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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
24-7080-8802 | - |  |
4939 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||
 |
RCBLF227L2020P | 40.8400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF227L2020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
WBRC96462 | 89.7800 | |
4519 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96Ag4 (96/4) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 430°F (221°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||||
|
23-6040-0027 | - | |
1025 | 0.00000000 | Kester Solder | 44 | Spool | Obsolete | Wire Solder | 0.5 lb (226.8 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1117 | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||
 |
4860P-500G | - | |
5244 | 0.00000000 | MG Chemicals | 4860 | Bulk | Obsolete | Solder Paste | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | |||||
 |
WBWSSAC31-4OZ | 24.9900 | |
6141 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWSSAC31-4OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | - | Water Soluble | - | Lead Free | ||||
|
840933 | - | |
8043 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 40 | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | - | |||||||||
 |
EXB-SN63PB37 | 23.0200 | |
8512 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN63 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-EXB-SN63PB37 | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | - | 361°F (183°C) | - | - | Leaded | |||||
|
26-6040-0103 | - | |
8905 | 0.00000000 | Kester Solder | 44 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 5 lbs (2.27kg) | 0.081" (2.06mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 12 AWG, 14 SWG | Leaded | ||||||
 |
27-7080-0661 | 1.0000 | |
5036 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 27-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 36 | Sn95Sb5 (95/5) | Spool, 18 lbs (8.16kg) | 0.062" (1.57mm) | 450 ~ 464°F (232 ~ 240°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | |||||
 |
24-6337-8806 | 76.9900 | |
219 | 0.00000000 | Kester Solder | 245 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | ||||
 |
397127 | - | |
1719 | 0.00000000 | Harimatec Inc. | 370 | Spool | Obsolete | Wire Solder | 1.2 lbs (544.3 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn62Pb38 (62/38) | Spool, 17.64 oz (500g) | 0.024" (0.61mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | - | |||||
|
2370856 | 73.0500 | |
8998 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 50 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge | - | 423°F (217°C) | No-Clean | - | Lead Free | 5 | |||||||
|
2080670 | 75.0211 | |
4310 | 0.00000000 | Harimatec Inc. | HF2W | Bulk | Active | Solder Paste | - | - | 32°F ~ 50°F (0°C ~ 10°C) | To ensure customer satisfaction and product integrity, air shipment is recommended. | - | RoHS non-compliant | Not Applicable | 0000.00.0000 | 10 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | ||||||||
 |
25-7080-0069 | 249.7688 | |
8076 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 25-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 4 lbs (1.81kg) | 0.125" (3.18mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Lead Free | |||||
|
57-3343-8109 | - | |
8261 | 0.00000000 | Kester Solder | - | Jar | Obsolete | Solder Paste | 1.1 lbs (499 g) | - | - | - | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | Q4067260A | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | - | - | Lead Free | - | |||
|
17554 | - | |
3824 | 0.00000000 | Aven Tools | - | Spool | Obsolete | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | Not applicable | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 8.8 oz (250g) | 0.030" (0.76mm) | 360°F (180°C) | Rosin Activated (RA) | 21 AWG, 22 SWG | Leaded | - | ||||
 |
4865-454G | 71.5700 | |
7 | 0.00000000 | MG Chemicals | 4860 | Spool | Active | Wire Solder | 4865 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||
 |
SMDSW.031 2OZ | 10.5700 | |
12 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.125 lb (56.7 g) | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | |||
 |
SMDSWLF.020 2OZ | 18.1800 | |
18 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.125 lb (56.7 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | |||
 |
SMDSW.031 4OZ | 16.6700 | |
8 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.25 lb (113.4 g) | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | |||
 |
SMDSW.020 4OZ | 17.0200 | |
9 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.25 lb (113.4 g) | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
 |
4888-454G | 71.5700 | |
2 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4888 | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | - | |||
 |
796037 | 60.8700 | |
9713 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423°F (217°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Lead Free | - | |||||
 |
386857 | - | |
9592 | 0.00000000 | Harimatec Inc. | C400 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||||
 |
981501 | - | |
8451 | 0.00000000 | Harimatec Inc. | - | Bulk | Obsolete | Bar Solder | 2.5 lbs (1.1 kg) | - | - | - | - | download | RoHS Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1,000 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 2.5 lbs (1.13kg) | - | 423°F (217°C) | - | - | Lead Free | - | ||||
 |
SMD291AX500T4C | 97.5000 | |
2538 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | ||||
|
MMF006622 | 116.5800 | |
1365 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | 361-40R | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | |||||
 |
4860P-250G | - | |
7039 | 0.00000000 | MG Chemicals | 4860 | Bulk | Obsolete | Solder Paste | 24 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||||
 |
4915-112G | - | |
5806 | 0.00000000 | MG Chemicals | 4915 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1236 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 18 AWG, 19 SWG | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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