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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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70-1002-0510 | 129.0500 | 8 | 0.00000000 | Kester Solder | HydroMark 531 | Jar | Active | Solder Paste | 70-1002 | 1.1 lbs (499 g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | Refrigerated | 3 | ||||
70-1903-0810 | 206.5200 | 8 | 0.00000000 | Kester Solder | R520A | Jar | Active | Solder Paste | 70-1903 | 1.1 lbs (499 g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | 3 | |||||
17552 | - | 8679 | 0.00000000 | Aven Tools | - | Tube | Obsolete | Wire Solder | 0.71 oz (20.23 g) | - | - | - | - | download | Not applicable | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Tube, 0.71 oz (20g) | 0.047" (1.19mm) | 360°F (180°C) | Rosin Activated (RA) | 17 AWG, 18 SWG | Leaded | - | ||||||
4898-454G | 82.2600 | 1 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4898 | 1 lb (453.59 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | - | |||||
SMDSWLF.031 2OZ | 18.0200 | 20 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.125 lb (56.7 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | |||||
4887-227G | 50.5400 | 4 | 0.00000000 | MG Chemicals | 4880 | Spool | Active | Wire Solder | 4887 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.050" (1.27mm) | 361°F (183°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | - | |||||
386839 | - | 9151 | 0.00000000 | Harimatec Inc. | 370 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||||||
395442 | - | 9666 | 0.00000000 | Harimatec Inc. | C400 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | - | |||||||
392249 | 59.4600 | 39 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | ||||||||
386876 | 60.2400 | 5 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.024" (0.61mm) | 361°F (183°C) | No-Clean | 22 AWG, 23 SWG | Leaded | ||||||||
796065 | 67.7900 | 5176 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423°F (217°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | - | |||||||
386862 | 60.2600 | 3 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||||||
386851 | 58.5200 | 1 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.022" (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | Leaded | - | |||||||
386818 | 58.9000 | 50 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | 70°F ~ 85°F (20°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | 82-132 | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | Water Soluble | 20 AWG, 21 SWG | Leaded | |||||||
MM01075 | - | 3342 | 0.00000000 | Harimatec Inc. | Hydro-X | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.024" (0.61mm) | 361°F (183°C) | Water Soluble | 22 AWG, 23 SWG | Leaded | - | |||||||
893358 | - | 8110 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Obsolete | Wire Solder | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 40 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 423°F (217°C) | Water Soluble | 23 AWG, 24 SWG | Lead Free | ||||||||
680290 | - | 1182 | 0.00000000 | Harimatec Inc. | - | Bulk | Obsolete | Bar Solder | 2 lbs (907.2 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 2.5 lbs (1.13kg) | - | 440 ~ 464°F (227 ~ 240°C) | - | - | Lead Free | |||||||
SMD2SW.020 1OZ | 7.6100 | 5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | Leaded | ||||||
SMD3SW.020 2OZ | 20.0800 | 2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||||
SMD3SW.031 4OZ | 30.9700 | 4 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||||
SMDSWLF.015 1OZ | 11.6300 | 5 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||||
SMD2SWLF.015 1OZ | 12.4100 | 8 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||||
SMD2SWLF.015 4OZ | 26.7800 | 3613 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||||
SMD2SWLF.020 4OZ | 26.2500 | 6 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||||
SMD2SWLF.031 2OZ | 16.3100 | 7 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | ||||||
SMD2180-25000 | 18.9900 | 5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.016" (0.40mm) | 361°F (183°C) | - | - | Leaded | |||||||
SMD2185 | 89.9500 | 5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.018" (0.46mm) | 361°F (183°C) | - | - | Leaded | |||||||
SMD2185-25000 | 17.9900 | 4951 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.018" (0.46mm) | 361°F (183°C) | - | - | Leaded | |||||||
SMD2140 | 104.9500 | 1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.008" (0.20mm) | 361°F (183°C) | - | - | Leaded | |||||||
SMD2024-25000 | 27.9900 | 10 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free |
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