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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CWSnCu0.7Ni RA3% .032 1# | 91.3000 |  |
100 | 0.00000000 | Amerway Inc | - | Tape & Box (TB) | Active | - | ROHS3 Compliant | REACH Affected | 2757-CWSnCu0.7NiRA3%.0321#TB | 1 | ||||||||||||||||||||
 |
CC6001020P | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 1 lb (453.59 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6001020P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||
 |
RC6301020E | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6301020E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||
 |
WC6301031 | 43.8900 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301031 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
 |
70-4105-0910 | 155.7020 | |
7723 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4105 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 4 | ||||
 |
153712 | 32.3800 | |
8910 | 0.00000000 | Kester Solder | ALPHA® | Box | Active | 6 Months | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 117-153712 | EAR99 | 3810.10.0000 | 30 | Refrigerated | |||||||||||||
 |
SMDSWLF.004 20G | 199.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 315-SMDSWLF.00420G | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.7 oz (20g) | 0.004" (0.10mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | |||||
 |
CQ-SS-SNBIAG-0.45MM-25000 | 59.9500 | |
10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.45MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.018" (0.46mm) | 280°F (138°C) | - | - | - | |||||
 |
CQ-SS-SNBIAG-0.20MM-25000 | 57.9500 | |
9 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.20MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.008" (0.20mm) | 280°F (138°C) | - | - | - | |||||
|
TOL-09325 | 9.9500 | |
7833 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | 12 Months | Date of Manufacture | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-09325 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | Water Soluble | - | Lead Free | |||||||
 |
RC60L2020 | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC60L2020 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||
 |
WC60L2031 | 30.2700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC60L2031 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 363°F (184°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
 |
RCBLF22701031P | 58.9200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701031P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 440°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
WC63L2062 | 29.6700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC63L2062 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
 |
CC6301062E | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6301062E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||||
 |
SMDSWLF.006 10G | 39.9900 | |
3 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.00610G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.35 oz (10g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
SMD3SW.020 2OZ | 20.0800 | |
2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
TS391LT500C | 150.9500 | |
5779 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
|
TOL-10242 | 34.4400 | |
9047 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-10242 | 1 | Sn96.35Cu0.5Sb0.15Ag3 (96.35/0.5/0.15/3) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | - | Water Soluble | - | Lead Free | |||||||
 |
24-7080-0061 | 69.5971 | |
1079 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
 |
77-6337-1930 | - | |
5387 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 77-6337 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Bar, 8.5 lbs (3.86kg) | - | 361°F (183°C) | - | - | Leaded | - | ||||
 |
24-6337-8813 | 66.3100 | |
89 | 0.00000000 | Kester Solder | 245 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | ||||
 |
96-7068-8820 | - | |
1584 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
RMA591LT250 | 84.9500 | |
1180 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-RMA591LT250 | 1 | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | - | ||||||
 |
CWSN99.3 NCCW2.2 .062 | 74.2000 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN99 | - | - | - | - | ROHS3 Compliant | 2757-CWSN99.3NCCW2.2.062 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | - | - | - | - | |||||||||
 |
OS-S031AS | - | |
2161 | 0.00000000 | MENDA/EasyBraid | - | Bulk | Obsolete | Wire Solder | - | - | - | - | - | - | RoHS non-compliant | Not Applicable | REACH Unaffected | EB1063 | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | - | |||
 |
24-6337-7415 | 126.4399 | |
9016 | 0.00000000 | Kester Solder | 282 | Bulk | Active | Wire Solder | 24-6337 | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | - | |||||
 |
386818 | 58.9000 | |
50 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | 70°F ~ 85°F (20°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | 82-132 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | Water Soluble | 20 AWG, 21 SWG | Leaded | |||||
|
1051208 | - | |
2149 | 0.00000000 | Harimatec Inc. | MP218 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 15 | Cartridge, 22.93 oz (650g) | - | - | No-Clean | - | Leaded | 4 | |||||||
 |
RASW.020 1LB | 41.5100 | |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | - | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0201LB | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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