Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
1107254-16 Aries Electronics 1107254-16 9.2111
RFQ
ECAD 7935 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 16 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1107254-32 Aries Electronics 1107254-32 13.4155
RFQ
ECAD 7364 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 32 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1107254-36 Aries Electronics 1107254-36 14.6000
RFQ
ECAD 8369 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 36 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
16-350000-10-HT Aries Electronics 16-350000-10-HT 17.6546
RFQ
ECAD 6655 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 16-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
10-350000-10-HT Aries Electronics 10-350000-10-HT 17.6546
RFQ
ECAD 7171 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 10-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 10 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
12-350000-10-HT Aries Electronics 12-350000-10-HT 17.6546
RFQ
ECAD 7501 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 12-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) Tin - Tin-Lead 200.0µin (5.08µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 12 - 0.100" (2.54mm) Brass 0.125" (3.18mm) Polyimide (PI)
14-354000-20 Aries Electronics 14-354000-20 22.5795
RFQ
ECAD 2446 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 14-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 14 Beryllium Copper 0.050" (1.27mm) Brass - -
20-354000-20 Aries Electronics 20-354000-20 25.5738
RFQ
ECAD 8661 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 20-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 20 Beryllium Copper 0.050" (1.27mm) Brass - -
08-305479-10 Aries Electronics 08-305479-10 14.3910
RFQ
ECAD 4345 0.00000000 Aries Electronics Correct-A-Chip® 305479 Bulk Active - Through Hole - 08-3054 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC JEDEC 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-352000-10 Aries Electronics 20-352000-10 -
RFQ
ECAD 3969 0.00000000 Aries Electronics Correct-A-Chip® 352000 Bulk Active - Through Hole - 20-3520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead - PLCC DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-353000-10 Aries Electronics 28-353000-10 -
RFQ
ECAD 6908 0.00000000 Aries Electronics Correct-A-Chip® 353000 Bulk Active - Through Hole Socket Included 28-3530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead - PLCC DIP, 0.3" (7.62mm) Row Spacing 28 Phosphor Bronze 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
95-132I25-P Aries Electronics 95-132I25-P -
RFQ
ECAD 8986 0.00000000 Aries Electronics Correct-A-Chip® 95-132I25 Bulk Discontinued at SIC - Through Hole - 95-132I Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 - - 0.025" (0.64mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 132 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
97-56001-P Aries Electronics 97-56001-P -
RFQ
ECAD 3313 0.00000000 Aries Electronics Correct-A-Chip® 97-56001 Bulk Discontinued at SIC - Through Hole - 97-5600 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) QFP PGA 169 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-505-110 Aries Electronics 28-505-110 12.8587
RFQ
ECAD 6414 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 28-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 28 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
84-505-111 Aries Electronics 84-505-111 67.6843
RFQ
ECAD 9201 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 84-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 84 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
24-651000-10 Aries Electronics 24-651000-10 32.8877
RFQ
ECAD 3712 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 24-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
14-666000-00 Aries Electronics 14-666000-00 13.5549
RFQ
ECAD 1493 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 14-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 14 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
22-666000-00 Aries Electronics 22-666000-00 14.5129
RFQ
ECAD 9825 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 22-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 22 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
12-665000-00 Aries Electronics 12-665000-00 -
RFQ
ECAD 9343 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 12-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 12 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
18-665000-00 Aries Electronics 18-665000-00 15.8116
RFQ
ECAD 1432 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 18-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 18 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
28-665000-00 Aries Electronics 28-665000-00 17.2292
RFQ
ECAD 9413 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 28-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 28 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1111841-8 Aries Electronics 1111841-8 9.3263
RFQ
ECAD 8095 0.00000000 Aries Electronics Correct-A-Chip® 1111841 Bulk Active - Through Hole - 1111841 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.020" (0.50mm) - - Tin-Lead 200.0µin (5.08µm) MSOP DIP, 0.3" (7.62mm) Row Spacing 8 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1111903 Aries Electronics 1111903 -
RFQ
ECAD 8590 0.00000000 Aries Electronics Correct-A-Chip® 1111903 Bulk Active - Through Hole - 1111903 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOWIC DIP, 0.4" (10.16mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-301550-10 Aries Electronics 20-301550-10 16.6559
RFQ
ECAD 5320 0.00000000 Aries Electronics Correct-A-Chip® 301550 Bulk Active - Through Hole - 20-3015 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC PLCC 20 - 0.100" (2.54mm) Brass 0.030" (0.76mm) FR4 Epoxy Glass
20-301550-20 Aries Electronics 20-301550-20 16.6559
RFQ
ECAD 4166 0.00000000 Aries Electronics Correct-A-Chip® 301550 Bulk Active - Through Hole - 20-3015 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC PLCC 20 - 0.100" (2.54mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
7131-108-18 Aries Electronics 7131-108-18 -
RFQ
ECAD 1718 0.00000000 Aries Electronics - Bulk Active - Through Hole - 7131-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead 200.0µin (5.08µm) HB2E Relay DIP, 0.3" (7.62mm) Row Spacing 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
14-35W000-11-RC Aries Electronics 14-35W000-11-RC -
RFQ
ECAD 2907 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 14-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 27 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 14 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-35W000-11-RC Aries Electronics 18-35W000-11-RC 22.3833
RFQ
ECAD 1533 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 18-35W0 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC-W DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-354000-11-RC Aries Electronics 16-354000-11-RC 18.2038
RFQ
ECAD 4813 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 16-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 16 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
20-354000-11-RC Aries Electronics 20-354000-11-RC 25.6063
RFQ
ECAD 7210 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 20-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 20 Beryllium Copper 0.050" (1.27mm) Brass 0.030" (0.76mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse