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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
16-7040-0125 | 385.4565 |  |
2737 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-7040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 5 lbs (2.27kg) | 0.125" (3.18mm) | 430°F (221°C) | - | 8 AWG, 10 SWG | Lead Free | |||||
 |
NCSWLF.015 2OZ | 35.6800 | |
38 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NCSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NCSWLF.0152OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | |||
 |
TOL-09161 | 6.5000 | |
1770 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | 12 Months | Date of Manufacture | - | - | - | Not applicable | 1 (Unlimited) | 1568-TOL-09161 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | Water Soluble | - | Leaded | |||||
 |
4944-454G | - | |
9507 | 0.00000000 | MG Chemicals | 4944 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1252 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 442°F (228°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Lead Free | ||||||
|
44-0595-0000 | 21.8603 | |
5073 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | 44-0595 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb95Sn5 (95/5) | Bar, 1.66 lbs (750g) | - | 574 ~ 597°F (301 ~ 314°C) | - | - | Leaded | - | ||||
 |
17551LF | 5.2000 | |
9944 | 0.00000000 | Aven Tools | - | Bag | Obsolete | Wire Solder | 17551 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.71 oz (20g) | 0.039" (0.99mm) | 440°F (227°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | - | |||||
 |
386839 | - | |
9151 | 0.00000000 | Harimatec Inc. | 370 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||||
 |
SMDIN100-S-16 | 365.4600 | |
4095 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | In100 (100) | Bag, 1 lb (454g) | - | 315°F (157°C) | - | - | Lead Free | ||||||
|
44-7317-0000 | 70.1868 | |
3211 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | 44-7317 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb88Sn10Ag2 (88/10/2) | Bar, 1.66 lbs (750g) | - | 514 ~ 570°F (268 ~ 299°C) | - | - | Leaded | - | ||||
 |
70-1903-0810 | 206.5200 | |
8 | 0.00000000 | Kester Solder | R520A | Jar | Active | Solder Paste | 70-1903 | 1.1 lbs (499 g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | 3 | |||
 |
WC6301020P | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301020P | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | ||||||||
 |
SMD2SWLF.015 4OZ | 26.7800 | |
3613 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||
|
82-7340-0118 | - | |
1407 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 82-7340 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 17.64 oz (500g) | 0.118" (3.00mm) | 565 ~ 574°F (296 ~ 301°C) | - | 9 AWG, 11 SWG | Leaded | - | ||||
 |
SSNC-T5-50G | 26.9900 | |
7376 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC-T | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 5 | |||
 |
NC191LTA35T5 | 23.9500 | |
9504 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA35T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 1.23 oz (35g), 10cc | - | 279°F (137°C) | No-Clean | - | - | 5 | ||||
 |
4900-112G | 55.8100 | |
19 | 0.00000000 | MG Chemicals | 4900 | Spool | Active | Wire Solder | 4900 | 0.25 lb (113.4 g) | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 3 | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | Spool, 4 oz (113.40g) | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||
 |
24-7068-1404 | 109.4800 | |
134 | 0.00000000 | Kester Solder | 48 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Lead Free | ||||
 |
24-7068-7606 | 109.8100 | |
223 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 16 AWG, 18 SWG | Lead Free | ||||
 |
NC3SW.031 0.5OZ | 5.8300 | |
46 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC3SW.0310.5OZ | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||||
|
24-9574-7619 | 75.5156 | |
1339 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 441°F (227°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | ||||||
|
24-9574-7610 | 77.7496 | |
3405 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
 |
25-7080-0025 | - | |
7288 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 25-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 4 lbs (1.81kg) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | |||||
 |
70-4021-0819 | - | |
7454 | 0.00000000 | Kester Solder | NP505-HR | Bulk | Active | Solder Paste | 70-4021 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
 |
24-5050-0069 | - | |
7709 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Leaded | |||||
 |
CCBLF227L2020 | 40.8400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF227L2020 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
NC191SNL500T5C | 175.9000 | |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191SNL500T5C | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 5 | ||||
 |
WS991LT500T4 | 97.0900 | |
10 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | WS991 | 6 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-WS991LT500T4 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 17.64 oz (500g) | - | 281°F (138°C) | Water Soluble | - | Lead Free | 4 | |||||
|
NC2SW.015 8OZ | 39.0300 | |
10 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NC2SW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NC2SW.0158OZ | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (226.80g) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | Leaded | |||
 |
SMD2050 | 111.9500 | |
3013 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.024" (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||
 |
70-0202-0310 | 149.7430 | |
3746 | 0.00000000 | Kester Solder | EP256 | Bulk | Active | Solder Paste | 70-0202 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn62Pb36Ag2 (62/36/2) | Jar, 17.64 oz (500g) | - | 354°F (179°C) | No-Clean | - | Leaded | 3 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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