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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD2SWLF.031 8OZ | 37.6400 |  |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||
 |
70-4105-0810 | 142.5310 | |
7634 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4105 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
 |
SMD3SWLT.040 50G | 70.9500 | |
6128 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04050G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 1.8 oz (50g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | |||||
 |
WC6301062 | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301062 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
 |
24-6337-0027 | 56.5100 | |
209 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||
 |
NC2SWLF.031 1LB | 55.7500 | |
6806 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | |||||
 |
27-9574-0654 | - | |
2150 | 0.00000000 | Kester Solder | OR421 | Bulk | Active | Wire Solder | 27-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 36 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 18 lbs (8.16kg) | 0.062" (1.57mm) | 441°F (227°C) | Water Soluble | 14 AWG, 16 SWG | Lead Free | |||||
 |
SS-S020 | - | |
8403 | 0.00000000 | MENDA/EasyBraid | - | Bulk | Obsolete | Wire Solder | - | - | - | - | - | - | RoHS non-compliant | Not Applicable | REACH Unaffected | EB1064 | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
 |
RCBLF22701020P | 68.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
SMD3SW.020 1OZ | 14.6700 | |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||
 |
70-4003-2111 | 0.4400 | |
7441 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-70-4003-2111 | 1 | ||||||||||||||||||||||
 |
SMDLTLFP15T4 | 19.9500 | |
7 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 0.53 oz (15g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
14-7080-1001 | - | |
5280 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 450 ~ 464°F (232 ~ 240°C) | - | 11 AWG, 13 SWG | Lead Free | |||||
|
70-1003-0618 | - | |
7414 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1003 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 49.38 oz (1.4kg) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
 |
96-9574-9525 | 104.3500 | |
83 | 0.00000000 | Kester Solder | 268 | Bulk | Active | Wire Solder | 96-9574 | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 441°F (227°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | |||||
 |
SMDLTLFP60T4 | 40.9500 | |
8221 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | |||||
 |
SMDSW.031 8OZ | 24.4000 | |
10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||
 |
SMD2020-25000 | 28.9900 | |
7617 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
24-6337-9756 | 126.5300 | |
141 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.010" (0.25mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 30 AWG, 33 SWG | Leaded | |||||
 |
SMD291SNL250T3 | 54.9500 | |
4587 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
 |
70-0102-0518 | - | |
5909 | 0.00000000 | Kester Solder | EP256 | Bulk | Active | Solder Paste | 70-0102 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 49.38 oz (1.4kg) | - | 361°F (183°C) | No-Clean | - | Leaded | 3 | ||||
 |
SMDSW.020 1OZ | 7.8900 | |
12 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.062 lb (28.12 g) | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 oz (28.35g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
 |
TS391LT250 | 84.9500 | |
1121 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
SMD2150-25000 | 20.9900 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | |||||
 |
RASW.020 2OZ | 6.8400 | |
26 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0202OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||
|
NC2SWLF.015 2OZ | 16.9800 | |
29 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NC2SW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NC2SWLF.0152OZ | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | - | - | |||
 |
24-7040-0061 | - | |
1920 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 430°F (221°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | |||||
 |
44-7040-0000 | - | |
1362 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7040 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Bar, 1.66 lbs (750g) | - | 430°F (221°C) | - | - | Lead Free | - | ||||
|
24-7317-9710 | 69.1729 | |
5043 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7317 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb88Sn10Ag2 (88/10/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | Leaded | |||||
|
6040 | 34.9900 | |
29 | 0.00000000 | GC Electronics | - | Bulk | Active | Wire Solder | 1 lb (453.59 g) | 24 Months | download | RoHS non-compliant | Vendor Undefined | REACH info available upon request | 2266-6040 | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.047" (1.19mm) | 361°F (183°C) | 16 AWG, 18 SWG | Leaded |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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