Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
36-3572-11 Aries Electronics 36-3572-11 27.5047
RFQ
ECAD 8171 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
44-6556-20 Aries Electronics 44-6556-20 16.2812
RFQ
ECAD 3263 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 44-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.283" (7.19mm) -
D2608-42 Harwin Inc. D2608-42 2.3900
RFQ
ECAD 2 0.00000000 Harwin Inc. D26 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame D2608 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 52 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 196.9µin (5.00µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.110" (2.78mm) 10mOhm
117-87-664-41-005101 Preci-Dip 117-87-664-41-005101 3.2022
RFQ
ECAD 1837 0.00000000 Preci-Dip 117 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.070" (1.78mm) Gold Flash Tin - 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) Brass 0.125" (3.18mm) 10mOhm
48-3571-10 Aries Electronics 48-3571-10 20.9433
RFQ
ECAD 2137 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
40-6575-16 Aries Electronics 40-6575-16 47.0314
RFQ
ECAD 6696 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
48-3570-11 Aries Electronics 48-3570-11 34.1150
RFQ
ECAD 2135 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
116-87-642-41-002101 Preci-Dip 116-87-642-41-002101 4.3452
RFQ
ECAD 2998 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
116-87-640-41-002101 Preci-Dip 116-87-640-41-002101 4.5978
RFQ
ECAD 4058 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
514-83-223-18-091117 Preci-Dip 514-83-223-18-091117 24.5353
RFQ
ECAD 3301 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount PGA Open Frame 514-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
28-7440-10 Aries Electronics 28-7440-10 14.9137
RFQ
ECAD 2656 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 28-7440 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 28 (1 x 28) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
40-0501-31 Aries Electronics 40-0501-31 19.6833
RFQ
ECAD 4501 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 40-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (1 x 40) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
514-87-500M30-001148 Preci-Dip 514-87-500M30-001148 47.5403
RFQ
ECAD 4161 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount BGA Open Frame 514-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 500 (30 x 30) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
28-6518-11H Aries Electronics 28-6518-11H 9.5263
RFQ
ECAD 9807 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 28-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
50-9518-11H Aries Electronics 50-9518-11H 15.7020
RFQ
ECAD 4463 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 50-9518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-0508-30 Aries Electronics 14-0508-30 5.6419
RFQ
ECAD 2772 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 14-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Beryllium Copper - Brass 0.500" (12.70mm) -
28-3571-11 Aries Electronics 28-3571-11 22.0725
RFQ
ECAD 1139 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
116-83-314-41-008101 Preci-Dip 116-83-314-41-008101 1.6540
RFQ
ECAD 6728 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ICO-320-NGT Samtec Inc. ICO-320-NGT 7.4736
RFQ
ECAD 8652 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-320-NGT 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
540-88-032-17-400-2 Preci-Dip 540-88-032-17-400-2 -
RFQ
ECAD 2648 0.00000000 Preci-Dip 540 Bulk Obsolete - Surface Mount PLCC Board Guide, Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 832 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin - Tin - 32 (4 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - 20mOhm
518-77-388M26-001106 Preci-Dip 518-77-388M26-001106 55.8582
RFQ
ECAD 7950 0.00000000 Preci-Dip 518 Bulk Active -55°C ~ 125°C Surface Mount PGA Open Frame 518-77 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold Flash Gold Flash 388 (26 x 26) Beryllium Copper 0.050" (1.27mm) Brass 0.062" (1.57mm) 10mOhm
614-83-314-31-012101 Preci-Dip 614-83-314-31-012101 1.2463
RFQ
ECAD 5453 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 29 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
20-0503-31 Aries Electronics 20-0503-31 13.5200
RFQ
ECAD 5213 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 20-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
18-3518-01 Aries Electronics 18-3518-01 8.8275
RFQ
ECAD 2717 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 18-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
D3908-42 Harwin Inc. D3908-42 -
RFQ
ECAD 9896 0.00000000 Harwin Inc. D39 Bulk Obsolete -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 50 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 196.9µin (5.00µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) 10mOhm
117-87-624-41-105101 Preci-Dip 117-87-624-41-105101 1.7148
RFQ
ECAD 8801 0.00000000 Preci-Dip 117 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.070" (1.78mm) Gold Flash Tin - 24 (2 x 12) Beryllium Copper 0.070" (1.78mm) Brass 0.125" (3.18mm) 10mOhm
511-13-154-13-021002 Mill-Max Manufacturing Corp. 511-13-154-13-021002 -
RFQ
ECAD 9341 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 154 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
116-87-306-41-012101 Preci-Dip 116-87-306-41-012101 0.4518
RFQ
ECAD 4580 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 71 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
518-77-357M19-001106 Preci-Dip 518-77-357M19-001106 50.2360
RFQ
ECAD 5515 0.00000000 Preci-Dip 518 Bulk Active -55°C ~ 125°C Surface Mount PGA Open Frame 518-77 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold Flash Gold Flash 357 (19 x 19) Beryllium Copper 0.050" (1.27mm) Brass 0.062" (1.57mm) 10mOhm
546-87-529-21-121147 Preci-Dip 546-87-529-21-121147 48.6579
RFQ
ECAD 6423 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold Flash Tin - 529 (21 x 21) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse