Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
612-43-310-41-001000 Mill-Max Manufacturing Corp. 612-43-310-41-001000 12.3685
RFQ
ECAD 6089 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 612-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
515-93-238-19-086001 Mill-Max Manufacturing Corp. 515-93-238-19-086001 -
RFQ
ECAD 2290 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 238 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
614-93-068-10-041001 Mill-Max Manufacturing Corp. 614-93-068-10-041001 -
RFQ
ECAD 7991 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 68 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
515-13-120-13-061001 Mill-Max Manufacturing Corp. 515-13-120-13-061001 -
RFQ
ECAD 9383 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 120 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
10-0511-10 Aries Electronics 10-0511-10 4.9510
RFQ
ECAD 2313 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 10-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
1051420432 Molex 1051420432 -
RFQ
ECAD 7480 0.00000000 Molex 105142 Bulk Obsolete - Surface Mount LGA Open Frame 105142 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 105142-0432 EAR99 8536.69.4040 200 Thermoplastic UL94 V-0 0.040" (1.02mm) Gold 15.0µin (0.38µm) - - 2011 (47 x 58) Copper Alloy 0.040" (1.01mm) Copper Alloy - -
APA-624-T-K Samtec Inc. APA-624-T-K -
RFQ
ECAD 3683 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
5-6437504-5 TE Connectivity AMP Connectors 5-6437504-5 -
RFQ
ECAD 5931 0.00000000 TE Connectivity AMP Connectors - Bulk Obsolete -55°C ~ 125°C Chassis Mount Transistor, TO-3 Closed Frame 6437504 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Phenolic - - Gold - Gold - 3 (Oval) Beryllium Copper - Beryllium Copper - -
D83032B-46R Harwin Inc. D83032B-46R -
RFQ
ECAD 7635 0.00000000 Harwin Inc. D830 Tube Obsolete -50°C ~ 105°C Surface Mount PLCC Board Guide, Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin - Tin - 32 (4 x 8) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 30mOhm
515-91-073-11-061003 Mill-Max Manufacturing Corp. 515-91-073-11-061003 -
RFQ
ECAD 7415 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 73 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
APA-422-G-Q Samtec Inc. APA-422-G-Q -
RFQ
ECAD 6710 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-422 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-318-G-C Samtec Inc. APA-318-G-C 13.0700
RFQ
ECAD 7203 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-318 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
16-3518-101 Aries Electronics 16-3518-101 3.7572
RFQ
ECAD 6908 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-6823-90 Aries Electronics 14-6823-90 9.4355
RFQ
ECAD 3170 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 14-6823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
515-93-144-13-041003 Mill-Max Manufacturing Corp. 515-93-144-13-041003 -
RFQ
ECAD 9383 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 144 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
522-93-100-10-000003 Mill-Max Manufacturing Corp. 522-93-100-10-000003 -
RFQ
ECAD 6254 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
133-PGM13046-10 Aries Electronics 133-PGM13046-10 17.4908
RFQ
ECAD 1032 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 133-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
614-93-133-14-071007 Mill-Max Manufacturing Corp. 614-93-133-14-071007 -
RFQ
ECAD 2864 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 133 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
04-0513-10 Aries Electronics 04-0513-10 0.5479
RFQ
ECAD 9389 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 04-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
132-PGM13038-10 Aries Electronics 132-PGM13038-10 16.9313
RFQ
ECAD 3819 0.00000000 Aries Electronics PGM - Active - Through Hole PGA - 132-PGM Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q8889276 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
551-90-089-13-061003 Mill-Max Manufacturing Corp. 551-90-089-13-061003 -
RFQ
ECAD 4464 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 89 (13 x 13) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
APA-632-T-D Samtec Inc. APA-632-T-D -
RFQ
ECAD 9802 0.00000000 Samtec Inc. APA Bulk Obsolete - Through Hole - Open Frame APA-632 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
116-91-318-41-008000 Mill-Max Manufacturing Corp. 116-91-318-41-008000 14.9723
RFQ
ECAD 3431 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
114-87-632-41-117101 Preci-Dip 114-87-632-41-117101 1.7045
RFQ
ECAD 4833 0.00000000 Preci-Dip 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 114-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
A 08-LC-TR Assmann WSW Components A 08-LC-TR 0.2000
RFQ
ECAD 7 0.00000000 Assmann WSW Components - Tube Active -55°C ~ 85°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame A 08-LC Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 60 1 A Polybutylene Terephthalate (PBT) UL94 V-0 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.124" (3.15mm) 30mOhm
116-43-210-61-008000 Mill-Max Manufacturing Corp. 116-43-210-61-008000 20.5235
RFQ
ECAD 9107 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
14-3508-312 Aries Electronics 14-3508-312 14.2168
RFQ
ECAD 7399 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
110-83-428-41-005101 Preci-Dip 110-83-428-41-005101 1.7721
RFQ
ECAD 8342 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass - 10mOhm
122-13-624-41-001000 Mill-Max Manufacturing Corp. 122-13-624-41-001000 16.4469
RFQ
ECAD 1699 0.00000000 Mill-Max Manufacturing Corp. 122 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 122-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) -
522-13-085-11-041002 Mill-Max Manufacturing Corp. 522-13-085-11-041002 -
RFQ
ECAD 7454 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 85 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse