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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD4300AX250T5 | 98.9500 |  |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 0.551 lb (249.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | Refrigerated | 5 | ||
 |
CB4463370030 | 24.2375 | |
8798 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-CB4463370030 | 1 | ||||||||||||||||||||||
 |
WC9601020P | 92.5400 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-WC9601020P | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 24 AWG, 25 SWG | Lead Free | ||||||||
 |
CWSnCu0.7Ni RMA3% .032 1# | 91.3000 | |
100 | 0.00000000 | Amerway Inc | - | Tape & Box (TB) | Active | - | ROHS3 Compliant | REACH Affected | 2757-CWSnCu0.7NiRMA3%.0321#TB | 1 | ||||||||||||||||||||
 |
SMD291SNL50T6 | 99.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNL50T6 | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 6 | ||||
 |
JET551LT10T5 | 47.9500 | |
7802 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-JET551LT10T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | - | 280°F ~ 338°F (138°C ~ 170°C) | No-Clean | - | - | ||||
 |
92-6337-8813 | - | |
9851 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | |||||
|
TOL-10243 | 27.5000 | |
6375 | 0.00000000 | SparkFun Electronics | - | Bulk | Active | Wire Solder | - | - | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 1568-TOL-10243 | 1 | Sn96.35Cu0.5Sb0.15Ag3 (96.35/0.5/0.15/3) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | - | Water Soluble | - | Lead Free | |||||||
|
24-3070-2437 | - | |
6849 | 0.00000000 | Kester Solder | Acid Cored Wire | Bulk | Obsolete | Wire Solder | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb70Sn30 (70/30) | Spool, 1 lb (454 g) | 0.125" (3.18mm) | 361 ~ 496°F (183 ~ 258°C) | Acid Cored | 8 AWG, 10 SWG | Leaded | - | ||||||
 |
4902P-25G | 28.8800 | |
4299 | 0.00000000 | MG Chemicals | 4902 | Bulk | Active | Solder Paste | 4902P | 24 Months (Refrigerated), 12 Months (Room Temp) | Date of Manufacture | 35°F ~ 50°F (2°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 5 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.88 oz (25g) | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | - | |||
 |
24-7040-0027 | - | |
8912 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3.5 (96.5/3.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 430°F (221°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | |||||
|
91-6337-8843 | 66.9388 | |
3217 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 91-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | ||||||
 |
SMD2150-25000 | 20.9900 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | |||||
|
92-7068-9835 | - | |
9941 | 0.00000000 | Kester Solder | 296 | Bulk | Obsolete | Wire Solder | 92-7068 | - | - | - | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.025" (0.64mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 22 AWG, 23 SWG | Lead Free | - | ||||
 |
SMD291SNL10 | 24.9900 | |
36 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.077 lb (34.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
 |
24-6040-9703 | 68.4000 | |
91 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | |||||
|
92-6337-9727 | - | |
5227 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | |||||
 |
SMD2SWLF.031 1LB | 62.7400 | |
19 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||
|
147226 | - | |
9987 | 0.00000000 | Kester Solder | * | Cut Tape (CT) | Active | - | - | - | - | RoHS Compliant | Vendor Undefined | REACH Unaffected | EAR99 | 8311.90.0000 | 4,000 | |||||||||||||||
 |
24-9574-7609 | 91.2600 | |
83 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | ||||||
 |
SMD291SNL500T5 | 198.9500 | |
8103 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 5 | ||||
|
1747469 | - | |
4443 | 0.00000000 | Harimatec Inc. | HF250DP | Bulk | Obsolete | Solder Paste | - | - | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | Cartridge, 0.88 oz (25g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | |||||
 |
14-7070-0031 | 125.0542 | |
8901 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7070 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 430 ~ 473°F (221 ~ 245°C) | - | 20 AWG, 22 SWG | Lead Free | |||||
|
2164169 | - | |
2720 | 0.00000000 | LOCTITE | LM100 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Bi58Sn42 (58/42) | Jar | - | 281°F (138°C) | No-Clean | - | Lead Free | - | - | |||||
 |
SMD4300SNL500T4C | 127.5000 | |
6259 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | 4 | ||||
|
96-6040-8832 | - | |
1837 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 17.64 oz (500g) | 0.031" (0.79mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||
 |
24-6337-0061 | 57.1400 | |
87 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | ||||
 |
SMDLTLFP60T4 | 40.9500 | |
8221 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | |||||
|
24-6337-8500 | - | |
2116 | 0.00000000 | Kester Solder | 232 | Bulk | Obsolete | Wire Solder | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | - | 20 AWG, 22 SWG | Leaded | - | ||||||
 |
SMDSWLF.015 2OZ | 18.4200 | |
4 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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