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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
24-7050-0039 | - |  |
3399 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
 |
SMD4300SNL500T3C | 108.7500 | |
2375 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | 3 | ||||
 |
92-6337-8862 | - | |
6658 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | |||||
|
84-7068-0118 | - | |
1727 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 84-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 11.02 lbs (5kg) | 0.118" (3.00mm) | 423 ~ 424°F (217 ~ 218°C) | - | 9 AWG, 11 SWG | Lead Free | |||||
 |
SMD2180-25000 | 18.9900 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.016" (0.40mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
NC191AX35 | 16.9500 | |
3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX35 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
 |
28-5050-0654 | - | |
1997 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 28-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 20 lbs (9.07kg) | 0.062" (1.57mm) | 361 ~ 420°F (183 ~ 216°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||
 |
24-6040-0053 | 48.6300 | |
51 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6040 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | ||||
 |
24-9574-1402 | 77.7600 | |
190 | 0.00000000 | Kester Solder | 48 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
 |
SMD3SW.020 8OZ | 46.3400 | |
3 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
 |
386818 | 58.9000 | |
50 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | 70°F ~ 85°F (20°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | 82-132 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | Water Soluble | 20 AWG, 21 SWG | Leaded | |||||
|
24-6337-8834 | 66.7100 | |
61 | 0.00000000 | Kester Solder | 245 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||
 |
24-6337-7604 | 66.8256 | |
2347 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | ||||||
|
24-6337-7615 | - | |
3570 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | |||||||
 |
SMDSW.020 8OZ | 24.9100 | |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
|
24-6337-0657 | 50.8716 | |
5420 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||
|
44-0595-0000 | 21.8603 | |
5073 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | 44-0595 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb95Sn5 (95/5) | Bar, 1.66 lbs (750g) | - | 574 ~ 597°F (301 ~ 314°C) | - | - | Leaded | - | ||||
 |
24-7068-7600 | 97.2832 | |
9456 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 24-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | |||||
 |
SMD291AX500T3 | 75.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
14-6337-0125 | 38.1780 | |
3873 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 14-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361°F (183°C) | - | 8 AWG, 10 SWG | Leaded | ||||||
 |
T0051388399 | 38.0000 | |
5 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051388399 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.012" (0.31mm) | - | No-Clean | - | Lead Free | |||||
 |
SMDSWLF.031 2OZ | 18.0200 | |
20 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.125 lb (56.7 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | |||
 |
BARSN99.3CU0.7-8OZ | 25.6700 | |
34 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN99.3 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 0.5 lb (227g) | - | 441°F (227°C) | - | - | Lead Free | ||||||
|
145077-1 | - | |
3124 | 0.00000000 | iFixit | - | Bulk | Active | Wire Solder | IF145 | - | - | - | - | Not applicable | Not Applicable | 1 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.50 oz (14.17g) | 0.040" (1.02mm) | 446°F (230°C) | - | - | Lead Free | |||||||||
 |
SMD2215-25000 | 15.7900 | |
11 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.030" (0.76mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
|
24-7340-0026 | 59.8829 | |
5916 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | |||||
 |
T0051388599 | 64.0000 | |
7 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051388599 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.031" (0.79mm) | - | No-Clean | - | Lead Free | |||||
|
24-7040-9718 | - | |
4628 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 430°F (221°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Lead Free | ||||||
|
24-7068-9720 | - | |
3874 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Mildly Activated (RMA) | 18 AWG, 19 SWG | Lead Free | ||||||
 |
17552 | - | |
8679 | 0.00000000 | Aven Tools | - | Tube | Obsolete | Wire Solder | 0.71 oz (20.23 g) | - | - | - | - | download | Not applicable | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Tube, 0.71 oz (20g) | 0.047" (1.19mm) | 360°F (180°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | Leaded | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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