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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
RCBLF227L2031E | 35.1900 |  |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF227L2031E | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 440°F (227°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
WCBLF22701020 | 68.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WCBLF22701020 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 440°F (227°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
84-6337-0118 | - | |
8925 | 0.00000000 | Kester Solder | Solid Solder Wire | Bulk | Active | Wire Solder | 84-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 11.02 lbs (5kg) | 0.118" (3.00mm) | 361°F (183°C) | - | 9 AWG, 11 SWG | Leaded | |||||
 |
JET551LT30T5 | 99.9500 | |
2191 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-JET551LT30T5 | 1 | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | Syringe, 3.53 oz (100g) | - | 280°F (138°C) | No-Clean | - | - | ||||||
 |
9132 | 3.0000 | |
96 | 0.00000000 | GC Electronics | * | Bulk | Active | download | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-9132 | EAR99 | 8311.30.3000 | 1 | |||||||||||||||||
 |
673828 | 59.7600 | |
10 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 0.55 lb (249.48 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | ||||||
 |
NC2SWLF.020 0.3OZ | 2.7700 | |
25 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC2SWLF.0200.3OZ | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | 24 AWG, 25 SWG | - | |||||
 |
SSLFWS-35G | 24.9900 | |
8954 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSLFWS | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSLFWS-35G | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | - | Rosin Mildly Activated (RMA), Water Soluble | - | - | 3 | ||||
 |
CC9601020ESAC | 92.5400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CC9601020ESAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
4886-454G | 71.5700 | |
12 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4886 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | |||
|
SOLDER WIRE SAC0307-0.6 | 13.1600 | |
8771 | 0.00000000 | Olimex LTD | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1188-SOLDERWIRESAC0307-0.6 | 1 | Sn99Cu0.7Ag0.3 (99/0.7/0.3) | Spool | 0.024" (0.61mm) | 415 ~ 442°F (213 ~ 228°C) | No-Clean | - | Lead Free | ||||||||
 |
92-7150-9703 | - | |
6071 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 92-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 17.64 oz (500g) | 0.015" (0.38mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | |||||
 |
92-7068-8803 | - | |
7397 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | |||||
 |
83-7068-1402 | 6.7500 | |
1 | 0.00000000 | Kester Solder | 83 | Bag | Active | Wire Solder | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 2368-83-7068-1402 | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.43 oz (12.19g) | 0.031" (0.79mm) | - | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | |||||||
 |
CQ-SS-SNBIAG-0.35MM-25000 | 59.9500 | |
10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.35MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.014" (0.36mm) | 280°F (138°C) | - | - | - | |||||
 |
NCSWLF.020 0.3OZ | 4.9500 | |
36 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NCSWLF.0200.3OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | 24 AWG, 25 SWG | - | |||||
 |
18-7000-0045 | 1.0000 | |
5443 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 18-7000 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99 (99) | Spool, 20 lbs (9.07kg) | 0.045" (1.14mm) | - | - | 17 AWG, 18 SWG | Lead Free | |||||
 |
BARSN63PB37-8OZ | 16.2400 | |
7311 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN63 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Bar, 0.5 lb (227g) | - | 361°F (183°C) | - | - | Leaded | ||||||
 |
RASWLF.031 1OZ | 7.0600 | |
60 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0311OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Lead Free | |||||||
 |
4886-227G | 50.5400 | |
2 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4886 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | |||
 |
T0051403099 | 14.0000 | |
5939 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051403099 | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 3.53 oz (100g) | 0.039" (0.99mm) | - | No-Clean | - | Leaded | |||||
 |
386820 | 31.6700 | |
61 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Active | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | 82-134 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 361°F (183°C) | Water Soluble | 23 AWG, 24 SWG | Leaded | - | ||||
 |
SMD2SWLF.015 2OZ | 16.9800 | |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||
|
92-6337-9756 | - | |
2116 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.010" (0.25mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 30 AWG, 33 SWG | Leaded | |||||
 |
24-6337-0652 | 39.5920 | |
7555 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Water Soluble | 18 AWG, 19 SWG | Leaded | ||||||
 |
WCBLF227L2062E | 33.4400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WCBLF227L2062E | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 440°F (227°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | ||||||||
|
92-7150-9702 | - | |
8443 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 92-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 354°F (179°C) | Rosin Mildly Activated (RMA) | 24 AWG, 25 SWG | Leaded | |||||
 |
SMD3SWLT.047 1OZ | 13.0300 | |
13 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.0471OZ | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 1 oz (28.35g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | ||||||
 |
92-7080-0018 | - | |
2805 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 92-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn95Sb5 (95/5) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Lead Free | |||||
 |
NC191LT10 | 7.9500 | |
38 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT10 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.35 oz (10g), 5cc | - | 280°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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