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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Board Material
28-652000-11-RC Aries Electronics 28-652000-11-RC 45.2512
RFQ
ECAD 7832 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 28-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-653000-11-RC Aries Electronics 28-653000-11-RC 42.5882
RFQ
ECAD 9198 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 28-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-652000-11-RC Aries Electronics 32-652000-11-RC 46.4487
RFQ
ECAD 3630 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 32-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
44-653000-11-RC Aries Electronics 44-653000-11-RC 54.4800
RFQ
ECAD 1520 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 44-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-652000-11-RC Aries Electronics 84-652000-11-RC 68.0957
RFQ
ECAD 3514 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-653000-11-RC Aries Electronics 84-653000-11-RC 163.1033
RFQ
ECAD 9033 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 84-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
16-307349-11-RC-P (170 UP) Aries Electronics 16-307349-11-RC-P (170 UP) -
RFQ
ECAD 1759 0.00000000 Aries Electronics Correct-A-Chip® 307349 Bulk Discontinued at SIC - Through Hole - 16-3073 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 170 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) PLCC DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-351000-11-RC Aries Electronics 18-351000-11-RC 23.7248
RFQ
ECAD 9526 0.00000000 Aries Electronics Correct-A-Chip® 351000 Tube Active - Through Hole - 18-3510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A749 EAR99 8536.69.4040 21 - - 0.026" (0.65mm) Gold - Gold 10.0µin (0.25µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
24-650000-11-RC Aries Electronics 24-650000-11-RC 38.1890
RFQ
ECAD 9571 0.00000000 Aries Electronics Correct-A-Chip® 650000 Tube Active - Through Hole - 24-650 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A754 EAR99 8536.69.4040 20 - - 0.050" (1.27mm) Gold - Gold 10.0µin (0.25µm) SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-350002-11-RC Aries Electronics 28-350002-11-RC 24.8600
RFQ
ECAD 1226 0.00000000 Aries Electronics Correct-A-Chip® 350000 Tube Active - Through Hole - 28-3500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A757 EAR99 8536.69.4040 14 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
222-3343-19-0602J 3M 222-3343-19-0602J 27.8000
RFQ
ECAD 29 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 222 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing 22 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
240-1280-29-0602J 3M 240-1280-29-0602J 28.8200
RFQ
ECAD 26 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 240 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
240-3639-19-0602J 3M 240-3639-19-0602J 38.5165
RFQ
ECAD 7660 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 240 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
242-1281-09-0602J 3M 242-1281-09-0602J -
RFQ
ECAD 3617 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 242 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
242-1281-39-0602J 3M 242-1281-39-0602J -
RFQ
ECAD 2600 0.00000000 3M Textool™ Box Obsolete -55°C ~ 125°C Through Hole Closed Frame Wire Wrap download 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
242-1293-29-0602J 3M 242-1293-29-0602J -
RFQ
ECAD 9989 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 242 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
248-1282-09-0602J 3M 248-1282-09-0602J -
RFQ
ECAD 3320 0.00000000 3M Textool™ Box Obsolete -55°C ~ 125°C Through Hole Closed Frame 248 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
248-1282-19-0602J 3M 248-1282-19-0602J -
RFQ
ECAD 9737 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
248-1282-39-0602J 3M 248-1282-39-0602J -
RFQ
ECAD 6916 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
264-1300-29-0602J 3M 264-1300-29-0602J -
RFQ
ECAD 9623 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 264 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.8" (20.32mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing 64 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
290-1294-09-0602J 3M 290-1294-09-0602J -
RFQ
ECAD 3784 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 290 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing 90 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
28-650000-10-P Aries Electronics 28-650000-10-P -
RFQ
ECAD 4324 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 28-650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 84 - - 0.050" (1.27mm) - - Tin-Lead - SOIC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1109523 Aries Electronics 1109523 13.8200
RFQ
ECAD 31 0.00000000 Aries Electronics Correct-A-Chip® 1109523 Bulk Active - Through Hole Socket Included 1109523 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing JEDEC 8 Beryllium Copper - Brass 0.125" (3.18mm) FR4 Epoxy Glass
1107254-24 Aries Electronics 1107254-24 11.2351
RFQ
ECAD 8060 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 24 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1106396-28 Aries Electronics 1106396-28 15.2900
RFQ
ECAD 5950 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 28 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
1106396-24 Aries Electronics 1106396-24 13.7300
RFQ
ECAD 97 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 24 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
20-350001-10 Aries Electronics 20-350001-10 10.8535
RFQ
ECAD 6537 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A325 EAR99 8536.69.4040 19 - - 0.050" (1.27mm) - - Tin 200.0µin (5.08µm) SOJ DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
222-3343-09-0602J 3M 222-3343-09-0602J -
RFQ
ECAD 9409 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 222 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing 22 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
228-1277-09-0602J 3M 228-1277-09-0602J 22.0500
RFQ
ECAD 24 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole - 228 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 28 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
28-354000-10 Aries Electronics 28-354000-10 30.1064
RFQ
ECAD 7098 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 28-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q272465 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.050" (1.27mm) Brass - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse