Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
96-100M65 Aries Electronics 96-100M65 -
RFQ
ECAD 6785 0.00000000 Aries Electronics - Obsolete - Through Hole - Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 100 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
48-6645-18 Aries Electronics 48-6645-18 -
RFQ
ECAD 4071 0.00000000 Aries Electronics Correct-A-Chip® 6645 Bulk Active - Through Hole - 48-6645 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected Q3453236 EAR99 8536.69.4040 2 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) TQFP DIP, 0.6" (15.24mm) Row Spacing 48 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
232-1285-29-0602J 3M 232-1285-29-0602J 18.2810
RFQ
ECAD 6543 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 232 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 32 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
32-653000-10 Aries Electronics 32-653000-10 45.6900
RFQ
ECAD 12 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 32-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-351000-10 Aries Electronics 18-351000-10 21.0743
RFQ
ECAD 9022 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 18-3510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1111841 Aries Electronics 1111841 11.6535
RFQ
ECAD 4538 0.00000000 Aries Electronics Correct-A-Chip® 1111841 Bulk Active 105°C Through Hole - 1111841 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q2178958 EAR99 8536.69.4040 1 - - 0.020" (0.50mm) - - Tin-Lead 200.0µin (5.08µm) MSOP DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse