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Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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SMDSWLF.015 2OZ | 18.4200 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||||
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SMD2032 | 122.9500 | ![]() |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
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24-6040-9721 | 60.5800 | ![]() |
137 | 0.00000000 | Kester Solder | 285 | Bulk | Active | Wire Solder | 24-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | |||||
RASW.015 100G | 15.5100 | ![]() |
17 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.015 | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.015100G | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 3.53 oz (100g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Leaded | |||||||
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EBSN96.5AG3 | 63.8800 | ![]() |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Bar Solder | EBSN96 | - | - | - | - | ROHS3 Compliant | 2757-EBSN96.5AG3 | EAR99 | 8311.90.0000 | 25 | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar, 1 lb (453.59g) | - | - | - | - | - | |||||||
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SMD291SNL250T3 | 54.9500 | ![]() |
4587 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
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NC191LTA50T5 | 27.9500 | ![]() |
1338 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA50T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 1.76 oz (50g) | - | 279°F (137°C) | No-Clean | - | - | 5 | ||||
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70-1003-0611 | 146.0940 | ![]() |
9181 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1003 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 4 | ||||
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SMD2SW.015 100G | 15.4900 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | SMD2SW.015100G | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 3.53 oz (100g) | 0.015" (0.38mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | Leaded | - | |||
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70-4105-0819 | - | ![]() |
3878 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4105 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
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19-6337-0062 | - | ![]() |
3678 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 19-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | - | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG, 16 SWG | Leaded | |||||
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WBWS633720-4OZ | 14.9900 | ![]() |
19 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBWS633720-4OZ | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | - | No-Clean, Water Soluble | - | Leaded | - | - | |||
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WB63/37-1/2LB | 18.9900 | ![]() |
2 | 0.00000000 | SRA Soldering Products | SUPER-PURE™ | Bag | Active | Bar Solder | WB63/37 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 2260-WB63/37-1/2LB | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Bar, 0.5 lb (266.79g) | - | - | - | - | Leaded | |||||
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24-7340-0006 | 151.7081 | ![]() |
5958 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Leaded | |||||
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14-0000-8053 | 54.9905 | ![]() |
8026 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-0000 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.093" (2.36mm) | 438 ~ 495°F (225 ~ 257°C) | - | 11 AWG, 13 SWG | Lead Free | |||||
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24-6337-9832 | - | ![]() |
4234 | 0.00000000 | Kester Solder | 296 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | |||||||
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SMD2150 | 103.9500 | ![]() |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | |||||
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70-4102-0611 | 164.4200 | ![]() |
12 | 0.00000000 | Kester Solder | NP545 | Bulk | Active | Solder Paste | 70-4102 | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 4 | |||
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92-9574-7650 | - | ![]() |
5403 | 0.00000000 | Kester Solder | 275 | Bulk | Active | Wire Solder | 92-9574 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 17.64 oz (500g) | 0.047" (1.19mm) | 441°F (227°C) | No-Clean | 17 AWG, 18 SWG | Lead Free | |||||
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SSLFWS-T5-15G | 26.9900 | ![]() |
3054 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSLFWS | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSLFWS-T5-15G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | - | No-Clean, Water Soluble | - | - | 5 | ||||
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RC60L2062BE | 27.6000 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-RC60L2062BE | 1 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 363°F (184°C) | Rosin Mildly Activated (RMA) | 14 AWG, 16 SWG | Leaded | ||||||||
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SMDSW.020 .4OZ | 5.9900 | ![]() |
18 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | SMDSW.020.4OZ | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Tube, 0.4 oz (11.34g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||
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SMD2205-25000 | 16.3900 | ![]() |
36 | 0.00000000 | Chip Quik Inc. | SMD2 | Jar | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.025" (0.64mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
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SMDSWLT.040 20G | 34.4600 | ![]() |
16 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 0.7 oz (20g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
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24-7080-0027 | 78.5194 | ![]() |
3384 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | |||||
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16-6337-0062 | 225.1088 | ![]() |
1990 | 0.00000000 | Kester Solder | Solid Core Wire | Spool | Active | Wire Solder | 16-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 5 lbs (2.27kg) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG, 16 SWG | Leaded | ||||||
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15-7340-0062 | 278.7300 | ![]() |
7 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 15-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 1573400062 | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 4 lbs (1.81kg) | 0.062" (1.57mm) | 565 ~ 574°F (296 ~ 301°C) | - | 14 AWG, 16 SWG | Leaded | ||||
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NC191AX50T5 | 24.9500 | ![]() |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX50T5 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
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24-6337-8811 | - | ![]() |
4581 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.030" (0.76mm) | 361°F (183°C) | No-Clean | 21 AWG, 22 SWG | Leaded | |||||||
RASW.020 8OZ | 29.0600 | ![]() |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | - | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0208OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded |
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