Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
228-1277-09-0602J 3M 228-1277-09-0602J 22.0500
RFQ
ECAD 24 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 228 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 28 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
28-354000-10 Aries Electronics 28-354000-10 30.1064
RFQ
ECAD 7098 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 28-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q272465 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.050" (1.27mm) Brass - -
97-68340 Aries Electronics 97-68340 -
RFQ
ECAD 9175 0.00000000 Aries Electronics Correct-A-Chip® 97-68340 Bulk Active - Through Hole - 97-6834 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) Tin - Tin 200.0µin (5.08µm) QFP PGA 144 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1110087 Aries Electronics 1110087 73.3850
RFQ
ECAD 2341 0.00000000 Aries Electronics Correct-A-Chip® 1110087 Bulk Active 105°C Through Hole - 1110087 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q717785 EAR99 8536.69.4040 1 - - 0.020" (0.50mm) Gold - Tin-Lead 200.0µin (5.08µm) VQFP PGA 144 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
218-3341-19-0602J 3M 218-3341-19-0602J 33.6700
RFQ
ECAD 1376 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 218 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 18 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
97-AQ132D Aries Electronics 97-AQ132D 99.6900
RFQ
ECAD 6430 0.00000000 Aries Electronics Correct-A-Chip® 97-AQ132D Bulk Active - Through Hole - 97-AQ13 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) PQFP PGA 132 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
44-305263-20 Aries Electronics 44-305263-20 -
RFQ
ECAD 8907 0.00000000 Aries Electronics Correct-A-Chip® 305263 Bulk Active - Through Hole - 44-3052 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.024" (0.60mm) - - Tin-Lead 200.0µin (5.08µm) QFP PLCC 44 - 0.050" (1.27mm) Brass 0.090" (2.29mm) FR4 Epoxy Glass
08-354000-10 Aries Electronics 08-354000-10 21.7779
RFQ
ECAD 4558 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 08-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1424359 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 8 Beryllium Copper 0.050" (1.27mm) Brass - -
24-351000-10 Aries Electronics 24-351000-10 22.6841
RFQ
ECAD 4772 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 24-3510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected Q3115742 EAR99 8536.69.4040 16 - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-354W00-10 Aries Electronics 16-354W00-10 -
RFQ
ECAD 8548 0.00000000 Aries Electronics Correct-A-Chip® 354W00 Tube Active 105°C Through Hole - 16-354W Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOWIC 16 Beryllium Copper 0.050" (1.27mm) Brass -
16-304235-10 Aries Electronics 16-304235-10 19.8962
RFQ
ECAD 2324 0.00000000 Aries Electronics Correct-A-Chip® 304235 Bulk Active 105°C Through Hole Socket Included 16-3042 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q2249621 EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 16 Beryllium Copper - Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-35W000-10 Aries Electronics 16-35W000-10 15.7150
RFQ
ECAD 8634 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 16-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-450001-10 Aries Electronics 28-450001-10 30.3679
RFQ
ECAD 2470 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Active - Through Hole - 28-4500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 - - 0.050" (1.27mm) - - - - SOJ DIP, 0.4" (10.16mm) Row Spacing 28 - 0.100" (2.54mm) - 0.125" (3.18mm) FR4 Epoxy Glass
44-647-10 Aries Electronics 44-647-10 177.7533
RFQ
ECAD 2482 0.00000000 Aries Electronics 647 Bulk Active - Through Hole - 44-647 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A - - - Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) SOIC DIP, 0.6" (15.24mm) Row Spacing 44 Beryllium Copper - Phosphor Bronze 0.180" (4.57mm) -
36-651000-10 Aries Electronics 36-651000-10 32.1346
RFQ
ECAD 2557 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active 105°C Through Hole - 36-6510 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.026" (0.65mm) Tin - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 36 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-655000-10 Aries Electronics 32-655000-10 38.0087
RFQ
ECAD 7175 0.00000000 Aries Electronics Correct-A-Chip® 655000 Bulk Active - Through Hole - 32-6550 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 - - 0.020" (0.50mm) Silver - Tin-Lead 200.0µin (5.08µm) TSOP DIP, 0.6" (15.24mm) Row Spacing 32 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-505-110 Aries Electronics 84-505-110 56.5413
RFQ
ECAD 3101 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 84-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected Q4754028 EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 84 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
800-19-6-1 TE Connectivity Deutsch Connectors 800-19-6-1 131.3781
RFQ
ECAD 7621 0.00000000 TE Connectivity Deutsch Connectors - Bulk Active - - - 800 - - ROHS3 Compliant 1 (Unlimited) REACH Affected 0000.00.0000 25 - - - - - - - - - - - - - -
PA-SOD6SM18-44 Logical Systems Inc. PA-SOD6SM18-44 22.0000
RFQ
ECAD 4801 0.00000000 Logical Systems Inc. - Bulk Active - Through Hole - PA-SOD Solder download RoHS Compliant Not Applicable 3A992A 8536.69.4040 1 - - 0.050" (1.27mm) - - - - SOIC DIP 44 - 0.100" (2.54mm) - 0.125" (3.18mm) -
44-653000-10 Aries Electronics 44-653000-10 135.7450
RFQ
ECAD 4728 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 44-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109342 Aries Electronics 1109342 88.8540
RFQ
ECAD 3355 0.00000000 Aries Electronics Correct-A-Chip® 1109342 Bulk Active 105°C Through Hole - 1109342 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1156143 EAR99 8536.69.4040 1 Polyphenylene Sulfide (PPS) UL94 V-0 - Tin 150.0µin (3.81µm) Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 Phosphor Bronze 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-450001-10 Aries Electronics 32-450001-10 60.7475
RFQ
ECAD 5891 0.00000000 Aries Electronics Correct-A-Chip® 450001 Bulk Active - Through Hole - 32-4500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A324 EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - - - SOJ DIP, 0.4" (10.16mm) Row Spacing 32 - 0.100" (2.54mm) - 0.125" (3.18mm) FR4 Epoxy Glass
08-665000-00 Aries Electronics 08-665000-00 16.7954
RFQ
ECAD 3246 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 08-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 8 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1107254-20 Aries Electronics 1107254-20 9.7264
RFQ
ECAD 3690 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 20 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
97-56001 Aries Electronics 97-56001 99.8618
RFQ
ECAD 6309 0.00000000 Aries Electronics Correct-A-Chip® 97-56001 Bulk Active - Through Hole - 97-5600 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) QFP PGA 169 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
68-652000-10 Aries Electronics 68-652000-10 108.8925
RFQ
ECAD 4945 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 68-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 68 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-352000-10 Aries Electronics 28-352000-10 -
RFQ
ECAD 7792 0.00000000 Aries Electronics Correct-A-Chip® 352000 Bulk Active - Through Hole - 28-3520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead - PLCC DIP, 0.3" (7.62mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
96-208M50 Aries Electronics 96-208M50 -
RFQ
ECAD 1019 0.00000000 Aries Electronics Correct-A-Chip® 96-208M50 Bulk Active - Through Hole - 96-208M Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 - - 0.020" (0.50mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 208 Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
96-128M80 Aries Electronics 96-128M80 -
RFQ
ECAD 3623 0.00000000 Aries Electronics Correct-A-Chip® Obsolete 105°C Through Hole - Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 - - 0.031" (0.80mm) Tin - Tin-Lead 200.0µin (5.08µm) QFP PGA 128 Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) FR4 Epoxy Glass
DS9075-40V/NO-BRAND Analog Devices Inc./Maxim Integrated DS9075-40V/NO-BRAND -
RFQ
ECAD 7636 0.00000000 Analog Devices Inc./Maxim Integrated DS9075 Bulk Obsolete - - - DS9075 - download RoHS non-compliant 1 (Unlimited) REACH Unaffected DS907540V/NOBRAND EAR99 8536.69.4040 1 - - - - - - - SIP DIP 40 - - - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse