5-40 Aries Electronics LCQT-QFP0.5-40 9.9080
RFQ
ECAD 8814 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A867AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.020" (0.50mm) - - Gold Flash Multiple Packages QFP 40 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
LCQT-QFP0.65-52 Aries Electronics LCQT-QFP0.65-52 9.9080
RFQ
ECAD 4496 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A871AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.026" (0.65mm) - - Gold Flash Multiple Packages QFP 52 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
LCQT-QFP0.5-60 Aries Electronics LCQT-QFP0.5-60 9.9080
RFQ
ECAD 4153 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A872AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.020" (0.50mm) - - Gold Flash Multiple Packages QFP 60 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
LCQT-QFP0.5-80 Aries Electronics LCQT-QFP0.5-80 9.9080
RFQ
ECAD 7271 0.00000000 Aries Electronics Correct-A-Chip® Tube Active -55°C ~ 125°C Through Hole - LCQT-QF Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A876AR EAR99 8536.69.4040 17 Polyester UL94 V-0 0.020" (0.50mm) - - Gold Flash Multiple Packages QFP 80 - 0.100" (2.54mm) Brass 0.236" (6.00mm) FR4 Epoxy Glass
20-354W00-10 Aries Electronics 20-354W00-10 -
RFQ
ECAD 5689 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Tube Active 105°C Through Hole - 20-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 20 Beryllium Copper 0.050" (1.27mm) Brass -
220-3342-19-0602J 3M 220-3342-19-0602J 36.0200
RFQ
ECAD 7373 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 220 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 20 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse