Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
1109906-48 Aries Electronics 1109906-48 -
RFQ
ECAD 9910 0.00000000 Aries Electronics - - Active - - - - 1109906 - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 - - - - - - - - - - - - -
24-516-11S Aries Electronics 24-516-11S 12.3442
RFQ
ECAD 7245 0.00000000 Aries Electronics 516 Bulk Active - Through Hole DIP, ZIF (ZIP) Closed Frame 24-516 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.150" (3.81mm) -
117-83-624-41-105101 Preci-Dip 117-83-624-41-105101 2.3253
RFQ
ECAD 1012 0.00000000 Preci-Dip 117 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.070" (1.78mm) Gold 29.5µin (0.75µm) Tin - 24 (2 x 12) Beryllium Copper 0.070" (1.78mm) Brass 0.125" (3.18mm) 10mOhm
121-83-328-41-001101 Preci-Dip 121-83-328-41-001101 3.0132
RFQ
ECAD 4557 0.00000000 Preci-Dip 121 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 121-83 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.260" (6.60mm) 10mOhm
940-99-044-24-000000 Mill-Max Manufacturing Corp. 940-99-044-24-000000 -
RFQ
ECAD 6306 0.00000000 Mill-Max Manufacturing Corp. 940 Tube Obsolete -55°C ~ 125°C Through Hole PLCC Closed Frame 940-99 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 26 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 200.0µin (5.08µm) 44 (4 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.130" (3.30mm) 30mOhm
116-87-210-41-018101 Preci-Dip 116-87-210-41-018101 0.8666
RFQ
ECAD 3368 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 800 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
511-93-114-13-061001 Mill-Max Manufacturing Corp. 511-93-114-13-061001 -
RFQ
ECAD 6912 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 114 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
14-81100-10WR Aries Electronics 14-81100-10WR 3.3936
RFQ
ECAD 3599 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8110 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) -
510-87-256-16-000101 Preci-Dip 510-87-256-16-000101 7.9551
RFQ
ECAD 4662 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 256 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
518-77-255M16-001105 Preci-Dip 518-77-255M16-001105 27.5213
RFQ
ECAD 7566 0.00000000 Preci-Dip 518 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 518-77 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold Flash Gold Flash 255 (16 x 16) Beryllium Copper 0.050" (1.27mm) Brass 0.110" (2.78mm) 10mOhm
514-87-456M26-001148 Preci-Dip 514-87-456M26-001148 42.7864
RFQ
ECAD 9930 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount BGA Open Frame 514-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 456 (26 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
551-90-101-13-061003 Mill-Max Manufacturing Corp. 551-90-101-13-061003 -
RFQ
ECAD 8486 0.00000000 Mill-Max Manufacturing Corp. 551 Tube Active - Through Hole PGA Open Frame 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 101 (13 x 13) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
612-83-636-41-001101 Preci-Dip 612-83-636-41-001101 3.4848
RFQ
ECAD 8924 0.00000000 Preci-Dip 612 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm
15-0503-31 Aries Electronics 15-0503-31 10.6172
RFQ
ECAD 6201 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 15-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
14-0503-30 Aries Electronics 14-0503-30 6.8891
RFQ
ECAD 7088 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 14-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
42-6554-16 Aries Electronics 42-6554-16 75.3414
RFQ
ECAD 5449 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 42-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-650000-10-P Aries Electronics 24-650000-10-P -
RFQ
ECAD 4087 0.00000000 Aries Electronics Correct-A-Chip® 650000 Bulk Discontinued at SIC - Through Hole - 24-650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 98 - - 0.050" (1.27mm) - - Tin-Lead - SOIC DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
522-93-175-16-006002 Mill-Max Manufacturing Corp. 522-93-175-16-006002 -
RFQ
ECAD 2346 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 175 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
146-83-304-41-036101 Preci-Dip 146-83-304-41-036101 0.4342
RFQ
ECAD 3699 0.00000000 Preci-Dip 146 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 146-83 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 105 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.110" (2.78mm) 10mOhm
116-87-318-41-008101 Preci-Dip 116-87-318-41-008101 1.6364
RFQ
ECAD 4960 0.00000000 Preci-Dip 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ICO-318-ZMGT Samtec Inc. ICO-318-ZMGT 5.7768
RFQ
ECAD 1064 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-318-ZMGT 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
37-0511-11 Aries Electronics 37-0511-11 24.5924
RFQ
ECAD 3021 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 37-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 37 (1 x 37) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
20-6511-10 Aries Electronics 20-6511-10 4.1208
RFQ
ECAD 7678 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 20-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
44-6572-11 Aries Electronics 44-6572-11 32.6262
RFQ
ECAD 8879 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
299-83-608-10-002101 Preci-Dip 299-83-608-10-002101 2.3208
RFQ
ECAD 3901 0.00000000 Preci-Dip 299 Bulk Active -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 299-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 52 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.128" (3.24mm) 10mOhm
514-87-478M26-131148 Preci-Dip 514-87-478M26-131148 45.1632
RFQ
ECAD 3853 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount BGA Open Frame 514-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 478 (26 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
614-87-044-08-031112 Preci-Dip 614-87-044-08-031112 4.9743
RFQ
ECAD 1604 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 26 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 44 (8 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
21-0503-20 Aries Electronics 21-0503-20 9.6900
RFQ
ECAD 3402 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 21-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 21 (1 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
04-1518-00 Aries Electronics 04-1518-00 0.5479
RFQ
ECAD 2453 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 04-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-3575-16 Aries Electronics 28-3575-16 37.3706
RFQ
ECAD 8646 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse