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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
NC191AX35 | 16.9500 |  |
3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX35 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
 |
14-6337-0031 | 61.7300 | |
132 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 14-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | - | 20 AWG, 22 SWG | Leaded | ||||
 |
SMDSW.020 8OZ | 24.9100 | |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
 |
24-6337-0010 | 63.3400 | |
253 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||
 |
4884-227G | 50.5400 | |
7 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4884 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||
 |
NC191LT50T5 | 27.9500 | |
9933 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT50T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 280°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 5 | ||
 |
NC191AX250T5 | 77.9500 | |
2695 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX250T5 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
 |
92-6337-8862 | - | |
6658 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | |||||
 |
NCSWLF.015 1LB | 99.7800 | |
11 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NCSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NCSWLF.0151LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.592g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | |||
 |
BARSN99.3CU0.7-8OZ | 25.6700 | |
34 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN99.3 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 0.5 lb (227g) | - | 441°F (227°C) | - | - | Lead Free | ||||||
|
23-6040-0027 | - | |
1025 | 0.00000000 | Kester Solder | 44 | Spool | Obsolete | Wire Solder | 0.5 lb (226.8 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1117 | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||
 |
25-7068-7610 | 507.9500 | |
1737 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 25-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 lbs (1.81kg) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
24-6337-0657 | 50.8716 | |
5420 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||
 |
CWSnCu0.7Ni RA3% .032 1# | 91.3000 | |
100 | 0.00000000 | Amerway Inc | - | Tape & Box (TB) | Active | - | ROHS3 Compliant | REACH Affected | 2757-CWSnCu0.7NiRA3%.0321#TB | 1 | ||||||||||||||||||||
 |
CC6001020P | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 1 lb (453.59 g) | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6001020P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||
 |
RC6301020E | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6301020E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||
 |
WC6301031 | 43.8900 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301031 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
 |
70-4105-0910 | 155.7020 | |
7723 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4105 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 4 | ||||
|
153712 | 32.3800 | |
8910 | 0.00000000 | Kester Solder | ALPHA® | Box | Active | 6 Months | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 117-153712 | EAR99 | 3810.10.0000 | 30 | Refrigerated | |||||||||||||
 |
SMDSWLF.004 20G | 199.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 315-SMDSWLF.00420G | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.7 oz (20g) | 0.004" (0.10mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | |||||
 |
CQ-SS-SNBIAG-0.45MM-25000 | 59.9500 | |
10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.45MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.018" (0.46mm) | 280°F (138°C) | - | - | - | |||||
 |
CQ-SS-SNBIAG-0.20MM-25000 | 57.9500 | |
9 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.20MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.008" (0.20mm) | 280°F (138°C) | - | - | - | |||||
|
TOL-09325 | 9.9500 | |
7833 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | 12 Months | Date of Manufacture | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-09325 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | Water Soluble | - | Lead Free | |||||||
 |
RC60L2020 | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC60L2020 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||
 |
WC60L2031 | 30.2700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC60L2031 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 363°F (184°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
 |
RCBLF22701031P | 58.9200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701031P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 440°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
WC63L2062 | 29.6700 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC63L2062 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
 |
CC6301062E | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6301062E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||||
 |
SMDSWLF.006 10G | 39.9900 | |
3 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.00610G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.35 oz (10g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
SMD3SW.020 2OZ | 20.0800 | |
2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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