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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Type Base Product Number Weight Shelf Life Shelf Life Start Storage/Refrigeration Temperature Shipping Info DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Composition Form Diameter Melting Point Flux Type Wire Gauge Process SIC Storage Mesh Type
92-7068-7642 Kester Solder 92-7068-7642 -
RFQ
 ECAD 3891 0.00000000 Kester Solder 275 Bulk Active Wire Solder 92-7068 - - 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 17.64 oz (500g) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) No-Clean 20 AWG, 22 SWG Lead Free
4470120000 Kester Solder 4470120000 40.2914
RFQ
 ECAD 5301 0.00000000 Kester Solder - Bulk Active Bar Solder - 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - download 117-4470120000 1 Sn99.3Cu0.7 (99.3/0.7) Bar, 1.66 lbs (750g) - 423°F ~ 426°F (217°C ~ 219°C) - - Lead Free
662727 Harimatec Inc. 662727 -
RFQ
 ECAD 6770 0.00000000 Harimatec Inc. MP218 Bulk Obsolete Solder Paste 6 Months Date of Manufacture 32°F ~ 50°F (0°C ~ 10°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download RoHS non-compliant Not Applicable EAR99 8311.90.0000 10 - - - No-Clean - Leaded 4
NC2SWLF.015 2OZ Chip Quik Inc. NC2SWLF.015 2OZ 16.9800
RFQ
 ECAD 29 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Wire Solder NC2SW - - - - - download ROHS3 Compliant Not Applicable REACH Unaffected 315-NC2SWLF.0152OZ EAR99 8311.30.6000 1 Sn99.3Cu0.7 (99.3/0.7) Spool, 2 oz (56.70g) 0.015" (0.38mm) 441°F (227°C) No-Clean - -
SMDSW.020 1OZ Chip Quik Inc. SMDSW.020 1OZ 7.8900
RFQ
 ECAD 12 0.00000000 Chip Quik Inc. - Spool Active Wire Solder SMDSW 0.062 lb (28.12 g) - - - - download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.3000 1 Sn63Pb37 (63/37) Spool, 1 oz (28.35g) 0.020" (0.51mm) 361°F (183°C) No-Clean, Water Soluble 24 AWG, 25 SWG Leaded -
CWSN99.3 WRMAP3 .032 Amerway Inc CWSN99.3 WRMAP3 .032 76.2000
RFQ
 ECAD 100 0.00000000 Amerway Inc - Box Active Wire Solder CWSN99 - - - - ROHS3 Compliant 2757-CWSN99.3WRMAP3.032 25 Sn99.3Cu0.7 (99.3/0.7) Spool, 1 lb (453.59g) 0.032" (0.81mm) - - - -
CQ-SS-SNBIAG-0.30MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.30MM-25000 59.9500
RFQ
 ECAD 5 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.30MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.012" (0.31mm) 280°F (138°C) - - -
SMDIN97AG3 Chip Quik Inc. SMDIN97AG3 19.9500
RFQ
 ECAD 27 0.00000000 Chip Quik Inc. SMD Bulk Active Wire Solder SMDIN 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.90.0000 1 In97Ag3 (97/3) Spool 0.031" (0.79mm) 289°F (143°C) - 20 AWG, 21 SWG Lead Free -
CWSnCu0.7Ni RMA3% .032 1# Amerway Inc CWSnCu0.7Ni RMA3% .032 1# 91.3000
RFQ
 ECAD 100 0.00000000 Amerway Inc - Tape & Box (TB) Active - ROHS3 Compliant REACH Affected 2757-CWSnCu0.7NiRMA3%.0321#TB 1
MMF006630 Micro-Measurements (Division of Vishay Precision Group) MMF006630 180.0900
RFQ
 ECAD 1817 0.00000000 Micro-Measurements (Division of Vishay Precision Group) - Jar Active Solder Paste 9 Months Date of Manufacture 41°F ~ 77°F (5°C ~ 25°C) download RoHS non-compliant 1 (Unlimited) 1240-FPA EAR99 3810.10.0000 1 Ag40Cu30Zn28Ni2 (40/30/28/2) Jar, 1 oz (28g) - 1220 ~ 1435°F (660 ~ 780°C) - - Lead Free -
24-7150-9702 Kester Solder 24-7150-9702 116.0600
RFQ
 ECAD 88 0.00000000 Kester Solder 285 Bulk Active Wire Solder 24-7150 - - 50°F ~ 104°F (10°C ~ 40°C) - RoHS non-compliant Not Applicable REACH Unaffected EAR99 8311.30.3000 1 Sn62Pb36Ag2 (62/36/2) Spool, 1 lb (453.59g) 0.020" (0.51mm) - Rosin Activated (RA) - Leaded
16-7050-0125 Kester Solder 16-7050-0125 630.9270
RFQ
 ECAD 1933 0.00000000 Kester Solder Solid Core Wire Bulk Active Wire Solder 16-7050 - - 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 25 Sn96.3Ag3.7 (96.3/3.7) Spool, 5 lbs (2.27kg) 0.125" (3.18mm) 430 ~ 444°F (221 ~ 223°C) - 8 AWG, 10 SWG Lead Free
SMDSWLF.015 1LB Chip Quik Inc. SMDSWLF.015 1LB 96.9500
RFQ
 ECAD 1 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder SMDSW - - - - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.015" (0.38mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 27 AWG, 28 SWG Lead Free -
SMD291SNL Chip Quik Inc. SMD291SNL 15.9500
RFQ
 ECAD 3534 0.00000000 Chip Quik Inc. - Syringe Active Solder Paste SMD291 0.033 lb (14.97 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected SMD 291SNL EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free Refrigerated 3
SMDSWLF.031 .7OZ Chip Quik Inc. SMDSWLF.031 .7OZ 9.9900
RFQ
 ECAD 5 0.00000000 Chip Quik Inc. SMD Bulk Active Wire Solder SMDSW - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected SMDSWLF.031.7OZ EAR99 8311.90.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Tube, 0.7 oz (19.85g) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 21 SWG Lead Free -
SMD291SNL250T5 Chip Quik Inc. SMD291SNL250T5 103.9500
RFQ
 ECAD 1 0.00000000 Chip Quik Inc. - Jar Active Solder Paste SMD291 0.551 lb (249.93 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) - 423 ~ 428°F (217 ~ 220°C) No-Clean - Lead Free Refrigerated 5
DKS-63/37-NC-02OZ DIGIKEY STANDARD DKS-63/37-NC-02OZ 12.7200
RFQ
 ECAD 8929 0.00000000 DIGIKEY STANDARD - Bulk Active - Not Applicable 4937-DKS-63/37-NC-02OZ 1
24-6337-7420 Kester Solder 24-6337-7420 110.3486
RFQ
 ECAD 1097 0.00000000 Kester Solder 282 Bulk Active Wire Solder 24-6337 - - - - download 1 (Unlimited) REACH Unaffected EAR99 8311.30.3000 25 Sn63Pb37 (63/37) Spool, 1 lb (454 g) 0.025" (0.64mm) 361°F (183°C) Rosin Mildly Activated (RMA) 22 AWG, 23 SWG Leaded -
16-5050-0062 Kester Solder 16-5050-0062 -
RFQ
 ECAD 2276 0.00000000 Kester Solder Solid Core Wire Bulk Active Wire Solder 16-5050 - - 50°F ~ 104°F (10°C ~ 40°C) - download RoHS non-compliant 1 (Unlimited) REACH Unaffected 1650500062 EAR99 8311.30.3000 25 Sn50Pb50 (50/50) Spool, 5 lbs (2.27kg) 0.062" (1.57mm) 361 ~ 420°F (183 ~ 216°C) - 14 AWG, 16 SWG Leaded
RASWLF.015 1LB Chip Quik Inc. RASWLF.015 1LB 96.9500
RFQ
 ECAD 6411 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder RASW - download ROHS3 Compliant Not Applicable REACH Unaffected RASWLF.0151LB EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.015" (0.38mm) 422 ~ 428°F (217 ~ 220°C) Rosin Activated (RA) 27 AWG, 28 SWG Lead Free
24-7068-1402 Kester Solder 24-7068-1402 103.6600
RFQ
 ECAD 572 0.00000000 Kester Solder 48 Spool Active Wire Solder 24-7068 1 lb (453.59 g) - - 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 25 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) Rosin Activated (RA) 20 AWG, 22 SWG Lead Free
24-7068-6403 Kester Solder 24-7068-6403 114.8400
RFQ
 ECAD 108 0.00000000 Kester Solder 331 Spool Active Wire Solder 24-7068 1 lb (453.59 g) 36 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.3000 25 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) Water Soluble 20 AWG, 22 SWG Lead Free
RC9601031PSAC Canfield Technologies RC9601031PSAC 89.3900
RFQ
 ECAD 100 0.00000000 Canfield Technologies - Spool Active Wire Solder - 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - download ROHS3 Compliant 6 (Time on Label) REACH Unaffected 3844-RC9601031PSAC 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g) 0.031" (0.79mm) 423 ~ 424°F (217 ~ 218°C) Rosin Activated (RA) 20 AWG, 22 SWG Lead Free
CC60L2020E Canfield Technologies CC60L2020E 35.5600
RFQ
 ECAD 100 0.00000000 Canfield Technologies - Spool Active Wire Solder - 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - - RoHS non-compliant 6 (Time on Label) REACH Affected 3844-CC60L2020E 1 Sn60Pb40 (60/40) Spool, 8 oz (226.80g) 0.020" (0.51mm) 363°F (184°C) No-Clean 24 AWG, 25 SWG Leaded
DKS-SOLDERPASTE15G DIGIKEY STANDARD DKS-SOLDERPASTE15G 23.3600
RFQ
 ECAD 73 0.00000000 DIGIKEY STANDARD DIGI-KEY STANDARD Bag Active Solder Paste 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Syringe, 0.53 oz (15g), 5cc - 361°F (183°C) No-Clean - Leaded Refrigerated 3
152986 Kester Solder 152986 26.5400
RFQ
 ECAD 70 0.00000000 Kester Solder ALPHA® Box Active 6 Months Date of Manufacture Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected 117-152986 EAR99 3810.10.0000 40 Refrigerated
CQ-SS-SNBIAG-0.76MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.76MM-25000 97.9500
RFQ
 ECAD 8 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.76MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.030" (0.76mm) 280°F (138°C) - - -
CQ-SS-SNBIAG-0.50MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.50MM-25000 62.9500
RFQ
 ECAD 6 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.50MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.020" (0.51mm) 280°F (138°C) - - -
CCBLF22701020 Canfield Technologies CCBLF22701020 68.3800
RFQ
 ECAD 50 0.00000000 Canfield Technologies - Spool Active Wire Solder 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 3844-CCBLF22701020 1 BLF 227 (99.17Sn/.8Cu/.03Ni) Spool, 1 lb (453.59g) 0.020" (0.51mm) 440°F (227°C) No-Clean 24 AWG, 25 SWG Lead Free
WC6301062 Canfield Technologies WC6301062 41.5300
RFQ
 ECAD 50 0.00000000 Canfield Technologies - Spool Active Wire Solder 24 Months Date of Manufacture 50°F ~ 104°F (10°C ~ 40°C) - RoHS non-compliant 1 (Unlimited) REACH Affected 3844-WC6301062 1 Sn63Pb37 (63/37) Spool, 1 lb (453.59g) 0.062" (1.57mm) 361°F (183°C) Water Soluble 14 AWG, 16 SWG Leaded
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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AD9208BBPZ-3000

196-LFBGA Exposed Pad

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