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Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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2472691 | - | ![]() |
5533 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 18 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 30 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||||
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91-6040-8806 | - | ![]() |
5406 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 27 AWG, 28 SWG | Leaded | |||||||
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24-7040-0009 | - | ![]() |
5252 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 430°F (221°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||
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91-7068-7623 | - | ![]() |
9696 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 91-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.010" (0.25mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 30 AWG, 33 SWG | Lead Free | |||||
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70-1002-0510 | 129.0500 | ![]() |
8 | 0.00000000 | Kester Solder | HydroMark 531 | Jar | Active | Solder Paste | 70-1002 | 1.1 lbs (499 g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | Refrigerated | 3 | ||
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70-5426-2411 | 296.2100 | ![]() |
10 | 0.00000000 | Kester Solder | NP505-HR | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | - | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | - | Cartridge, 21.16 oz (600g) | - | - | No-Clean | - | Lead Free | Refrigerated | 4 | ||||
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NC2SWLF.020 1LB | 64.0300 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0201LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
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24-7150-8802 | 75.1965 | ![]() |
1889 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
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24-6337-7615 | - | ![]() |
3570 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | |||||||
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NC3SWLF.031 0.5OZ | 5.5800 | ![]() |
23 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC3SWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | |||||
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24-7050-8846 | - | ![]() |
2063 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
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EXB-SN99.3CU0.7 | 36.4500 | ![]() |
5 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN99 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN99.3CU0.7 | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | - | 441°F (227°C) | - | - | Leaded | |||||
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24-7040-9718 | - | ![]() |
4628 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 430°F (221°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Lead Free | ||||||
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24-6040-9713 | 58.7600 | ![]() |
39 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
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1844674 | - | ![]() |
6541 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 20 | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 21.16 oz (600g) | - | 411 ~ 424°F (209 ~ 218°C) | No-Clean | - | Lead Free | - | - | |||||
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SMD2028 | 123.9500 | ![]() |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.014" (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
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24-5050-0066 | - | ![]() |
3661 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | Leaded | |||||
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NC3SW.031 1LB | 75.5400 | ![]() |
11 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC3SW.0311LB | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||||
SMDSWLF.015 1OZ | 11.6300 | ![]() |
5 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||||
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WBNCSAC31-35G | 26.9900 | ![]() |
5 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Tube | Active | Wire Solder | WBNCSA | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBNCSAC31-35G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 0.031" (0.79mm) | - | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
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RC6001031P | 42.3800 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6001031P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||||||
SMD2185-25000 | 17.9900 | ![]() |
4951 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.018" (0.46mm) | 361°F (183°C) | - | - | Leaded | ||||||
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92-6337-9710 | - | ![]() |
5975 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
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24-6337-9710 | 51.4500 | ![]() |
120 | 0.00000000 | Kester Solder | 285 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | ||||||
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4770680000 | 61.7353 | ![]() |
4748 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 117-4770680000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 5 lbs (2.27kg) | - | 423°F ~ 426°F (217°C ~ 219°C) | - | - | Lead Free | |||||||||
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CB4460400050 | 24.5890 | ![]() |
7975 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4460400050 | 1 | ||||||||||||||||||||||
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JET551SNL10T5 | 49.9500 | ![]() |
5707 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-JET551SNL10T5 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | ||||||
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SMD2028-25000 | 26.9900 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.014" (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
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437756 | - | ![]() |
4868 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | OBSOLETE | 0000.00.0000 | 20 | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | Spool, 17.64 oz (500g) | 0.032" (0.81mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | ||||||
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25-7080-0069 | 249.7688 | ![]() |
8076 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 25-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 4 lbs (1.81kg) | 0.125" (3.18mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Lead Free |
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