Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
70-1003-0618 | - | ![]() |
7414 | 0.00000000 | Kester Solder | HydroMark 531 | Bulk | Active | Solder Paste | 70-1003 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 49.38 oz (1.4kg) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
![]() |
70-2002-0310 | - | ![]() |
8558 | 0.00000000 | Kester Solder | R560 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn62Pb36Ag2 (62/36/2) | Jar, 17.64 oz (500g) | - | 354°F (179°C) | Water Soluble | - | Leaded | - | |||||
![]() |
70-2002-0611 | - | ![]() |
2668 | 0.00000000 | Kester Solder | R560 | Bulk | Active | Solder Paste | 70-2002 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 4 | ||||
![]() |
70-2103-0511 | 137.1980 | ![]() |
7080 | 0.00000000 | Kester Solder | R562 | Bulk | Active | Solder Paste | 70-2103 | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 3 | ||||
![]() |
70-3205-0819 | - | ![]() |
5209 | 0.00000000 | Kester Solder | NXG1 | Bulk | Active | Solder Paste | 70-3205 | 8 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | Lead Free | 3 | ||||
![]() |
70-3205-1810 | - | ![]() |
5703 | 0.00000000 | Kester Solder | NXG1 | Bulk | Obsolete | Solder Paste | 70-3205 | 8 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Jar, 17.64 oz (500g) | - | 441°F (227°C) | No-Clean | - | Lead Free | - | ||||
![]() |
96-6337-8846 | - | ![]() |
9574 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 96-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.040" (1.02mm) | 361°F (183°C) | No-Clean | 18 AWG, 19 SWG | Leaded | |||||
![]() |
1728117 | - | ![]() |
6709 | 0.00000000 | Harimatec Inc. | LF318 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 18 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.88 oz (25g) | - | 423°F (217°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||||
![]() |
SMDSW.020 1LB | 41.5100 | ![]() |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
![]() |
SMDSWLF.031 1LB | 94.8500 | ![]() |
9 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||
![]() |
SMDLTLFP15T4 | 19.9500 | ![]() |
7 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 0.53 oz (15g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
![]() |
SMD291AX500T5C | 180.7500 | ![]() |
2425 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
![]() |
SMD291SNL500T4C | 127.5000 | ![]() |
8847 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
![]() |
SMD291AX | 14.9900 | ![]() |
40 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.033 lb (14.97 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Affected | SMD 291AX | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | |
![]() |
CQ-SS-SNBIAG-0.76MM-25000 | 97.9500 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.76MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.030" (0.76mm) | 280°F (138°C) | - | - | - | |||||
![]() |
CQ-SS-SNBIAG-0.50MM-25000 | 62.9500 | ![]() |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.50MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.020" (0.51mm) | 280°F (138°C) | - | - | - | |||||
![]() |
WC6301062 | 41.5300 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301062 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
![]() |
WC6001062P | 40.0200 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6001062P | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 363°F (184°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
![]() |
WC63L2031 | 31.3500 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC63L2031 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 361°F (183°C) | Water Soluble | 20 AWG, 22 SWG | Leaded | ||||||||
![]() |
RCBLF22701020P | 68.3800 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RCBLF22701020P | 1 | BLF 227 (99.17Sn/.8Cu/.03Ni) | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 440°F (227°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | ||||||||
![]() |
WC96L2031E | 50.9000 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 20 AWG, 22 SWG | Lead Free | |||||||||
![]() |
JPAGSC1501P | 162.8000 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Tube | Active | Brazing Rod | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-JPAGSC1501P | 1 | 15% Ag, 80% Cu, 5% Phos | Tube, 1 lb (454g) | - | 1190/1475°F (643/802°C) | - | - | Lead Free | ||||||||
![]() |
SMDSWLF.059 3.3 1LB | 107.1900 | ![]() |
24 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.0593.31LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.059" (1.50mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||
![]() |
WBWSSAC31-1LB | 84.9900 | ![]() |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | - | Water Soluble | - | Lead Free | - | |||||||
![]() |
WBRASAC31-1LB | 84.9900 | ![]() |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | - | Spool, 1 lb (453.59g) | 0.031" (0.79mm) | 423°F (217°C) | Rosin Activated (RA) | - | Lead Free | - | - | ||||
![]() |
T0051386299 | 118.0000 | ![]() |
1 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051386299 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 17.64 oz (500g) | 0.039" (0.99mm) | - | No-Clean | - | Lead Free | |||||
![]() |
T0051402499 | 29.5000 | ![]() |
3 | 0.00000000 | Apex Tool Group | Weller® | Spool | Active | Wire Solder | - | - | - | - | - | download | 1 (Unlimited) | REACH Unaffected | 72-T0051402499 | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | Spool, 0.7 oz (20g) | - | - | No-Clean | - | Lead Free | |||||
![]() |
SMDSWLT.040 50G | 73.8500 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 1.8 oz (50g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | Lead Free | ||||||
![]() |
893357 | - | ![]() |
7051 | 0.00000000 | Harimatec Inc. | Hydro-X | Bulk | Obsolete | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 40 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 423°F (217°C) | Water Soluble | 27 AWG, 28 SWG | Lead Free | - | ||||||
![]() |
CC6301031E | 43.8900 | ![]() |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-CC6301031E | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse