- RFQ
- BOM
-
Contact Us
Tel: +86-0755-83501315
Email: sales@sic-components.com
- Chinese
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur
Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MMF006630 | 180.0900 |  |
1817 | 0.00000000 | Micro-Measurements (Division of Vishay Precision Group) | - | Jar | Active | Solder Paste | 9 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | download | RoHS non-compliant | 1 (Unlimited) | 1240-FPA | EAR99 | 3810.10.0000 | 1 | Ag40Cu30Zn28Ni2 (40/30/28/2) | Jar, 1 oz (28g) | - | 1220 ~ 1435°F (660 ~ 780°C) | - | - | Lead Free | - | ||||||
 |
24-7150-9702 | 116.0600 | |
88 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | - | Rosin Activated (RA) | - | Leaded | ||||||
 |
16-7050-0125 | 630.9270 | |
1933 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-7050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 5 lbs (2.27kg) | 0.125" (3.18mm) | 430 ~ 444°F (221 ~ 223°C) | - | 8 AWG, 10 SWG | Lead Free | |||||
 |
SMDSWLF.015 1LB | 96.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | Lead Free | - | ||||
 |
SMD291SNL | 15.9500 | |
3534 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.033 lb (14.97 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | SMD 291SNL | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |
 |
SMDSWLF.031 .7OZ | 9.9900 | |
5 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMDSWLF.031.7OZ | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.7 oz (19.85g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 21 SWG | Lead Free | - | |||
 |
SMD291SNL250T5 | 103.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 5 | ||
 |
24-6337-7420 | 110.3486 | |
1097 | 0.00000000 | Kester Solder | 282 | Bulk | Active | Wire Solder | 24-6337 | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 22 AWG, 23 SWG | Leaded | - | |||||
 |
16-5050-0062 | - | |
2276 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 16-5050 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 1650500062 | EAR99 | 8311.30.3000 | 25 | Sn50Pb50 (50/50) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361 ~ 420°F (183 ~ 216°C) | - | 14 AWG, 16 SWG | Leaded | ||||
 |
RASWLF.015 1LB | 96.9500 | |
6411 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0151LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||||
 |
24-7068-1402 | 103.6600 | |
572 | 0.00000000 | Kester Solder | 48 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||
 |
24-7068-6403 | 114.8400 | |
108 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-7068 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 20 AWG, 22 SWG | Lead Free | ||||
 |
RC9601031PSAC | 89.3900 | |
100 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 6 (Time on Label) | REACH Unaffected | 3844-RC9601031PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
 |
CC60L2020E | 35.5600 | |
100 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | - | RoHS non-compliant | 6 (Time on Label) | REACH Affected | 3844-CC60L2020E | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (226.80g) | 0.020" (0.51mm) | 363°F (184°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||||
 |
DKS-SOLDERPASTE15G | 23.3600 | |
73 | 0.00000000 | DIGIKEY STANDARD | DIGI-KEY STANDARD | Bag | Active | Solder Paste | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | ||||
|
152986 | 26.5400 | |
70 | 0.00000000 | Kester Solder | ALPHA® | Box | Active | 6 Months | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 117-152986 | EAR99 | 3810.10.0000 | 40 | Refrigerated | |||||||||||||
 |
CQ-SS-SNBIAG-0.76MM-25000 | 97.9500 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.76MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.030" (0.76mm) | 280°F (138°C) | - | - | - | |||||
 |
CQ-SS-SNBIAG-0.50MM-25000 | 62.9500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.50MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.020" (0.51mm) | 280°F (138°C) | - | - | - | |||||
 |
CCBLF22701020 | 68.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF22701020 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 440°F (227°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
WC6301062 | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301062 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
 |
WC6001062P | 40.0200 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6001062P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 363°F (184°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
 |
WC9601020P | 92.5400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WC9601020P | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
WC63L2031 | 31.3500 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC63L2031 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
 |
RC63L2031E | 31.3500 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC63L2031E | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Leaded | ||||||||
 |
WCBLF227L2031 | 35.1900 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WCBLF227L2031 | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 440°F (227°C) | Water Soluble | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
RC60L2062BE | 27.6000 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC60L2062BE | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 363°F (184°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | ||||||||
 |
CC6001031 | 47.4100 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6001031 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 363°F (184°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
 |
CCBLF227L2031P | 35.1900 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-CCBLF227L2031P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 440°F (227°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | ||||||||
 |
RC601Z062BE | 12.1300 | |
50 | 0.00000000 | Canfield Technologies | - | Tube | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | Not applicable | 1 (Unlimited) | REACH Affected | 3844-RC601Z062BE | 1 | Sn60Pb40 (60/40) | Tube, 1 oz (28.35g) | 0.062" (1.57mm) | 363°F (184°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||||||
 |
RCBLF22701020P | 68.3800 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)