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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
RASWLF.015 2OZ | 12.9000 |  |
1785 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0152OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | ||||||
 |
BARSN60PB40 | 28.7800 | |
4726 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN60 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Bar, 1 lb (454g) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | Leaded | |||||
 |
BARSN63PB37 | 29.7500 | |
10 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN63 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | - | 361°F (183°C) | - | - | Leaded | |||||
 |
BARSN96.5AG3.0CU0.5 | 74.1700 | |
1 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN96.5 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar, 1 lb (454g) | - | 422 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
BARSN99.3CU0.7 | 44.9700 | |
17 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN99.3 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | - | 441°F (227°C) | - | - | Lead Free | |||||
 |
BARSN96.5AG3.0CU0.5-8OZ | 39.0900 | |
3 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN96.5 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar, 0.5 lb (227g) | - | 422 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
BARSN62PB36AG2-8OZ | 29.5700 | |
1457 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN62 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Bar, 0.5 lb (227g) | - | 354°F (179°C) | - | - | Leaded | |||||
 |
BARSN42BI57AG1-8OZ | 29.0000 | |
3 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN42 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Bar, 0.5 lb (227g) | - | 280°F (138°C) | - | - | Lead Free | |||||
 |
SMDSWLT.040 20G | 34.4600 | |
16 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 0.7 oz (20g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | |||||
 |
SMDSWLT.040 50G | 73.8500 | |
8 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 1.8 oz (50g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | |||||
 |
SMDAG100-S-1 | 44.1000 | |
2 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDAG | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Ag100(100) | Bag, 1 oz (28g) | - | 1762°F (961°C) | - | - | Lead Free | |||||
 |
SMDSN100-S-1 | 8.5000 | |
1 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDSN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn100(100) | Bag, 1 oz (28g) | - | 450°F (232°C) | - | - | Lead Free | |||||
 |
SMDCU100-S-1 | 8.0000 | |
4 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Shot | SMDC | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Cu100(100) | Bag, 1 oz (28g) | - | 1983°F (1084°C) | - | - | Lead Free | |||||
 |
NC2SW.020 1LB | 40.0500 | |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC2SW.0201LB | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||
 |
NC4SW.020 1LB | 36.7500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC4SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC4SW.0201LB | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||
 |
NC2SWLF.031 1LB | 55.7500 | |
6806 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||
 |
SMDIN100-R | 67.0000 | |
2126 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Ribbon Solder | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | In100 (100) | Spool | - | 315°F (157°C) | - | - | Lead Free | |||||
 |
SMDIN52SN48-R | 44.0000 | |
17 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Ribbon Solder | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | In52Sn48 (52/48) | Spool | - | 244°F (118°C) | - | - | Lead Free | |||||
 |
GA100-50G | 73.3000 | |
2 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-GA100-50G | EAR99 | 8112.99.9100 | 1 | Ga100 | Syringe, 1.8 oz (51.029g) | - | 85.57°F (29.76°C) | - | - | - | - | ||
 |
SMD2SW.031 2OZ | 10.0800 | |
3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | Leaded | |||
 |
SMD3SW.020 1OZ | 14.6700 | |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | |||
 |
SMD3SW.031 1OZ | 14.3500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | |||
 |
SMDSWLF.015 2OZ | 18.4200 | |
4 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||
 |
SMDSWLF.015 4OZ | 31.9900 | |
3 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||
 |
SMD2140-25000 | 21.9900 | |
3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.008" (0.20mm) | 361°F (183°C) | - | - | Leaded | ||||
 |
SMD2150 | 103.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | ||||
 |
SMD2150-25000 | 20.9900 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | ||||
 |
SMD2170-25000 | 19.9500 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.014" (0.36mm) | 361°F (183°C) | - | - | Leaded | ||||
 |
SMD2195 | 83.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.022" (0.56mm) | 361°F (183°C) | - | - | Leaded | ||||
 |
SMD2020-25000 | 28.9900 | |
7617 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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