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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Mesh Type |
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70-0102-0510 | 113.1200 | ![]() |
9653 | 0.00000000 | Kester Solder | Profile®, 256 | Jar | Active | Solder Paste | 70-0102 | 1.1 lbs (499 g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||
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SMDSWLF.006 2G | 19.9900 | ![]() |
28 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.0062G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.07 oz (2g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||
RASWLF.031 1OZ | 7.0600 | ![]() |
60 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0311OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Lead Free | |||||||
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WB63/37 | 29.9900 | ![]() |
38 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | - | 361°F (183°C) | - | - | - |
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