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Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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SMDSW.020 1OZ | 7.8900 | ![]() |
12 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.062 lb (28.12 g) | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 oz (28.35g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
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WS991AX500T4 | 105.7700 | ![]() |
2 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | WS991 | 6 Months | Date of Manufacture | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-WS991AX500T4 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 4 | |||||
SMD291AX500T3C | 75.9500 | ![]() |
6002 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | ||||
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24-7040-0061 | - | ![]() |
1920 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 430°F (221°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
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70-2002-0310 | - | ![]() |
8558 | 0.00000000 | Kester Solder | R560 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn62Pb36Ag2 (62/36/2) | Jar, 17.64 oz (500g) | - | 354°F (179°C) | Water Soluble | - | Leaded | - | |||||
RASWLF.015 2OZ | 12.9000 | ![]() |
1785 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0152OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | ||||||||
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BARSN99.3CU0.7 | 44.9700 | ![]() |
17 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN99.3 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | - | 441°F (227°C) | - | - | Lead Free | ||||||
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T0051402499 | 29.5000 | ![]() |
3 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051402499 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | Spool, 0.7 oz (20g) | - | - | No-Clean | - | Lead Free | |||||
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14-7050-0020 | - | ![]() |
6033 | 0.00000000 | Kester Solder | - | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 430 ~ 444°F (221 ~ 223°C) | - | 24 AWG, 25 SWG | Lead Free | ||||||
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4875-454G | - | ![]() |
3686 | 0.00000000 | MG Chemicals | 4870 | Spool | Obsolete | Wire Solder | 4875 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||
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NC4SW.020 1LB | 36.7500 | ![]() |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC4SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC4SW.0201LB | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||
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24-6040-9759 | - | ![]() |
1721 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | Leaded | ||||||
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4470120000 | 40.2914 | ![]() |
5301 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 117-4470120000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1.66 lbs (750g) | - | 423°F ~ 426°F (217°C ~ 219°C) | - | - | Lead Free | |||||||||
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77-7033-0000 | - | ![]() |
3081 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 77-7033 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn97Ag3 (97/3) | Bar, 5 lbs (2.27kg) | - | 430 ~ 435°F (221 ~ 224°C) | - | - | Lead Free | - | ||||
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24-6337-7403 | 96.5338 | ![]() |
5089 | 0.00000000 | Kester Solder | 282 | Bulk | Active | Wire Solder | 24-6337 | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | - | |||||
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T0051386299 | 118.0000 | ![]() |
1 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051386299 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.039" (0.99mm) | - | No-Clean | - | Lead Free | |||||
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WCBLF227L2031 | 35.1900 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WCBLF227L2031 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 440°F (227°C) | Water Soluble | 20 AWG, 22 SWG | Lead Free | ||||||||
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24-7150-9710 | 99.2400 | ![]() |
44 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
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SMDSWLT.040 50G | 73.8500 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 1.8 oz (50g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
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14-7068-0015 | - | ![]() |
8150 | 0.00000000 | Kester Solder | - | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | - | 27 AWG, 28 SWG | Lead Free | |||||
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24-9574-6411 | 53.6754 | ![]() |
3599 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 441°F (227°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | ||||||
SMD3SW.020 1OZ | 14.6700 | ![]() |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | |||||
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4901-112G | 34.5400 | ![]() |
56 | 0.00000000 | MG Chemicals | 4901 | Spool | Active | Wire Solder | 4901 | 0.25 lb (113.4 g) | 60 Months | - | 65°F ~ 80°F (18°C ~ 27°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 3 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.032" (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||
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SMD2150-25000 | 20.9900 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | |||||
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24-5050-0068 | - | ![]() |
1566 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Leaded | |||||
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24-6337-9715 | 74.7300 | ![]() |
34 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | Leaded | |||||
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70-0902-0510 | 150.6920 | ![]() |
1233 | 0.00000000 | Kester Solder | FL250D | Bulk | Active | Solder Paste | 70-0902 | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
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14-7068-0062 | 90.5950 | ![]() |
1826 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | - | 14 AWG, 16 SWG | Lead Free | |||||
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SMD4300AX500T4C | 97.5000 | ![]() |
8673 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | 4 | ||||
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24-4060-2437 | 49.0456 | ![]() |
5198 | 0.00000000 | Kester Solder | Acid Cored Wire | Bulk | Active | Wire Solder | 24-4060 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb60Sn40 (60/40) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 460°F (183 ~ 238°C) | Acid Cored | 8 AWG, 10 SWG | Leaded |
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