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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
RC6001020P | 35.5600 |  |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6001020P | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 363°F (184°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||
 |
24-7080-0060 | 81.4768 | |
5910 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
|
24-7080-9702 | 140.5312 | |
1186 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | Lead Free | |||||
 |
SMD2SWLT.040 200G | 195.3500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD2SWLT.040200G | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Spool, 7 oz (200g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | |||||
 |
SMDSWLF.006 1G | 14.9500 | |
17 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.0061G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.035 oz (1g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||
 |
18-7000-0045 | 1.0000 | |
5443 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 18-7000 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99 (99) | Spool, 20 lbs (9.07kg) | 0.045" (1.14mm) | - | - | 17 AWG, 18 SWG | Lead Free | |||||
 |
NCSW.031 0.5OZ | 2.9700 | |
412 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NCSW.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | |||||
 |
24-6040-0027 | 55.6400 | |
180 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6040 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||
 |
RASWLF.015 1OZ | 8.0100 | |
2 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0151OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||||
 |
70-4102-0610 | 160.1300 | |
6575 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4102 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 4 | |||
 |
RASWLF.020 4OZ | 21.3100 | |
5 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0204OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | |||||||
|
24-6040-0010 | 67.8400 | |
90 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6040 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||
 |
96-9574-9520 | 106.5100 | |
182 | 0.00000000 | Kester Solder | 268 | Bulk | Active | Wire Solder | 96-9574 | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | KE1813 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||
 |
14-7070-0125 | - | |
1085 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 430 ~ 473°F (221 ~ 245°C) | - | 8 AWG, 10 SWG | Lead Free | ||||||
 |
TS991AX500T4 | 104.7300 | |
7198 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | TS991A | 12 Months | Date of Manufacture | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-TS991AX500T4 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | |||||
 |
NC2SWLF.020 0.3OZ | 2.7700 | |
25 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC2SWLF.0200.3OZ | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | |||||
|
24-6337-9706 | - | |
2421 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 11 AWG, 13 SWG | Leaded | ||||||
 |
SMD2016 | 126.9500 | |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
WBNCSAC20-4OZ | 25.9900 | |
8 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | WBNCSA | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
 |
92-6337-8802 | - | |
6330 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
|
24-6337-8213 | - | |
7747 | 0.00000000 | Kester Solder | 88 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | |||||||
 |
SMD2SW.020 2OZ | 10.4100 | |
9 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
NC191LTA500C | 115.9000 | |
7163 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA500C | EAR99 | 8311.90.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Cartridge, 17.64 oz (500g) | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||
|
92-7080-0018 | - | |
2805 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 92-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn95Sb5 (95/5) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Lead Free | |||||
 |
24-9574-6401 | 68.2821 | |
9500 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||
|
24-6337-0017 | - | |
4088 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | |||||
 |
WC60L2020E | 35.5600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 363°F (184°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||||
 |
70-1003-0610 | 139.1380 | |
7622 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1003 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
 |
CC96L2062E | 49.1600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CC96L2062E | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | ||||||||
 |
CC60L2062P | 27.6000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC60L2062P | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 363°F (184°C) | No-Clean | 14 AWG, 16 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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