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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
1728117 | - |  |
6709 | 0.00000000 | Harimatec Inc. | LF318 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 18 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.88 oz (25g) | - | 423°F (217°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||||
|
1747469 | - | |
4443 | 0.00000000 | Harimatec Inc. | HF250DP | Bulk | Obsolete | Solder Paste | - | - | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | Cartridge, 0.88 oz (25g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | |||||
|
1846154 | - | |
5847 | 0.00000000 | Harimatec Inc. | HF212 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | - | - | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | - | |||||
 |
SMDSW.020 1LB | 41.5100 | |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
 |
SMD2SW.031 1LB | 38.7700 | |
5 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||
 |
SMD3SW.020 1LB | 77.2300 | |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
 |
SMDSWLF.031 1LB | 94.8500 | |
9 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||
 |
SMD2SWLF.020 1LB | 64.0300 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | ||||
 |
SMD2SWLF.031 1LB | 62.7400 | |
19 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||
 |
SMDLTLFP15T4 | 19.9500 | |
7 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste, Two Part Mix | SMDLTL | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 0.53 oz (15g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
 |
2041005 | 150.0800 | |
7016 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 3W | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | |||||
 |
2023641 | 162.7800 | |
7607 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 10 | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 41°F ~ 77°F (5°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | - | 423°F (217°C) | No-Clean | - | Lead Free | - | |||||
 |
SMD291AX500T3C | 75.9500 | |
6002 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | |||
 |
SMD291SNL500T3C | 108.7500 | |
4487 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||
 |
SMD291AX500T5C | 180.7500 | |
2425 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | ||||
 |
SMD291SNL500T4C | 127.5000 | |
8847 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||
 |
SMD2215 | 78.9500 | |
3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Jar | 0.030" (0.76mm) | 361°F (183°C) | - | - | Leaded | - | ||||||
 |
SMD291AX | 14.9900 | |
40 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 0.033 lb (14.97 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Affected | SMD 291AX | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | |
 |
733002 | 100.1500 | |
8525 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 423°F (217°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | - | |||||
 |
733001 | 59.8500 | |
1 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | 0.55 lb (249.48 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 423°F (217°C) | No-Clean | 23 AWG, 24 SWG | Lead Free | - | |||||
 |
450314 | 63.6500 | |
18 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.022" (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | Leaded | - | |||||
 |
673832 | 94.6000 | |
11 | 0.00000000 | Harimatec Inc. | C400 | Bulk | Active | Wire Solder | 0.55 lb (249.48 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 423°F (217°C) | No-Clean | 14 AWG, 16 SWG | Lead Free | - | |||||
 |
395451 | 55.0500 | |
39 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | Leaded | - | |||||
 |
395465 | 59.4800 | |
7 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Active | Wire Solder | 1 lb (453.59 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.064" (1.63mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | Leaded | - | |||||
 |
397952 | 24.5700 | |
4994 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Active | Wire Solder | 0.551 lb (249.93 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 23 AWG, 24 SWG | Leaded | - | |||||
 |
395439 | 57.0600 | |
95 | 0.00000000 | Harimatec Inc. | 366 | Bulk | Active | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 17.64 oz (500g) | 0.050" (1.27mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | Leaded | - | |||||
 |
SMDSN60BI40 | 19.9500 | |
2919 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-SMDSN60BI40 | EAR99 | 8311.30.6000 | 1 | Sn60Bi40 (60/40) | Spool | 0.031" (0.79mm) | 280°F ~ 338°F (138°C ~ 170°C) | - | - | Lead Free | ||||
|
26-4060-2437 | 24.6915 | |
7325 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-26-4060-2437 | 1 | ||||||||||||||||||||||
|
4795740050 | 35.2798 | |
2221 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 117-4795740050 | 1 | - | Bar, 5 lbs (2.27kg) | - | 441°F (227°C) | - | - | Lead Free | |||||||||
|
70-5023-2210 | 0.5900 | |
7763 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | 117-70-5023-2210 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | - | Water Soluble | - | Lead Free |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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