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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
2041005 | 150.0800 |  |
7016 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 3W | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | |||||
 |
RASW.020 4OZ | 10.8700 | |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0204OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||
 |
2064239 | - | |
4736 | 0.00000000 | LOCTITE | LOCTITE® GC 10 | Bulk | Active | Solder Paste | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 29.98 oz (850g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | ||||||
 |
SSLFNC-50G | 20.9900 | |
6 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSLFNC | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||
|
605500 | - | |
7727 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 40 | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | Spool, 5.51 lbs (2.5kg) | 0.022" (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | |||||||
 |
24-6337-0060 | - | |
6924 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | |||||
 |
SMD2SWLF.031 8OZ | 37.6400 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||
 |
SMD4300AX500T5C | 180.7500 | |
1534 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Cartridge | Active | Solder Paste | SMD4300 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | 5 | ||||
 |
S200 | 51.3400 | |
40 | 0.00000000 | Chemtronics | SMD2 | Tube | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 24 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube | 0.040" (1.02mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | - | ||||
 |
395465 | 59.4800 | |
7 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | - | |||||
 |
24-6337-8802 | 55.7300 | |
305 | 0.00000000 | Kester Solder | 245 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||
 |
CWSnCu0.7Ni RA3% .062 1# | 89.9900 | |
100 | 0.00000000 | Amerway Inc | - | Tape & Box (TB) | Active | - | ROHS3 Compliant | REACH Affected | 2757-CWSnCu0.7NiRA3%.0621#TB | 1 | ||||||||||||||||||||
|
2164169 | - | |
2720 | 0.00000000 | LOCTITE | LM100 | Bulk | Active | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS non-compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Bi58Sn42 (58/42) | Jar | - | 281°F (138°C) | No-Clean | - | Lead Free | - | - | |||||
 |
RC96L2062PSAC | 49.1600 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC96L2062PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | ||||||||
|
386874 | - | |
7049 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | No-Clean | 27 AWG, 28 SWG | - | ||||||||||
|
386863 | - | |
5762 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Obsolete | Wire Solder | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 1 lb (454 g) | 0.022" (0.56mm) | No-Clean | 23 AWG, 24 SWG | - | ||||||||||
 |
24-7050-0027 | 102.1757 | |
5131 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-7050 | - | - | - | - | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn96.3Ag3.7 (96.3/3.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 430 ~ 444°F (221 ~ 223°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
 |
SR37-LFM48S-3.5-0.5MM | 49.5500 | |
5 | 0.00000000 | Almit | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | - | - | ROHS3 Compliant | 1 (Unlimited) | 2345-SR37-LFM48S-3.5-0.5MM | EAR99 | 8311.30.6000 | 1 | - | Spool, 3.53 oz (100g) | 0.020" (0.51mm) | - | - | - | Lead Free | |||||||
 |
SMDSWLF.020 1LB | 95.6700 | |
3 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | ||||
|
403674 | - | |
4386 | 0.00000000 | Harimatec Inc. | 381™ | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 40 | Sn63Pb37 (63/37) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | Leaded | - | ||||||
 |
JET551AX10T5 | 45.9500 | |
3784 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Affected | 315-JET551AX10T5 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | - | ||||||
 |
CQ-SS-SNBIAG-0.25MM-25000 | 57.9500 | |
5 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.25MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.010" (0.25mm) | 280°F (138°C) | - | - | - | |||||
 |
732998 | 94.7500 | |
13 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 423°F (217°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | - | |||||
 |
24-6337-6403 | 55.5600 | |
228 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-6337 | 1 lb (453.59 g) | 36 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||
|
24-6040-0039 | 59.3600 | |
57 | 0.00000000 | Kester Solder | 44 | Spool | Active | Wire Solder | 24-6040 | 1 lb (453.59 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.040" (1.02mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | ||||
|
24-7340-0060 | 74.2067 | |
5202 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | |||||
 |
24-4060-8290 | - | |
1044 | 0.00000000 | Kester Solder | 88 | Bulk | Active | Wire Solder | 24-4060 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Pb60Sn40 (60/40) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361 ~ 460°F (183 ~ 238°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||
 |
EXB-SN63PB37-0.5LB | 12.6000 | |
158 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN63 | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-EXB-SN63PB37-0.5LB | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Bar, 0.5 lb (227g) | - | 361°F (183°C) | - | - | Leaded | |||||
 |
SMDSWLF.020 4OZ | 31.5700 | |
40 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.25 lb (113.4 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | |||
 |
CWSN60NCCW2 .032 1# | 47.2100 | |
100 | 0.00000000 | Amerway Inc | - | Box | Active | Wire Solder | CWSN60 | - | - | - | - | RoHS non-compliant | 2757-CWSN60NCCW2.0321# | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.032" (0.81mm) | - | - | - | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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