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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
24-7050-0027 | 102.1757 |  |
5131 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-7050 | - | - | - | - | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
 |
SMDLTLFP10 | 21.9500 | |
7532 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||
 |
1042100 | - | |
8245 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn60Pb40 (60/40) | Spool, 5.51 lbs (2.5kg) | 0.064" (1.63mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 14 AWG, 16 SWG | Leaded | - | ||||||
|
386838 | - | |
9463 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.048" (1.22mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 16 AWG, 18 SWG | Leaded | - | ||||||
|
386849 | - | |
1108 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 1 lb (454 g) | 0.032" (0.81mm) | No-Clean | 20 AWG, 21 SWG | - | ||||||||||
|
386863 | - | |
5762 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 1 lb (454 g) | 0.022" (0.56mm) | No-Clean | 23 AWG, 24 SWG | - | ||||||||||
|
605500 | - | |
7727 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 40 | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | Spool, 5.51 lbs (2.5kg) | 0.022" (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | |||||||
|
692857 | - | |
3385 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | |||||||
|
1051209 | - | |
1067 | 0.00000000 | Harimatec Inc. | MP218 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 35 | Jar, 17.64 oz (500g) | - | - | No-Clean | - | Leaded | 4 | |||||||
|
1354298 | - | |
9672 | 0.00000000 | Multicore | WS200™ | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||||
|
1817240 | - | |
1649 | 0.00000000 | Harimatec Inc. | - | Bulk | Obsolete | Solder Paste | 6 Months | - | 32°F ~ 50°F (0°C ~ 10°C) | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | - | - | Lead Free | - | |||||||
|
289398 | - | |
2876 | 0.00000000 | Harimatec Inc. | - | Bulk | Obsolete | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 400 | - | - | - | - | - | - | - | - | ||||||
 |
2003721 | 173.5100 | |
7 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 10 | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||
 |
17553LF | - | |
6187 | 0.00000000 | Aven Tools | - | Spool | Obsolete | Wire Solder | 17553 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 3.53 oz (100g) | 0.047" (1.19mm) | 440°F (227°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | Lead Free | - | |||||
 |
17552LF | 5.2000 | |
4466 | 0.00000000 | Aven Tools | - | Bag | Obsolete | Wire Solder | 17552 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 20 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.71 oz (20g) | 0.047" (1.19mm) | 440°F (227°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | Lead Free | - | |||||
 |
SMD291SNL10T4 | 29.9500 | |
5308 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 4 | |||
 |
SMDLTLFP250T4 | 83.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 4 | |||
 |
4894-227G | 50.5400 | |
21 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4894 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.025" (0.64mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||
 |
4895-454G | 65.0800 | |
3 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4895 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
4897-227G | 50.5400 | |
2 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4897 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.050" (1.27mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | - | |||
 |
4897-454G | - | |
6190 | 0.00000000 | MG Chemicals | 4890 | Spool | Obsolete | Wire Solder | 4897 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.050" (1.27mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | - | |||
 |
4890-18G | 7.6500 | |
4609 | 0.00000000 | MG Chemicals | 4890 | Bulk | Active | Wire Solder | 4890 | 0.04 lb (18.14 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Tube, 0.63 oz (18g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
4865-227G | 50.5400 | |
2 | 0.00000000 | MG Chemicals | 4860 | Spool | Active | Wire Solder | 4865 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||
 |
4875-227G | 50.5400 | |
3 | 0.00000000 | MG Chemicals | 4870 | Spool | Active | Wire Solder | 4875 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||
 |
4875-454G | - | |
3686 | 0.00000000 | MG Chemicals | 4870 | Spool | Obsolete | Wire Solder | 4875 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||
 |
SMDLTLFP60T4 | 40.9500 | |
8221 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | |||||
|
MMF006630 | 180.0900 | |
1817 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Jar | Active | Solder Paste | 9 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | RoHS non-compliant | 1 (Unlimited) | 1240-FPA | EAR99 | 3810.10.0000 | 1 | Ag40Cu30Zn28Ni2 (40/30/28/2) | Jar, 1 oz (28g) | - | 1220 ~ 1435°F (660 ~ 780°C) | - | - | Lead Free | - | ||||||
|
MMF006619 | 36.4100 | |
5807 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 361A-20R-25 | EAR99 | 3810.10.0000 | 1 | Sn63Pb36.65Sb0.35 (63/36.65/0.35) | Spool | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | - | |||||
 |
SMD4300AX500T4C | 97.5000 | |
8673 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | 4 | ||||
 |
SMD4300AX500T5C | 180.7500 | |
1534 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | 5 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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