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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
XC7Z035-1FBG676I | 1.0000 |  |
1677 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 676-BBGA, FCBGA | XC7Z035 | 676-FCBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 275K Logic Cells | ||
 |
XCVP1502-1LSEVSVA3340 | 29.0000 | |
7373 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 3340-BFBGA | 3340-BGA (55x55) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-1LSEVSVA3340 | 1 | MPU, FPGA | 486 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
 |
A2F060M3E-1FGG256 | - | |
3114 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 256-LBGA | A2F060M3E | 256-FPBGA (17x17) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 26, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
 |
TDA4VE88TGAALZRQ1 | 100.2200 | |
3179 | 0.00000000 | Texas Instruments | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | 770-BFBGA, FCBGA | 770-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A992C | 8542.31.0001 | 250 | DSP, MCU, MPU | 155 | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | 2GHz, 1GHz, 1GHz | MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB | DMA, PWM, WDT | 2MB | - | - | |||
 |
M2S010TS-1VFG400 | 62.9852 | |
4337 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
|
XCVC1702-1MSINSVG1369 | 20.0000 | |
9141 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 110°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVC1702-1MSINSVG1369 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||
|
XCVM1502-2MLIVSVA2197 | 13.0000 | |
4597 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | - | 4 (72 Hours) | 122-XCVM1502-2MLIVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||||
|
M2S005S-VF400I | 28.4716 | |
3076 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S005 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 169 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR | 64KB | 128KB | FPGA - 5K Logic Modules | ||
|
BCM33843DIFSBG | - | |
9064 | 0.00000000 | Broadcom Limited | - | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 5,000 | |||||||||||||||||
 |
XCZU2EG-1SBVA484E | 335.4000 | |
5141 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | XCZU2 | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||
 |
A2F060M3E-1TQG144 | - | |
4924 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 144-LQFP | A2F060M3E | 144-TQFP (20x20) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 21, FPGA - 33 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
 |
5ASXFB5H4F40C6NES | - | |
2807 | 0.00000000 | Intel | Arria V SX | Tray | Obsolete | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 5ASXFB5 | 1517-FBGA, FC (40x40) | download | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 1 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 700MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | |||
 |
XCZU7EV-2FFVF1517E | 4.0000 | |
6970 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | XCZU7 | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 464 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
 |
M2S150T-FCV484 | 409.2344 | |
6918 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BFBGA | M2S150 | 484-FBGA (19x19) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
|
XCVE1752-1MSEVSVA2197 | 16.0000 | |
1817 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | - | 4 (72 Hours) | 122-XCVE1752-1MSEVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | |||||||
|
M2S005S-1TQG144T2 | - | |
5024 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 144-LQFP | M2S005 | 144-TQFP (20x20) | download | REACH Unaffected | 0000.00.0000 | 60 | MCU, FPGA | 213 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | |||||
|
M2S010-1TQG144 | 41.6263 | |
3321 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 144-LQFP | M2S010 | 144-TQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 84 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 256KB | FPGA - 10K Logic Modules | ||
|
BCM3384ZKFSBG | - | |
2918 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 5,000 | |||||||||||||||||
|
MPFS025T-FCSG325I | 91.9000 | |
7193 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-FCSG325I | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
 |
XCZU15EG-1FFVC900E | 4.0000 | |
7007 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU15 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ||
 |
10AS022E4F29E3SG | 877.0100 | |
6448 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA, FC (29x29) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 973476 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 220K Logic Elements | ||
|
AGFA019R25A2E3V | 33.0000 | |
1981 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA019R25A2E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
 |
XCZU48DR-1FSVE1156E | 19.0000 | |
8697 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU48DR-1FSVE1156E | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
|
XCVE1752-2MSENSVG1369 | 18.0000 | |
7318 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVE1752-2MSENSVG1369 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||
 |
M2S150-FCG1152 | 384.9408 | |
9622 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
M2S090T-1FCSG325I | 230.0733 | |
7458 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 325-TFBGA, FCBGA | M2S090 | 325-FCBGA (11x13.5) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
|
AGFA019R25A2E4F | 33.0000 | |
2693 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA019R25A2E4F | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFB027R25A2I3E | 67.0000 | |
6198 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB027R25A2I3E | 1 | MPU, FPGA | 624 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
|
10AS048E3F29I2LG | 3.0000 | |
8411 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA, FC (29x29) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965034 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 480K Logic Elements | ||
 |
XCZU43DR-1FSVG1517E | 17.0000 | |
2007 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU43DR-1FSVG1517E | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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