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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MPFS025TS-1FCVG484I | 111.3800 |  |
3759 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | - | REACH Unaffected | 150-MPFS025TS-1FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
 |
XCZU3CG-L1SFVC784I | 674.7000 | |
5691 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||
|
AGFA023R24C3E3V | 12.0000 | |
1074 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA023R24C3E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
M2S060TS-VFG400 | 169.1874 | |
8100 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 400-LFBGA | M2S060 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
XCZU5EV-2FBVB900E | 3.0000 | |
5979 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU5 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||
 |
10AS048K2F35I2SG | 5.0000 | |
4759 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 964983 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 396 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 480K Logic Elements | ||
 |
M2S090-1FGG676 | 306.4465 | |
2949 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
XCVP1502-2LLEVSVA2785 | 42.0000 | |
9117 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA | 2785-BGA (50x50) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-2LLEVSVA2785 | 1 | MPU, FPGA | 702 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
 |
XCVP1502-2LLEVSVA3340 | 44.0000 | |
9723 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 3340-BFBGA | 3340-BGA (55x55) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-2LLEVSVA3340 | 1 | MPU, FPGA | 486 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
 |
MPFS250T-1FCVG784T2 | - | |
3126 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-1FCVG784T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | ||||
 |
XCVC1902-2LLEVIVA1596 | 39.0000 | |
9285 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-2LLEVIVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | |||
 |
XCZU2EG-1SFVA625I | 440.7000 | |
9129 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | XCZU2 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 180 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||
|
TCI6638K2KDXAAW2T | - | |
8862 | 0.00000000 | Texas Instruments | KeyStone Multicore | Bulk | Active | 0°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6638K2KDXAAW2T | 1 | DSP, MPU | 32 | C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | 1.2GHz | Ethernet, I²C, SPI, UART/USART, USB | DDR, DMA, PCIe, POR, WDT | - | - | - | |||||
|
TCI6638K2KDXAAW24H | - | |
6760 | 0.00000000 | Texas Instruments | * | Bulk | Active | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6638K2KDXAAW24H | 1 | |||||||||||||||
 |
M2S050-FG896I | 189.6244 | |
2863 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
|
AGFD023R24C2E2VB | 23.0000 | |
3583 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFD023R24C2E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
M2S010TS-1FG484M | 165.0960 | |
5346 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -55°C ~ 125°C (TJ) | 484-BGA | M2S010 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 60 | MCU, FPGA | 233 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
|
MPFS160T-FCVG784E | 334.1600 | |
6601 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | REACH Unaffected | 150-MPFS160T-FCVG784E | 1 | MPU, FPGA | MCU - 136, FPGA - 312 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128kB | FPGA - 161K Logic Modules | ||||||
|
AGFA027R24C2I1VB | 37.0000 | |
9073 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA027R24C2I1VB | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||
 |
10AS066N2F40E1HG | 6.0000 | |
1282 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 967624 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 588 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
 |
PLCHIP-P13-51220X10 | 650.6000 | |
3 | 0.00000000 | Divelbiss Corporation | - | Tray | Active | -40°C ~ 85°C (TJ) | 208-LQFP | 208-LQFP (28x28) | download | ROHS3 Compliant | 2 (1 Year) | 2698-PLCHIP-P13-51220X10 | EAR99 | 8537.10.9160 | 1 | MCU | 164 | PLC | 12MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | LCD, PWM, WDT | 32KB | 256KB | - | |||
 |
1SX280HN3F43E2LG | 29.0000 | |
7918 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HN3F43E2LG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
|
R8J66744BG#R0 | 42.6600 | |
909 | 0.00000000 | Renesas Electronics America Inc | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | |||||||||||||||
 |
1SX250HU1F50E1VG | 42.0000 | |
2829 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HU1F50E1VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
AGIB027R31A1I1VB | 138.0000 | |
8698 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB027R31A1I1VB | 3 | |||||||||||||||||||
|
XCZU4EV-1SFVC784I | 1.0000 | |
3305 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU4 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
 |
1SX280LH2F55I2LG | 40.0000 | |
6244 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 1160 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | |||
|
M2S050T-VF400I | 161.1207 | |
1196 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
 |
A2F500M3G-1PQ208I | - | |
1180 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Obsolete | -40°C ~ 100°C (TJ) | 208-BFQFP | A2F500M3G | 208-PQFP (28x28) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 24 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
 |
5ASXFB5G4F35C4G | 6.0000 | |
1540 | 0.00000000 | Intel | Arria V SX | Tray | Active | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXFB5G4F35C4G | 24 | MCU, FPGA | MCU - 208, FPGA - 385 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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