SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Type Base Product Number Weight Shelf Life Shelf Life Start Storage/Refrigeration Temperature Shipping Info DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Composition Form Diameter Melting Point Flux Type Wire Gauge Process SIC Storage Mesh Type
SMDIN100-0.4MM Chip Quik Inc. SMDIN100-0.4MM 29.9500
RFQ
ECAD 12 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Wire Solder - 60 Months Date of Manufacture - - download ROHS3 Compliant Not Applicable REACH Unaffected 315-SMDIN100-0.4MM EAR99 8311.90.0000 1 In100 (100) Spool 0.016" (0.40mm) 315°F (157°C) No-Clean - Lead Free
JET551SNL10T5 Chip Quik Inc. JET551SNL10T5 49.9500
RFQ
ECAD 5707 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 12 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-JET551SNL10T5 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc - 423 ~ 428°F (217 ~ 220°C) No-Clean - -
RMA591LT250 Chip Quik Inc. RMA591LT250 84.9500
RFQ
ECAD 1180 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 6 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-RMA591LT250 1 Sn42Bi57.6Ag0.4 (42/57.6/0.4) Jar, 8.8 oz (250g) - 280°F (138°C) No-Clean - -
CQ-SS-6040-0.76MM Chip Quik Inc. CQ-SS-6040-0.76MM 350.0000
RFQ
ECAD 4 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant Not Applicable REACH Affected 315-CQ-SS-6040-0.76MM 1 Sn60Pb40 (60/40) Jar - 361°F (183°C) - - Leaded
CB4470680000 Kester Solder CB4470680000 54.5239
RFQ
ECAD 5493 0.00000000 Kester Solder - Bulk Active - 117-CB4470680000 1
CB4460400050 Kester Solder CB4460400050 24.5890
RFQ
ECAD 7975 0.00000000 Kester Solder - Bulk Active - 117-CB4460400050 1
4770680000 Kester Solder 4770680000 61.7353
RFQ
ECAD 4748 0.00000000 Kester Solder - Bulk Active Bar Solder - 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - download 117-4770680000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Bar, 5 lbs (2.27kg) - 423°F ~ 426°F (217°C ~ 219°C) - - Lead Free
275501 Kester Solder 275501 0.6800
RFQ
ECAD 2189 0.00000000 Kester Solder - Bulk Active Solder Paste - 6 Months Date of Manufacture 32°F ~ 50°F (0°C ~ 10°C) - download 117-275501 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar - - No-Clean - Lead Free
14-4060-0125 Kester Solder 14-4060-0125 28.4552
RFQ
ECAD 7540 0.00000000 Kester Solder - Bulk Active - 117-14-4060-0125 1
275500 Kester Solder 275500 0.4400
RFQ
ECAD 1213 0.00000000 Kester Solder - Bulk Active - 117-275500 1
70-4003-2110 Kester Solder 70-4003-2110 0.4400
RFQ
ECAD 6236 0.00000000 Kester Solder - Bulk Active - 117-70-4003-2110 1
24-7050-8808 Kester Solder 24-7050-8808 -
RFQ
ECAD 3241 0.00000000 Kester Solder 245 Bulk Active Wire Solder 24-7050 - - 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 25 Sn96.3Ag3.7 (96.3/3.7) Spool, 1 lb (454 g) 0.020" (0.51mm) 430 ~ 444°F (221 ~ 223°C) No-Clean 24 AWG, 25 SWG Lead Free
24-7150-8802 Kester Solder 24-7150-8802 75.1965
RFQ
ECAD 1889 0.00000000 Kester Solder 245 Bulk Active Wire Solder 24-7150 - - 50°F ~ 104°F (10°C ~ 40°C) - download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 25 Sn62Pb36Ag2 (62/36/2) Spool, 1 lb (454 g) 0.031" (0.79mm) 354°F (179°C) No-Clean 20 AWG, 22 SWG Leaded
SMD3SW.031 2OZ Chip Quik Inc. SMD3SW.031 2OZ 19.6400
RFQ
ECAD 1 0.00000000 Chip Quik Inc. SMD3 Bulk Active Wire Solder SMD3S - - - - - download ROHS3 Compliant Not Applicable REACH Affected EAR99 8311.90.0000 1 Sn62Pb36Ag2 (62/36/2) Spool, 2 oz (56.70g) 0.031" (0.79mm) 354°F (179°C) No-Clean, Water Soluble - Leaded
HV0006 Hvtools HV0006 16.9800
RFQ
ECAD 593 0.00000000 Hvtools - Box Active Wire Solder - Not applicable Vendor Undefined Vendor Undefined 3608-HV0006 1 Spool, 3.53 oz (100g)
24-7068-9720 Kester Solder 24-7068-9720 -
RFQ
ECAD 3874 0.00000000 Kester Solder 285 Bulk Obsolete Wire Solder - - 50°F ~ 104°F (10°C ~ 40°C) - download RoHS Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 25 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.040" (1.02mm) 423 ~ 424°F (217 ~ 218°C) Rosin Mildly Activated (RMA) 18 AWG, 19 SWG Lead Free
24-7068-6409 Kester Solder 24-7068-6409 130.0700
RFQ
ECAD 222 0.00000000 Kester Solder 331 Spool Active Wire Solder 24-7068 1 lb (453.59 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.3000 25 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.050" (1.27mm) 423 ~ 424°F (217 ~ 218°C) Water Soluble 16 AWG, 18 SWG Lead Free
24-6337-8850 Kester Solder 24-6337-8850 195.2600
RFQ
ECAD 29 0.00000000 Kester Solder 245 Bulk Active Wire Solder 24-6337 - - 50°F ~ 104°F (10°C ~ 40°C) - download 1 (Unlimited) REACH Unaffected EAR99 8311.30.3000 25 Sn63Pb37 (63/37) Spool, 1 lb (454 g) 0.010" (0.25mm) 361°F (183°C) No-Clean 30 AWG, 33 SWG Leaded
24-7080-9713 Kester Solder 24-7080-9713 75.7056
RFQ
ECAD 4460 0.00000000 Kester Solder 285 Bulk Active Wire Solder 24-7080 - - 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 25 Sn95Sb5 (95/5) Spool, 1 lb (454 g) 0.031" (0.79mm) 450 ~ 464°F (232 ~ 240°C) Rosin Mildly Activated (RMA) 20 AWG, 22 SWG Lead Free
24-6337-6407 Kester Solder 24-6337-6407 -
RFQ
ECAD 6554 0.00000000 Kester Solder 331 Bulk Obsolete Wire Solder - - 50°F ~ 104°F (10°C ~ 40°C) - download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.3000 25 Sn63Pb37 (63/37) Spool, 1 lb (454 g) 0.040" (1.02mm) 361°F (183°C) Water Soluble 18 AWG, 19 SWG Leaded
SMD2036-25000 Chip Quik Inc. SMD2036-25000 24.9900
RFQ
ECAD 4 0.00000000 Chip Quik Inc. SMD2 Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.90.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar 0.018" (0.46mm) 423 ~ 428°F (217 ~ 220°C) - - Lead Free
16-7068-0031 Kester Solder 16-7068-0031 -
RFQ
ECAD 8170 0.00000000 Kester Solder Solid Core Wire Bulk Active Wire Solder 16-7068 - - 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 25 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 5 lbs (2.27kg) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) - 20 AWG, 22 SWG Lead Free
6059 GC Electronics 6059 48.1800
RFQ
ECAD 167 0.00000000 GC Electronics * Bulk Active - RoHS non-compliant Vendor Undefined REACH info available upon request 2266-6059 EAR99 8311.30.3000 1
RC96L2031EAG3 Canfield Technologies RC96L2031EAG3 50.9000
RFQ
ECAD 50 0.00000000 Canfield Technologies - Spool Active Wire Solder 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 3844-RC96L2031EAG3 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 8 oz (227g), 1/2 lb 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) Rosin Activated (RA) 20 AWG, 22 SWG Lead Free
SMD4300SNL10 Chip Quik Inc. SMD4300SNL10 26.9900
RFQ
ECAD 2108 0.00000000 Chip Quik Inc. CHIPQUIK® SMD4300 Syringe Active Solder Paste SMD4300 0.077 lb (34.93 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - Lead Free Refrigerated 3
6044 GC Electronics 6044 20.3800
RFQ
ECAD 6 0.00000000 GC Electronics * Bulk Active Wire Solder 0.5 lb (226.8 g) 24 Months download RoHS non-compliant Vendor Undefined REACH info available upon request 2266-6044 EAR99 8311.30.3000 4 Sn60Pb40 (60/40) Spool, 8 oz (227g), 1/2 lb 0.062" (1.57mm) 361°F (183°C) 14 AWG, 16 SWG Leaded
SR37-LFM48S-3.5-0.65MM Almit SR37-LFM48S-3.5-0.65MM -
RFQ
ECAD 7533 0.00000000 Almit - Spool Active Wire Solder 24 Months Date of Manufacture - - ROHS3 Compliant 1 (Unlimited) 2345-SR37-LFM48S-3.5-0.65MM EAR99 8311.30.6000 1 - Spool, 3.53 oz (100g) 0.025" (0.64mm) - - - Lead Free
RCBLF227L2020P Canfield Technologies RCBLF227L2020P 40.8400
RFQ
ECAD 50 0.00000000 Canfield Technologies - Spool Active Wire Solder 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 3844-RCBLF227L2020P 1 BLF 227 (99.17Sn/.8Cu/.03Ni) Spool, 8 oz (227g), 1/2 lb 0.020" (0.51mm) 440°F (227°C) Rosin Activated (RA) 24 AWG, 25 SWG Lead Free
1405650 LOCTITE 1405650 115.3820
RFQ
ECAD 2003 0.00000000 LOCTITE WS300 Bulk Not For New Designs Solder Paste 6 Months Date of Manufacture 35.6°F ~ 46.4°F (2°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. - RoHS non-compliant Not Applicable EAR99 8311.90.0000 10 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g) - 423°F (217°C) Water Soluble - Lead Free -
SR37-LFM48S-3.5-0.8MM Almit SR37-LFM48S-3.5-0.8MM 48.3100
RFQ
ECAD 5 0.00000000 Almit - Spool Active Wire Solder 24 Months Date of Manufacture - - ROHS3 Compliant 1 (Unlimited) 2345-SR37-LFM48S-3.5-0.8MM EAR99 8311.30.6000 1 - Spool, 3.53 oz (100g) 0.031" (0.79mm) - - - Lead Free
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse