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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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SMDIN100-0.4MM | 29.9500 | 12 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-SMDIN100-0.4MM | EAR99 | 8311.90.0000 | 1 | In100 (100) | Spool | 0.016" (0.40mm) | 315°F (157°C) | No-Clean | - | Lead Free | ||||||
JET551SNL10T5 | 49.9500 | 5707 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-JET551SNL10T5 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | ||||||||
RMA591LT250 | 84.9500 | 1180 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-RMA591LT250 | 1 | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | - | ||||||||
CQ-SS-6040-0.76MM | 350.0000 | 4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | 315-CQ-SS-6040-0.76MM | 1 | Sn60Pb40 (60/40) | Jar | - | 361°F (183°C) | - | - | Leaded | ||||||||
CB4470680000 | 54.5239 | 5493 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4470680000 | 1 | ||||||||||||||||||||||||
CB4460400050 | 24.5890 | 7975 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4460400050 | 1 | ||||||||||||||||||||||||
4770680000 | 61.7353 | 4748 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 117-4770680000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 5 lbs (2.27kg) | - | 423°F ~ 426°F (217°C ~ 219°C) | - | - | Lead Free | |||||||||||
275501 | 0.6800 | 2189 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | 117-275501 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | - | - | No-Clean | - | Lead Free | |||||||||||
14-4060-0125 | 28.4552 | 7540 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-14-4060-0125 | 1 | ||||||||||||||||||||||||
275500 | 0.4400 | 1213 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-275500 | 1 | ||||||||||||||||||||||||
70-4003-2110 | 0.4400 | 6236 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-70-4003-2110 | 1 | ||||||||||||||||||||||||
24-7050-8808 | - | 3241 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 430 ~ 444°F (221 ~ 223°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||||
24-7150-8802 | 75.1965 | 1889 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||||
SMD3SW.031 2OZ | 19.6400 | 1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||||
HV0006 | 16.9800 | 593 | 0.00000000 | Hvtools | - | Box | Active | Wire Solder | - | Not applicable | Vendor Undefined | Vendor Undefined | 3608-HV0006 | 1 | Spool, 3.53 oz (100g) | |||||||||||||||||||
24-7068-9720 | - | 3874 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Mildly Activated (RMA) | 18 AWG, 19 SWG | Lead Free | ||||||||
24-7068-6409 | 130.0700 | 222 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 16 AWG, 18 SWG | Lead Free | ||||||
24-6337-8850 | 195.2600 | 29 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 361°F (183°C) | No-Clean | 30 AWG, 33 SWG | Leaded | ||||||||
24-7080-9713 | 75.7056 | 4460 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Lead Free | |||||||
24-6337-6407 | - | 6554 | 0.00000000 | Kester Solder | 331 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Water Soluble | 18 AWG, 19 SWG | Leaded | ||||||||
SMD2036-25000 | 24.9900 | 4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.018" (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||||
16-7068-0031 | - | 8170 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 5 lbs (2.27kg) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | - | 20 AWG, 22 SWG | Lead Free | |||||||
6059 | 48.1800 | 167 | 0.00000000 | GC Electronics | * | Bulk | Active | - | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-6059 | EAR99 | 8311.30.3000 | 1 | |||||||||||||||||||
RC96L2031EAG3 | 50.9000 | 50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2031EAG3 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||||||
SMD4300SNL10 | 26.9900 | 2108 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Syringe | Active | Solder Paste | SMD4300 | 0.077 lb (34.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 3 | ||||
6044 | 20.3800 | 6 | 0.00000000 | GC Electronics | * | Bulk | Active | Wire Solder | 0.5 lb (226.8 g) | 24 Months | download | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-6044 | EAR99 | 8311.30.3000 | 4 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 361°F (183°C) | 14 AWG, 16 SWG | Leaded | ||||||||||
SR37-LFM48S-3.5-0.65MM | - | 7533 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM48S-3.5-0.65MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.025" (0.64mm) | - | - | - | Lead Free | |||||||||
RCBLF227L2020P | 40.8400 | 50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF227L2020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||||
1405650 | 115.3820 | 2003 | 0.00000000 | LOCTITE | WS300 | Bulk | Not For New Designs | Solder Paste | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | ||||||||
SR37-LFM48S-3.5-0.8MM | 48.3100 | 5 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM48S-3.5-0.8MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | - | - | Lead Free |
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