- RFQ
- BOM
-
Contact Us
Tel: +86-0755-83501315
Email: sales@sic-components.com
- Chinese
- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur
System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
PLCHIP-P13-51220X10 | 650.6000 |  |
3 | 0.00000000 | Divelbiss Corporation | - | Tray | Active | -40°C ~ 85°C (TJ) | 208-LQFP | 208-LQFP (28x28) | download | ROHS3 Compliant | 2 (1 Year) | 2698-PLCHIP-P13-51220X10 | EAR99 | 8537.10.9160 | 1 | MCU | 164 | PLC | 12MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | LCD, PWM, WDT | 32KB | 256KB | - | |||
 |
HD64412FIV | 25.5900 | |
1 | 0.00000000 | Renesas Electronics America Inc | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 1 | |||||||||||||||
|
BCM33843MVKFSBGB0T | - | |
8246 | 0.00000000 | Broadcom Limited | - | Tray | Obsolete | - | ROHS3 Compliant | 516-BCM33843MVKFSBGB0T | OBSOLETE | 20,000 | |||||||||||||||||
|
BCM3383GUKFEBG | - | |
7641 | 0.00000000 | Broadcom Limited | - | Tray | Active | BCM3383 | - | ROHS3 Compliant | 1 (Unlimited) | 516-BCM3383GUKFEBG | 60 | ||||||||||||||||
|
AGFA012R24C3I3V | 26.0000 | |
5089 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA012R24C3I3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
MPFS095TL-FCSG325I | 307.5300 | |
7570 | 0.00000000 | Microchip Technology | - | Bulk | Active | -40°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095TL-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||||
|
MPFS095T-1FCSG325E | 260.2100 | |
1288 | 0.00000000 | Microchip Technology | - | Bulk | Active | 0°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095T-1FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||||
|
MPFS095T-FCSG325E | 236.5600 | |
6399 | 0.00000000 | Microchip Technology | - | Bulk | Active | 0°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095T-FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||||
|
MPFS025T-1FCSG325E | 91.9000 | |
9804 | 0.00000000 | Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-1FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
MPFS025TL-FCVG484E | 95.4800 | |
5068 | 0.00000000 | Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | - | REACH Unaffected | 150-MPFS025TL-FCVG484E | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
MPFS025TL-FCSG325E | 100.2300 | |
4796 | 0.00000000 | Microchip Technology | - | Tray | Active | 0°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025TL-FCSG325E | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
MPFS025T-FCSG325I | 91.9000 | |
7193 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
MPFS025TS-1FCSG325I | 116.9500 | |
5842 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025TS-1FCSG325I | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
MPFS025TS-1FCVG484I | 111.3800 | |
3759 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 484-BFBGA | 484-FBGA (19x19) | - | REACH Unaffected | 150-MPFS025TS-1FCVG484I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
XCVC1702-1MLIVSVA1596 | 27.0000 | |
2152 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 110°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (37.5x37.5) | - | 4 (72 Hours) | 122-XCVC1702-1MLIVSVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||
|
SAF3604EL/V3040BK | - | |
6241 | 0.00000000 | NXP USA Inc. | Automotive, AEC-Q100 | Bulk | Obsolete | -40°C ~ 85°C (TA) | 223-LFBGA | 223-LFBGA (12x12) | - | 568-SAF3604EL/V3040BK | 1 | DSP | 16 | SAF360x | 55.5MHz | GPIO, I²C, I²S, SPI, UART/USART | DMA | - | - | - | |||||||
 |
XCVP1502-2LLEVSVA2785 | 42.0000 | |
9117 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA | 2785-BGA (50x50) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-2LLEVSVA2785 | 1 | MPU, FPGA | 702 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
 |
XCVP1502-1LSEVSVA3340 | 29.0000 | |
7373 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 3340-BFBGA | 3340-BGA (55x55) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-1LSEVSVA3340 | 1 | MPU, FPGA | 486 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
 |
XCVC1902-2LLIVSVD1760 | 50.0000 | |
1693 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-2LLIVSVD1760 | 1 | MPU, FPGA | 726 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | |||||
|
XCVP1502-2LLEVSVA3340 | 44.0000 | |
9723 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 3340-BFBGA | 3340-BGA (55x55) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-2LLEVSVA3340 | 1 | MPU, FPGA | 486 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
 |
XCVC1802-2LLIVIVA1596 | 43.0000 | |
4421 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2LLIVIVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||||
 |
XCVM1502-1LSEVFVC1760 | 7.0000 | |
7473 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1502-1LSEVFVC1760 | 1 | MPU, FPGA | 378 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | |||||
|
AGFA012R24B1E1V | 34.0000 | |
5065 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA012R24B1E1V | 1 | MPU, FPGA | 768 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
AGFB008R16A3E3V | 14.0000 | |
4172 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB008R16A3E3V | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | ||||||
|
AGFB022R31C2E2VAA | 65.0000 | |
2885 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB022R31C2E2VAA | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
AGFB012R24B1E1V | 34.0000 | |
6051 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB012R24B1E1V | 1 | MPU, FPGA | 768 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
AGFA014R24B3I3E | 26.0000 | |
4639 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA014R24B3I3E | 1 | MPU, FPGA | 768 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
|
AGFD019R25A1E1V | 55.0000 | |
7157 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD019R25A1E1V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFB023R25A2E4X | 56.0000 | |
3538 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB023R25A2E4X | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
 |
1SX040HH2F35I1VG | 5.0000 | |
2225 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | download | 3 (168 Hours) | 544-1SX040HH2F35I1VG | 1 | MCU, FPGA | 374 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 400K Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)