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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMDSN100-S-16 | 33.6800 |  |
1 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDSN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn100(100) | Bag, 1 lb (454g) | - | 450°F (232°C) | - | - | Lead Free | ||||||
 |
16-6040-0050 | - | |
2454 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.050" (1.27mm) | 361°F (183°C) | - | 16 AWG, 18 SWG | Leaded | - | ||||||
|
70-1903-0911 | 249.3450 | |
5783 | 0.00000000 | Kester Solder | R520A | Bulk | Active | Solder Paste | 70-1903 | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | 4 | ||||
 |
SMDPB100-S-16 | 10.0000 | |
6937 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDPB | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Pb100(100) | Bag, 1 lb (454g) | - | 622°F (328°C) | - | - | Leaded | ||||||
 |
24-9574-6401 | 68.2821 | |
9500 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||
 |
BARSN42BI57AG1 | 54.0000 | |
13 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN42 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Bar, 1 lb (454g) | - | 280°F (138°C) | - | - | Lead Free | ||||||
 |
17551 | 3.7000 | |
15 | 0.00000000 | Aven Tools | - | Bag | Obsolete | Wire Solder | - | - | - | download | Not applicable | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 20 | Sn60Pb40 (60/40) | Tube, 0.71 oz (20g) | 0.039" (0.99mm) | 360°F (180°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | ||||||
 |
SR37-LFM23S-3.5-0.8MM | 45.0600 | |
5 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM23S-3.5-0.8MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.031" (0.79mm) | - | - | - | Lead Free | |||||||
|
412185 | - | |
6816 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | No-Clean | 23 AWG, 24 SWG | |||||||||||
 |
SMD2SW.031 1OZ | 7.3700 | |
29 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
28-6337-6470 | - | |
1138 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 28-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 20 lbs (9.07kg) | 0.093" (2.36mm) | 361°F (183°C) | Water Soluble | 11 AWG, 13 SWG | Leaded | |||||
 |
SMD291SNL60T4 | 44.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMD291 | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 2.12 oz (60g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | |||||
 |
92-9574-7611 | - | |
8534 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 92-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 441°F (227°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | |||||
|
1007354 | - | |
6530 | 0.00000000 | Harimatec Inc. | LM100 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Bi58Sn42 (58/42) | Jar, 17.64 oz (500g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 2 | ||||||
 |
SMDAL | 16.9500 | |
2313 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Paste | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Syringe, 0.35 oz (10g), 5cc | - | 430°F (221°C) | Water Soluble | - | Lead Free | Refrigerated | 3 | ||||
 |
WBRASAC20-1LB | 92.9900 | |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRASAC20-1LB | EAR99 | 8311.30.6000 | 1 | - | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423°F (217°C) | Rosin Activated (RA) | - | Lead Free | - | - | |||
 |
24-6337-8860 | 46.7044 | |
4302 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | Leaded | ||||||
 |
NC191LTA10 | 7.9500 | |
3541 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA10 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.35 oz (10g), 3cc | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||
 |
92-7068-8843 | - | |
8731 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | |||||
|
24-7068-7614 | - | |
9273 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | - | |||||
 |
SMDBI100-S-1 | 9.0000 | |
10 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDBI | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Bi100(100) | Bag, 1 oz (28g) | - | 521°F (271°C) | - | - | Lead Free | ||||||
 |
SMDSWLF.015 .3OZ | 12.9900 | |
1 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMDSWLF.015.3OZ | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.3 oz (8.51g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | Lead Free | - | |||
 |
4888-454G | 71.5700 | |
2 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4888 | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | - | |||
|
70-1608-0904 | 0.7900 | |
8035 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | 117-70-1608-0904 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 3.53 oz (100g) | - | - | No-Clean | - | Lead Free | |||||||||
 |
WCBLF227L2020 | 40.8400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WCBLF227L2020 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 440°F (227°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
4915-112G | - | |
5806 | 0.00000000 | MG Chemicals | 4915 | Spool | Obsolete | Wire Solder | - | - | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1236 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.040" (1.02mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 18 AWG, 19 SWG | Lead Free | ||||||
 |
24-7050-0066 | 107.3368 | |
5931 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | Lead Free | |||||
 |
CWSN60WRAP3 0.15 | 66.1500 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60WRAP30.15 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - | |||||||||
 |
CWSAC WRMAP .015 | 114.9800 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSAC | - | - | - | - | ROHS3 Compliant | 2757-CWSACWRMAP.015 | 25 | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - | |||||||||
 |
SMD4300AX250T4 | 51.9500 | |
9 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | Refrigerated | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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