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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
1394819 | - |  |
8388 | 0.00000000 | Harimatec Inc. | DA100 | Bulk | Obsolete | Solder Paste | 12 Months | Date of Manufacture | -0.4°F (-18°C), 41°F ~ 50°F (5°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Syringe, 1.06 oz (30g) | - | 546 ~ 567°F (286 ~ 297°C) | - | 4 | ||||||||
|
721473 | - | |
5549 | 0.00000000 | Harimatec Inc. | - | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | - | Syringe, 1.06 oz (30g) | - | - | No-Clean | - | Lead Free | 3 | |||||
 |
17551 | 3.7000 | |
15 | 0.00000000 | Aven Tools | - | Bag | Obsolete | Wire Solder | - | - | - | download | Not applicable | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 20 | Sn60Pb40 (60/40) | Tube, 0.71 oz (20g) | 0.039" (0.99mm) | 360°F (180°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | |||||
 |
SMD291AX10T4 | 24.9500 | |
3935 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 4 | ||
 |
SMD4300AX250T4 | 51.9500 | |
9 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | Refrigerated | 4 | ||
 |
SMDLTLFP10T4 | 26.9500 | |
3315 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMDLTL | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 4 | ||
 |
SMD291AX250T3 | 41.9500 | |
3453 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | |
 |
SMDLTLFP250T3 | 69.9500 | |
5134 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMDLTL | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |
 |
SMD291AX250T5 | 90.9500 | |
4023 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 5 | |
 |
SMD4300SNL250T5 | 103.9500 | |
8 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 5 | |
 |
24-9574-7615 | 90.0500 | |
31 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 441°F (227°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | |||||
 |
24-9574-6422 | 78.3073 | |
8589 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 441°F (227°C) | Water Soluble | 27 AWG, 28 SWG | Lead Free | |||||
 |
24-6337-7600 | 38.9557 | |
4275 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
|
24-9574-6401 | 68.2821 | |
9500 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | |||||
 |
24-6337-9702 | 59.0500 | |
1 | 0.00000000 | Kester Solder | 285 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | Leaded | |||||
 |
16-6337-0125 | 55.0300 | |
97 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 16-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.125" (3.18mm) | 361°F (183°C) | - | 8 AWG, 10 SWG | Leaded | |||||
|
16-6040-0031 | - | |
1876 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.031" (0.79mm) | 361°F (183°C) | - | 20 AWG, 22 SWG | Leaded | - | |||||
|
16-6040-0050 | - | |
2454 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.050" (1.27mm) | 361°F (183°C) | - | 16 AWG, 18 SWG | Leaded | - | |||||
 |
24-6337-7602 | 56.6590 | |
7690 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||
 |
4867-227G | - | |
5316 | 0.00000000 | MG Chemicals | 4860 | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 2 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.050" (1.27mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | Leaded | - | |||||
 |
SMD4300SNL10T5 | 38.9500 | |
3763 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Syringe | Active | Solder Paste | SMD4300 | 0.077 lb (34.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 5 | |
 |
4902P-15G | 18.1000 | |
8890 | 0.00000000 | MG Chemicals | 4902 | Bulk | Active | Solder Paste | 4902P | 12 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 5 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | - | ||
|
04-1090-0000 | - | |
9913 | 0.00000000 | Kester Solder | - | Bulk | Obsolete | Bar Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb90Sn10 (90/10) | Bar, 1.66 lbs (750g) | - | - | - | - | Leaded | - | ||||
 |
44-6040-0050 | 62.8300 | |
184 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Bar, 1.66 lbs (750g) | - | 361 ~ 374°F (183 ~ 190°C) | - | - | Leaded | - | |||
 |
44-7070-0000 | 137.7157 | |
7754 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7070 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Bar, 1.66 lbs (750g) | - | 430 ~ 473°F (221 ~ 245°C) | - | - | Lead Free | - | |||
|
44-7071-0000 | - | |
5325 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7071 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95.5Ag3.9Cu0.6 (95.5/3.9/0.6) | Bar, 1.66 lbs (750g) | - | - | - | - | Lead Free | - | |||
|
44-7150-0000 | 86.0384 | |
1108 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | 44-7150 | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn62Pb36Ag2 (62/36/2) | Bar, 1.66 lbs (750g) | - | 354°F (179°C) | - | - | Leaded | - | |||
|
14-5050-0125 | - | |
2579 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 420°F (183 ~ 216°C) | - | 8 AWG, 10 SWG | Leaded | ||||
 |
14-7068-0040 | 100.6910 | |
2348 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | - | 18 AWG, 19 SWG | Lead Free | ||||
|
14-7068-0125 | 91.0050 | |
3425 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 423 ~ 424°F (217 ~ 218°C) | - | 8 AWG, 10 SWG | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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