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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CB4460400050 | 24.5890 |  |
7975 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4460400050 | 1 | ||||||||||||||||||||||
|
4770680000 | 61.7353 | |
4748 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 117-4770680000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 5 lbs (2.27kg) | - | 423°F ~ 426°F (217°C ~ 219°C) | - | - | Lead Free | |||||||||
|
275501 | 0.6800 | |
2189 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | 117-275501 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | - | - | No-Clean | - | Lead Free | |||||||||
|
14-4060-0125 | 28.4552 | |
7540 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-14-4060-0125 | 1 | ||||||||||||||||||||||
|
275500 | 0.4400 | |
1213 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-275500 | 1 | ||||||||||||||||||||||
|
70-4003-2110 | 0.4400 | |
6236 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-70-4003-2110 | 1 | ||||||||||||||||||||||
 |
24-7050-8808 | - | |
3241 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 430 ~ 444°F (221 ~ 223°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
24-7150-8802 | 75.1965 | |
1889 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
 |
SMD3SW.031 2OZ | 19.6400 | |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
HV0006 | 16.9800 | |
593 | 0.00000000 | Hvtools | - | Box | Active | Wire Solder | - | Not applicable | Vendor Undefined | Vendor Undefined | 3608-HV0006 | 1 | Spool, 3.53 oz (100g) | |||||||||||||||||
|
24-7068-9720 | - | |
3874 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Mildly Activated (RMA) | 18 AWG, 19 SWG | Lead Free | ||||||
 |
24-7068-6409 | 130.0700 | |
222 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 16 AWG, 18 SWG | Lead Free | ||||
|
24-6337-8850 | 195.2600 | |
29 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 361°F (183°C) | No-Clean | 30 AWG, 33 SWG | Leaded | ||||||
 |
24-7080-9713 | 75.7056 | |
4460 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Lead Free | |||||
|
24-6337-6407 | - | |
6554 | 0.00000000 | Kester Solder | 331 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Water Soluble | 18 AWG, 19 SWG | Leaded | ||||||
 |
SMD2036-25000 | 24.9900 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.018" (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
16-7068-0031 | - | |
8170 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 5 lbs (2.27kg) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | - | 20 AWG, 22 SWG | Lead Free | |||||
|
6059 | 48.1800 | |
167 | 0.00000000 | GC Electronics | * | Bulk | Active | - | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-6059 | EAR99 | 8311.30.3000 | 1 | |||||||||||||||||
 |
RC96L2031EAG3 | 50.9000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2031EAG3 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
SMD4300SNL10 | 26.9900 | |
2108 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Syringe | Active | Solder Paste | SMD4300 | 0.077 lb (34.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 3 | ||
|
6044 | 20.3800 | |
6 | 0.00000000 | GC Electronics | * | Bulk | Active | Wire Solder | 0.5 lb (226.8 g) | 24 Months | download | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-6044 | EAR99 | 8311.30.3000 | 4 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 361°F (183°C) | 14 AWG, 16 SWG | Leaded | ||||||||
 |
SR37-LFM48S-3.5-0.65MM | - | |
7533 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM48S-3.5-0.65MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.025" (0.64mm) | - | - | - | Lead Free | |||||||
 |
RCBLF227L2020P | 40.8400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF227L2020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
386825 | - | |
9172 | 0.00000000 | Harimatec Inc. | C400 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||||
|
1354225 | 29.0517 | |
4023 | 0.00000000 | LOCTITE | WS300 | Bulk | Not For New Designs | Solder Paste | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 18 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 2.65 oz (75g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | ||||||
|
12-6025-BU | 5.2400 | |
40 | 0.00000000 | GC Electronics | * | Bulk | Active | - | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-12-6025-BU | EAR99 | 7413.00.1000 | 20 | |||||||||||||||||
|
721472 | - | |
6242 | 0.00000000 | LOCTITE | LF318 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | - | To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 18 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 2.65 oz (75g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | 3 | |||||
 |
CCBLF227L2020 | 40.8400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF227L2020 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||||
|
437756 | - | |
4868 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | OBSOLETE | 0000.00.0000 | 20 | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | Spool, 17.64 oz (500g) | 0.032" (0.81mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | ||||||
 |
RC6301031E | 43.8900 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6301031E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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