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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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SMD2SW.020 1LB | 40.0500 | 1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||||
SMD3SW.031 1LB | 75.5400 | 8951 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||||
TS391AX250 | 54.9500 | 8359 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391A | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||||
TS391AX50 | 13.9500 | 2118 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391A | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||||
SMD3SW.031 8OZ | 45.3200 | 1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||||
SMD2SWLF.020 8OZ | 38.4200 | 1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | ||||||
96-9574-9531 | 91.4900 | 31 | 0.00000000 | Kester Solder | 268 | Bulk | Active | Wire Solder | 96-9574 | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | KE1814 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
96-9574-9540 | 99.4300 | 89 | 0.00000000 | Kester Solder | 268 | Bulk | Active | Wire Solder | 96-9574 | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 441°F (227°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | |||||||
24-7068-1401 | 119.7900 | 225 | 0.00000000 | Kester Solder | 48 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||
24-7068-7617 | 115.2200 | 95 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | ||||||
44-7068-0000 | 131.5600 | 370 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7068 | 1.7 lbs (771.1 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 1.66 lbs (750g) | - | 423 ~ 424°F (217 ~ 218°C) | - | - | Lead Free | - | |||||
04-7012-0000 | - | 7086 | 0.00000000 | Kester Solder | E-Bar | Bulk | Obsolete | Bar Solder | 1.7 lbs (771.1 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | KE1136 | EAR99 | 8311.30.6000 | 15 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1.66 lbs (750g) | - | 441°F (227°C) | - | - | Lead Free | - | |||||
14-7050-0031 | 105.7813 | 7601 | 0.00000000 | Kester Solder | * | Bulk | Active | 14-7050 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | Q2619842 | EAR99 | 8311.30.3000 | 100 | ||||||||||||||||||
JET551AX30T5 | 91.9500 | 7299 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | 315-JET551AX30T5 | 1 | Sn63Pb37 (63/37) | Syringe, 3.53 oz (100g) | - | 361°F (183°C) | No-Clean | - | Leaded | ||||||||
SMDLTB35T4 | 25.9500 | 4707 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDLTB35T4 | 1 | Sn60Bi40 (60/40) | Syringe, 1.23 oz (35g), 10cc | - | 280°F ~ 338°F (138°C ~ 170°C) | No-Clean | - | - | ||||||||
SMDSN90AU10-2FT | 39.9500 | 18 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-SMDSN90AU10-2FT | EAR99 | 8311.30.6000 | 1 | Sn90Au10 (90/10) | Spool | 0.016" (0.40mm) | 423°F (217°C) | - | - | Lead Free | ||||||
JET551LT30T5 | 99.9500 | 2191 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-JET551LT30T5 | 1 | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | Syringe, 3.53 oz (100g) | - | 280°F (138°C) | No-Clean | - | - | ||||||||
CQ-SS-SNBIAG-0.60MM-25000 | 76.9500 | 6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.60MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.024" (0.61mm) | 280°F (138°C) | - | - | - | |||||||
WBWS633720-2OZ | 8.7500 | 5 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWS633720-2OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | - | No-Clean, Water Soluble | - | Leaded | - | - | |||||
WBWS633731-4OZ | 13.9900 | 2 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWS633731-4OZ | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | - | No-Clean, Water Soluble | - | Leaded | - | - | |||||
WBWSSAC20-1LB | 92.9900 | 10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWSSAC20-1LB | EAR99 | 8311.30.6000 | 1 | Sn97Cu3 (97/3) | Spool, 1 lb (453.592g) | 0.020" (0.51mm) | - | Water Soluble | - | Lead Free | ||||||
WBRA633720-1LB | 46.9900 | 6 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRA633720-1LB | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 16 oz (453.592g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | - | Leaded | ||||||
WBWSSAC20-2OZ | 14.9900 | 6 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWSSAC20-2OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | - | Water Soluble | - | Lead Free | - | ||||||||
WBRASAC20-1LB | 92.9900 | 10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRASAC20-1LB | EAR99 | 8311.30.6000 | 1 | - | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423°F (217°C) | Rosin Activated (RA) | - | Lead Free | - | - | |||||
WBCANFIELD6040 | - | 2551 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Wire Solder | - | - | - | - | - | - | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2349-WBCANFIELD6040 | EAR99 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.592g) | 0.125" (3.18mm) | 363°F (184°C) | Rosin Activated (RA) | - | Leaded | |||||||
24-7068-6411 | 122.3700 | 26 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | ||||||
92-6337-8860 | 103.1655 | 9235 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | Leaded | |||||||
TOL-09163 | 4.0000 | 2038 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-09163 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.53 oz (15g) | 0.031" (0.79mm) | - | No-Clean, Water Soluble | - | Lead Free | |||||||
24-7068-9716 | 137.5200 | 50 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Mildly Activated (RMA) | 18 AWG, 19 SWG | Lead Free | |||||||
92-6040-8846 | 44.3713 | 2674 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 18 AWG, 19 SWG | Leaded |
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