Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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70-2102-0511 | 137.5860 | ![]() |
9983 | 0.00000000 | Kester Solder | R562 | Bulk | Active | Solder Paste | 70-2102 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
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24-9574-7615 | 90.0500 | ![]() |
31 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 441°F (227°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | ||||||
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SMDSWLT.040 10G | 19.9500 | ![]() |
13 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 0.35 oz (10g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
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1042097 | 115.7300 | ![]() |
423 | 0.00000000 | Harimatec Inc. | ARAX | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 17.64 oz (500g) | 0.063" (1.60mm) | 430°F (221°C) | - | 14 AWG, 16 SWG | Lead Free | - | ||||||
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CWSN60WRMAP3 .015 | 62.1500 | ![]() |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60WRMAP3.015 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.015" (0.38mm) | - | - | - | - | |||||||||
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SMD2205 | 81.9500 | ![]() |
3077 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.025" (0.64mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
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24-6337-8810 | 172.0840 | ![]() |
9349 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 361°F (183°C) | No-Clean | 30 AWG, 33 SWG | Leaded | ||||||
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RC6001062P | 40.0200 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC6001062P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 363°F (184°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||||||
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395437 | 44.2600 | ![]() |
8666 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 17.64 oz (500g) | 0.028" (0.71mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 21 AWG, 22 SWG | Leaded | - | |||||
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24-4060-0066 | 42.2212 | ![]() |
8606 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-4060 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb60Sn40 (60/40) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 361 ~ 460°F (183 ~ 238°C) | Rosin Activated (RA) | 11 AWG, 13 SWG | Leaded | |||||
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SMDLTB35T4 | 25.9500 | ![]() |
4707 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDLTB35T4 | 1 | Sn60Bi40 (60/40) | Syringe, 1.23 oz (35g), 10cc | - | 280°F ~ 338°F (138°C ~ 170°C) | No-Clean | - | - | ||||||
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4902P-15G | 18.1000 | ![]() |
8890 | 0.00000000 | MG Chemicals | 4902 | Bulk | Active | Solder Paste | 4902P | 12 Months | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 5 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | - | |||
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4900-227G | 89.3100 | ![]() |
20 | 0.00000000 | MG Chemicals | 4900 | Spool | Active | Wire Solder | 4900 | 0.5 lb (226.8 g) | 60 Months | - | 65°F ~ 80°F (18°C ~ 27°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 2 | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | Spool, 8 oz (227g), 1/2 lb | 0.032" (0.81mm) | 423 ~ 430°F (217 ~ 221°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||
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152985 | 48.9700 | ![]() |
54 | 0.00000000 | Kester Solder | ALPHA® | Box | Active | 6 Months | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 117-152985 | EAR99 | 3810.10.0000 | 125 | Refrigerated | |||||||||||||
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SS-S031AS | - | ![]() |
9185 | 0.00000000 | MENDA/EasyBraid | - | Bulk | Obsolete | Wire Solder | - | - | - | - | - | - | RoHS non-compliant | Not Applicable | REACH Unaffected | EB1067 | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | - | |||
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26-5050-0061 | - | ![]() |
2687 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 26-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361 ~ 420°F (183 ~ 216°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | |||||
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24-6337-0069 | 41.9534 | ![]() |
3252 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361°F (183°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | Leaded | |||||
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421562 | - | ![]() |
1549 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 1 lb (454 g) | 0.040" (1.02mm) | No-Clean | 18 AWG, 19 SWG | |||||||||||
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SMD3SWLT.040 200G | 189.2500 | ![]() |
13 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.040200G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 7 oz (200g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | |||||
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SMD4300SNL250T5 | 103.9500 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | Refrigerated | 5 | ||
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96-7068-8825 | - | ![]() |
1472 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | |||||
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CQ-SS-623602-0.65MM-25000 | 82.9500 | ![]() |
10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | 1 (Unlimited) | 315-CQ-SS-623602-0.65MM-25000 | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Jar | 0.026" (0.66mm) | 354°F (179°C) | - | - | - | |||||
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1769647 | - | ![]() |
1389 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | 1000-124 | EAR99 | 8311.30.3000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 21.16 oz (600g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | ||||
673831 | 105.6200 | ![]() |
17 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 0.55 lb (249.48 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.048" (1.22mm) | 423°F (217°C) | No-Clean | 16 AWG, 18 SWG | Lead Free | |||||||
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24-6337-0652 | 39.5920 | ![]() |
7555 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361°F (183°C) | Water Soluble | 18 AWG, 19 SWG | Leaded | ||||||
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70-0203-0311 | - | ![]() |
8419 | 0.00000000 | Kester Solder | EP256HA | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | - | 354°F (179°C) | No-Clean | - | Leaded | - | ||||||
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24-7038-0673 | - | ![]() |
8609 | 0.00000000 | Kester Solder | OR421 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn97Cu3 (97/3) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | - | Water Soluble | 20 AWG, 22 SWG | Lead Free | ||||||
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WBARSAC-1/2LB | 55.0000 | ![]() |
7 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WBARSAC | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBARSAC-1/2LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 0.5 lb (266.79g) | - | - | - | - | Lead Free | |||||
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CC9601031PAG3 | 89.3900 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CC9601031PAG3 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||||
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CQ-SS-SNBIAG-0.60MM-25000 | 76.9500 | ![]() |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.60MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.024" (0.61mm) | 280°F (138°C) | - | - | - |
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