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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
568759 | - |  |
6338 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | OBSOLETE | 0000.00.0000 | 20 | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | Spool, 17.64 oz (500g) | 0.048" (1.22mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | - | ||||||
|
716856 | - | |
9262 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2.20 lbs (1kg) | 0.064" (1.63mm) | 440 ~ 464°F (227 ~ 240°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | - | ||||||
|
727190 | - | |
5419 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.022" (0.56mm) | 440 ~ 464°F (227 ~ 240°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | - | ||||||
|
840933 | - | |
8043 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 40 | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | - | |||||||||
|
849328 | - | |
7385 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | OBSOLETE | 0000.00.0000 | 20 | Spool, 5.51 lbs (2.5kg) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | |||||||||
|
1051208 | - | |
2149 | 0.00000000 | Harimatec Inc. | MP218 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 15 | Cartridge, 22.93 oz (650g) | - | - | No-Clean | - | Leaded | 4 | |||||||
 |
17555LF | 19.6400 | |
2385 | 0.00000000 | Aven Tools | - | Spool | Obsolete | Wire Solder | 17555 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 3.53 oz (100g) | 0.039" (0.99mm) | 440°F (227°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | - | |||||
 |
17551LF | 5.2000 | |
9944 | 0.00000000 | Aven Tools | - | Bag | Obsolete | Wire Solder | 17551 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.71 oz (20g) | 0.039" (0.99mm) | 440°F (227°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | - | |||||
 |
SMD291AX250T4 | 50.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 4 | |||
 |
SMD4300AX10T4 | 27.9500 | |
9 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Syringe | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | Refrigerated | 4 | |||
 |
SMD4300SNL10T4 | 32.9500 | |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Syringe | Active | Solder Paste | SMD4300 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 4 | |||
 |
SMD4300SNL250T4 | 67.9500 | |
19 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 4 | ||
 |
2041006 | 174.9800 | |
7987 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 3W | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | |||||
 |
SMD291SNL500T5C | 214.2800 | |
1198 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | ||||
 |
SMD4300AX500T3C | 83.2500 | |
5973 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | 3 | ||||
|
MMF006620 | 135.8000 | |
3244 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 361A-20R | EAR99 | 3810.10.0000 | 1 | Sn63Pb36.65Sb0.35 (63/36.65/0.35) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | - | |||||
 |
SMD291AX500T3 | 75.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
SMD291AX500T5 | 180.7500 | |
5653 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
 |
SMD291SNL500T3 | 108.7500 | |
8615 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 3 | ||||
 |
SMD4300SNL250T3 | 55.9500 | |
5145 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 3 | ||
 |
24-9574-7619 | 75.5156 | |
1339 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 441°F (227°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | ||||||
|
24-6337-7618 | - | |
7614 | 0.00000000 | Kester Solder | 275 | Spool | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||||
|
24-9574-7618 | 73.0100 | |
192 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
 |
24-6337-9710 | 51.4500 | |
120 | 0.00000000 | Kester Solder | 285 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | ||||||
 |
24-9574-6403 | 70.1504 | |
4739 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | Water Soluble | 20 AWG, 22 SWG | Lead Free | ||||||
 |
14-6337-0125 | 38.1780 | |
3873 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 14-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361°F (183°C) | - | 8 AWG, 10 SWG | Leaded | ||||||
|
14-6040-0125 | 36.1843 | |
8754 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 14-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 374°F (183 ~ 190°C) | - | 8 AWG, 10 SWG | Leaded | ||||||
 |
24-9574-1402 | 77.7600 | |
190 | 0.00000000 | Kester Solder | 48 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
|
24-9574-7610 | 77.7496 | |
3405 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
 |
24-6337-7604 | 66.8256 | |
2347 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)