Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
28-3503-31 Aries Electronics 28-3503-31 19.7981
RFQ
ECAD 1201 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 28-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
APA-324-G-B Samtec Inc. APA-324-G-B 22.0100
RFQ
ECAD 9174 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-324 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
111-43-322-41-001000 Mill-Max Manufacturing Corp. 111-43-322-41-001000 13.8632
RFQ
ECAD 8511 0.00000000 Mill-Max Manufacturing Corp. 111 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 111-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
24-6554-11 Aries Electronics 24-6554-11 19.4300
RFQ
ECAD 132 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
07-0513-10 Aries Electronics 07-0513-10 1.3600
RFQ
ECAD 3 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 07-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
AR 40-HZL/07-TT Assmann WSW Components AR 40-HZL/07-TT 1.8014
RFQ
ECAD 4686 0.00000000 Assmann WSW Components - Tube Active -40°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame AR 40-HZ Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
AR 18-HZL/07-TT Assmann WSW Components AR 18-HZL/07-TT 0.8928
RFQ
ECAD 1200 0.00000000 Assmann WSW Components - Tube Active -40°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame AR18-HZ Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 26 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
29-0508-21 Aries Electronics 29-0508-21 18.6527
RFQ
ECAD 4129 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 29-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 29 (1 x 29) Beryllium Copper - Brass 0.360" (9.14mm) -
116-93-628-61-003000 Mill-Max Manufacturing Corp. 116-93-628-61-003000 23.8779
RFQ
ECAD 8049 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
21-0508-30 Aries Electronics 21-0508-30 8.3476
RFQ
ECAD 8788 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 21-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 21 (1 x 21) Beryllium Copper - Brass 0.500" (12.70mm) -
08-7515-10 Aries Electronics 08-7515-10 6.4479
RFQ
ECAD 6731 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7515 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
08-7430-10 Aries Electronics 08-7430-10 6.4479
RFQ
ECAD 4007 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7430 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
26-6820-90C Aries Electronics 26-6820-90C 12.6692
RFQ
ECAD 7529 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 26-6820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
111-43-304-41-001000 Mill-Max Manufacturing Corp. 111-43-304-41-001000 6.9097
RFQ
ECAD 3345 0.00000000 Mill-Max Manufacturing Corp. 111 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 111-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 102 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
14-8940-310C Aries Electronics 14-8940-310C 9.4798
RFQ
ECAD 3583 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8940 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
21-0513-11H Aries Electronics 21-0513-11H 5.6419
RFQ
ECAD 8640 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 21-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 21 (1 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
145-PGM15023-10 Aries Electronics 145-PGM15023-10 18.2274
RFQ
ECAD 1719 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 145-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
XR2A-2411-N Omron Electronics Inc-EMC Div XR2A-2411-N 4.5000
RFQ
ECAD 118 0.00000000 Omron Electronics Inc-EMC Div XR2 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame XR2A Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 20 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.126" (3.20mm) 20mOhm
LP300 Aries Electronics LP300 2.6000
RFQ
ECAD 100 0.00000000 Aries Electronics LP300 Bulk Active -55°C ~ 125°C - LP300 Shorting Plug Black 0.3" DIP Sockets download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 UL94 V-0 Polyamide (PA46), Nylon 4/6 -
37-0508-20 Aries Electronics 37-0508-20 13.2064
RFQ
ECAD 2296 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 37-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 37 (1 x 37) Beryllium Copper - Brass 0.360" (9.14mm) -
84-537-20 Aries Electronics 84-537-20 16.0152
RFQ
ECAD 3432 0.00000000 Aries Electronics 537 Bulk Active -65°C ~ 260°C - 84-537 Insert Plate Black PLCC Sockets download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8538.90.8180 1 UL94 V-0 Polyphenylene Sulfide (PPS), Glass Filled - 84
510-13-073-11-061002 Mill-Max Manufacturing Corp. 510-13-073-11-061002 30.6606
RFQ
ECAD 7789 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 73 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
110-93-628-61-605000 Mill-Max Manufacturing Corp. 110-93-628-61-605000 22.2098
RFQ
ECAD 4711 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
APA-314-T-K Samtec Inc. APA-314-T-K -
RFQ
ECAD 1239 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-314 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-624-G-P Samtec Inc. APA-624-G-P 17.2650
RFQ
ECAD 2554 0.00000000 Samtec Inc. APA Tube Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 18 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-624-G-J Samtec Inc. APA-624-G-J -
RFQ
ECAD 8898 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
1051632005 Molex 1051632005 -
RFQ
ECAD 6912 0.00000000 Molex 105163 Tape & Reel (TR) Obsolete - - 105163 Cover Silver Camera Socket download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 105163-2005 EAR99 8536.69.4040 4,000 - Stainless Steel -
42-6556-41 Aries Electronics 42-6556-41 63.1686
RFQ
ECAD 8942 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 42-6556 Solder Cup download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.180" (4.57mm) -
13-0501-21 Aries Electronics 13-0501-21 10.7807
RFQ
ECAD 2591 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 13-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 13 (1 x 13) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
546-83-223-18-091135 Preci-Dip 546-83-223-18-091135 25.5619
RFQ
ECAD 5181 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-83 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin - 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse