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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD291SNL60T4 | 44.9500 |  |
1 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMD291 | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 2.12 oz (60g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | |||||
 |
SMDLTLFP500T3C | 127.9500 | |
2 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||
 |
SMD291AX500T4C | 97.5000 | |
2538 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
 |
MMF006622 | 116.5800 | |
1365 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 361-40R | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | |||||
 |
49500WS-454G | 109.1200 | |
12 | 0.00000000 | MG Chemicals | 49500 | Spool | Active | Wire Solder | 49500WS | 60 Months | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1211 | EAR99 | 8311.30.3000 | 3 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 442°F (228°C) | Water Soluble | 20 AWG, 21 SWG | Lead Free | |||||
 |
4860P-250G | - | |
7039 | 0.00000000 | MG Chemicals | 4860 | Bulk | Obsolete | Solder Paste | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||||
 |
4915-112G | - | |
5806 | 0.00000000 | MG Chemicals | 4915 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1236 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | ||||||
 |
4915-454G | - | |
7952 | 0.00000000 | MG Chemicals | 4915 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1237 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | ||||||
 |
4916-112G | - | |
4193 | 0.00000000 | MG Chemicals | 4916 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1238 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.050" (1.27mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 16 AWG, 18 SWG | Lead Free | ||||||
 |
4926-112G | - | |
1622 | 0.00000000 | MG Chemicals | 4926 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1243 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | |||||
 |
SMD2055-25000 | 22.3900 | |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.025" (0.64mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||
 |
SMD2050-25000 | 22.3900 | |
34 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.024" (0.61mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||
 |
SMD2165-25000 | 20.5900 | |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.012" (0.31mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD2200 | 81.9500 | |
6767 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.024" (0.61mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD2205 | 81.9500 | |
3077 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.025" (0.64mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD2040 | 120.9500 | |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||
 |
1769647 | - | |
1389 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | 1000-124 | EAR99 | 8311.30.3000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 21.16 oz (600g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | ||||
 |
4860P-35G | 35.5600 | |
3107 | 0.00000000 | MG Chemicals | 4860 | Syringe | Active | Solder Paste | 4860 | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 3810.10.0000 | 5 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
SMD291AX50T3 | 12.9800 | |
14 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.113 lb (51.26 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | ||
 |
SMD291SNL50T3 | 16.9500 | |
2082 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.113 lb (51.26 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
 |
SMDSWLTLFP32 | 38.3100 | |
13 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Bi57Sn42Ag1 (57/42/1) | - | 0.030" (0.76mm) | 281°F (138°C) | - | 21 AWG, 22 SWG | Lead Free | - | |||||
|
1042097 | 115.7300 | |
423 | 0.00000000 | Harimatec Inc. | ARAX | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 17.64 oz (500g) | 0.063" (1.60mm) | 430°F (221°C) | - | 14 AWG, 16 SWG | Lead Free | - | ||||||
|
386848 | - | |
9035 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 1 lb (454 g) | 0.032" (0.81mm) | No-Clean | 20 AWG, 21 SWG | |||||||||||
|
412185 | - | |
6816 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | No-Clean | 23 AWG, 24 SWG | |||||||||||
|
412188 | - | |
5700 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | No-Clean | 27 AWG, 28 SWG | - | ||||||||||
|
732997 | - | |
4368 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 423°F (217°C) | Water Soluble | 20 AWG, 21 SWG | Lead Free | - | ||||||
|
838498 | - | |
3096 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 40 | Spool, 8.8 oz (250g) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | - | |||||||||
|
848874 | 97.2200 | |
19 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 1 | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | |||||||||
|
865940 | 71.7500 | |
38 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 440 ~ 464°F (227 ~ 240°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | - | ||||||
|
1007354 | - | |
6530 | 0.00000000 | Harimatec Inc. | LM100 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Bi58Sn42 (58/42) | Jar, 17.64 oz (500g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 2 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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