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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD291AX10T5 | 29.9500 |  |
13 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.077 lb (34.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 5 | ||
 |
SMD2165 | 102.9500 | |
8021 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.012" (0.31mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD2190 | 84.9500 | |
5582 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.020" (0.51mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD2055 | 111.9500 | |
7805 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.025" (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||
 |
1769646 | - | |
3612 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | 1000-123 | EAR99 | 8311.30.3000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | ||||
 |
WBNCSAC31-35G | 26.9900 | |
5 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Tube | Active | Wire Solder | WBNCSA | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBNCSAC31-35G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 0.031" (0.79mm) | - | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||
 |
WBARS99.3/.7 | 49.9900 | |
25 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WBARS99 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBARS99.3/.7 | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (453.59g) | - | - | - | - | Lead Free | |||||
|
WBAR62/36/2 | 51.9900 | |
8274 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WBAR62/36 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 2260-WBAR62/36/2 | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Bar, 1 lb (453.59g) | - | - | - | - | Leaded | |||||
 |
83-6337-0027 | - | |
1596 | 0.00000000 | Kester Solder | 83 | Bag | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 2368-83-6337-0027 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | - | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | |||||||
|
2370856 | 73.0500 | |
8998 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 50 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge | - | 423°F (217°C) | No-Clean | - | Lead Free | 5 | |||||||
|
2591111 | 26.6000 | |
5557 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 50 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge | - | 423°F (217°C) | No-Clean | - | Lead Free | 5 | |||||||
 |
2472691 | - | |
5533 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 18 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 30 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||||
 |
CWSN63WRAP3 .015 | 69.9900 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN63 | - | - | - | - | RoHS non-compliant | 2757-CWSN63WRAP3.015 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - | |||||||||
 |
EBSN99.3CU.7 1# | 59.0000 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Bar Solder | EBSN99 | - | - | - | - | ROHS3 Compliant | REACH Affected | 2757-EBSN99.3CU.71# | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (453.59g) | - | - | - | - | - | ||||||||
 |
CWSN63 NCCW2 .062 | 43.4100 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN63 | - | - | - | - | RoHS non-compliant | 2757-CWSN63NCCW2.062 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | - | - | - | - | |||||||||
 |
CWSN99.3 NCCW2.2 .062 | 74.2000 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN99 | - | - | - | - | ROHS3 Compliant | 2757-CWSN99.3NCCW2.2.062 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | - | - | - | - | |||||||||
 |
CWSN60WRMAP3 .062 | 61.2000 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60WRMAP3.062 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | - | - | - | - | |||||||||
 |
CWSN63 NCCW2 .032 | 60.2600 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN63 | - | - | - | - | RoHS non-compliant | 2757-CWSN63NCCW2.032 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.032" (0.81mm) | - | - | - | - | |||||||||
 |
SSWS-50G | 23.9900 | |
3377 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSWS | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSWS-50G | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | - | Water Soluble | - | - | 3 | ||||
 |
35232 | 26.8700 | |
2 | 0.00000000 | Master Appliance Co | - | Box | Active | Wire Solder | - | - | - | - | ROHS3 Compliant | Not Applicable | REACH Unaffected | MA35232 | EAR99 | 8515.90.4000 | 1 | - | Tube | - | - | - | - | Lead Free | - | |||||
 |
4912-227G | - | |
7540 | 0.00000000 | MG Chemicals | 4912 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1235 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
 |
4917-227G | - | |
6219 | 0.00000000 | MG Chemicals | 4917 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1240 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | ||||||
 |
4942-112G | - | |
5512 | 0.00000000 | MG Chemicals | 4942 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1249 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 442°F (228°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||
 |
4944-112G | - | |
5592 | 0.00000000 | MG Chemicals | 4944 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1251 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 4 oz (113.40g) | 0.032" (0.81mm) | 442°F (228°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Lead Free | ||||||
 |
4944-454G | - | |
9507 | 0.00000000 | MG Chemicals | 4944 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1252 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 442°F (228°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Lead Free | ||||||
 |
SMD2040-25000 | 24.1900 | |
47 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||
 |
SMD2215-25000 | 15.7900 | |
11 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.030" (0.76mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD2200-25000 | 16.3900 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.024" (0.61mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
NC191SNL35 | 18.9500 | |
4 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL35 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
 |
NC191SNL50 | 13.9500 | |
13 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL50 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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