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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CC96L2020ESAC | 56.5500 |  |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CC96L2020ESAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | |||||||
 |
RC6001031P | 42.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6001031P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | |||||||
 |
WC6301020P | 48.8600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301020P | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | |||||||
 |
RC96L2031EAG3 | 50.9000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2031EAG3 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | |||||||
 |
WC96L2062PSAC | 49.1600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WC96L2062PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | |||||||
 |
CC6301062E | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6301062E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||||
 |
T0051402599 | 29.5000 | |
12 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051402599 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | No-Clean | - | Lead Free | ||||
 |
CC9601062PSAC | 86.3300 | |
100 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 6 (Time on Label) | REACH Unaffected | 3844-CC9601062PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | |||||
 |
SMDSWLF.004 20G | 199.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 315-SMDSWLF.00420G | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.7 oz (20g) | 0.004" (0.10mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | ||||
 |
TOL-09161 | 6.5000 | |
1770 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | 12 Months | Date of Manufacture | - | - | - | Not applicable | 1 (Unlimited) | 1568-TOL-09161 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | Water Soluble | - | Leaded | ||||
 |
CQ-SS-6040-0.76MM | 350.0000 | |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | 315-CQ-SS-6040-0.76MM | 1 | Sn60Pb40 (60/40) | Jar | - | 361°F (183°C) | - | - | Leaded | |||||
|
CB4470680000 | 54.5239 | |
5493 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4470680000 | 1 | |||||||||||||||||||||
 |
WBRASAC20-2OZ | 14.9900 | |
7 | 0.00000000 | SRA Soldering Products | - | Box | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRASAC20-2OZ | EAR99 | 8311.30.6000 | 1 | - | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | - | Rosin Activated (RA) | - | - | |||||
 |
WBRA633731-2OZ | 7.5000 | |
23 | 0.00000000 | SRA Soldering Products | - | Box | Active | Wire Solder | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRA633731-2OZ | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | - | Leaded | |||
 |
NC191LTA35T5 | 23.9500 | |
9504 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA35T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 1.23 oz (35g), 10cc | - | 279°F (137°C) | No-Clean | - | - | 5 | |||
 |
SMD291SNLT7 | 69.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNLT7 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.35 oz (10g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 7 | |||
 |
NC3SWLF.031 0.5OZ | 5.5800 | |
23 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC3SWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | ||||
 |
NC3SWLF.020 0.3OZ | 5.7700 | |
35 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC3SWLF.0200.3OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | ||||
 |
NC191LTA35 | 17.9500 | |
3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA35 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 1.23 oz (35g), 10cc | - | 279°F (137°C) | No-Clean | - | - | 4 | |||
 |
EXB-SN63PB37 | 23.0200 | |
8512 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN63 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-EXB-SN63PB37 | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | - | 361°F (183°C) | - | - | Leaded | ||||
 |
NC2SW.031 0.5OZ | 2.9400 | |
295 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC2SW.0310.5OZ | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 20 AWG, 21 SWG | Leaded | ||||
 |
SMD291SNL40T7 | 199.9500 | |
2 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNL40T7 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.41 oz (40g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | 7 | |||
 |
SMD3SWLT.040 20G | 33.0500 | |
9684 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04020G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 0.7 oz (20g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | ||||
 |
SMD3SWLT.040 10G | 19.1500 | |
4 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04010G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 0.35 oz (10g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | ||||
 |
TS991SNL500T3 | 107.1900 | |
28 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | TS991S | 12 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-TS991SNL500T3 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | 3 | ||||
 |
SMDSWLT.047 8OZ | 69.1600 | |
10 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLT.0478OZ | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 8 oz (227g), 1/2 lb | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||
 |
SMDSWLT.047 2OZ | 27.3400 | |
2 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLT.0472OZ | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 2 oz (56.70g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||
 |
SMD2SWLT.047 2OZ | 25.7300 | |
44 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD2SWLT.0472OZ | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Spool, 2 oz (56.70g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||
 |
SMD2SWLT.047 4OZ | 44.1200 | |
19 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD2SWLT.0474OZ | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Spool, 4 oz (113.40g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||
 |
WS991LT500T4 | 97.0900 | |
10 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | WS991 | 6 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-WS991LT500T4 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 17.64 oz (500g) | - | 281°F (138°C) | Water Soluble | - | Lead Free | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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