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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
1SX280HU3F50I3VG | 28.0000 |  |
6237 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HU3F50I3VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
 |
1SX085HN3F43E2LG | 12.0000 | |
7267 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX085HN3F43E2LG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 850K Logic Elements | ||||||
|
1SX210HU3F50I3VG | 24.0000 | |
6782 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX210HU3F50I3VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2100K Logic Elements | ||||||
|
1SX250HN2F43I2LG | 38.0000 | |
5333 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HN2F43I2LG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
 |
1SX250HH3F55E1VG | 24.0000 | |
2420 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HH3F55E1VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
 |
5ASXFB3H4F40C5G | 3.0000 | |
9399 | 0.00000000 | Intel | Arria V SX | Tray | Active | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXFB3H4F40C5G | 21 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 350K Logic Elements | ||||
 |
M2S150TS-1FCV484M | 1.0000 | |
3587 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -55°C ~ 125°C (TJ) | 484-BFBGA | 484-FBGA (19x19) | download | ROHS3 Compliant | REACH Unaffected | 150-M2S150TS-1FCV484M | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | |||||
|
BCM68654IFSBG | - | |
9486 | 0.00000000 | Broadcom Limited | - | Tray | Active | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 516-BCM68654IFSBG | 420 | - | - | - | - | - | Ethernet | - | - | - | |||||
 |
XAZU2EG-1SFVA625I | 448.5000 | |
2877 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | XAZU2 | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | 122-2063 | 5A002A4 XIL | 8542.39.0001 | 1 | MPU, FPGA | 128 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 1.2GHz | CANbus, I²C, SPI, UART/USART, USB | DMA, WDT | 1.2MB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||
|
BCM58101B0KFBG | 7.8273 | |
2487 | 0.00000000 | Broadcom Limited | * | Bulk | Active | BCM58101 | - | ROHS3 Compliant | REACH Unaffected | 0000.00.0000 | 1 | ||||||||||||||||
|
TCI6638K2KDXAAW22H | - | |
9917 | 0.00000000 | Texas Instruments | KeyStone Multicore | Bulk | Active | 0°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6638K2KDXAAW22H | 1 | DSP, MPU | 32 | C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | 1.2GHz | Ethernet, I²C, SPI, UART/USART, USB | DDR, DMA, PCIe, POR, WDT | - | - | - | |||||
|
TCI6630K2LXCMS2 | - | |
7874 | 0.00000000 | Texas Instruments | KeyStone Multicore | Bulk | Active | 0°C ~ 100°C (TC) | 900-BFBGA, FCBGA | 900-FCBGA (25x25) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6630K2LXCMS2 | 1 | DSP, MPU | 64 | Dual ARM® Cortex®-A15 MPCore™ with CoreSight™ | 1.2GHz | Ethernet, I²C, PCIe, SPI, UART/USART, USB | DDR, DMA, PCIe, POR, WDT | 3MB | - | - | |||||
|
TCI6630K2LSCMSA | - | |
9812 | 0.00000000 | Texas Instruments | KeyStone Multicore | Bulk | Active | -40°C ~ 100°C (TC) | 900-BFBGA, FCBGA | 900-FCBGA (25x25) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6630K2LSCMSA | 1 | DSP, MPU | 64 | Dual ARM® Cortex®-A15 MPCore™ with CoreSight™ | 1GHz | Ethernet, I²C, PCIe, SPI, UART/USART, USB | DDR, DMA, PCIe, POR, WDT | 3MB | - | - | |||||
|
TCI6638K2KDAAW2 | - | |
2833 | 0.00000000 | Texas Instruments | KeyStone Multicore | Bulk | Active | 0°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6638K2KDAAW2 | 1 | DSP, MPU | 32 | C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | 1.2GHz | Ethernet, I²C, SPI, UART/USART, USB | DDR, DMA, PCIe, POR, WDT | - | - | - | |||||
 |
MPFS250T-FCVG784E | 458.6000 | |
1 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-FCVG784E | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||||
 |
MPFS250T-1FCG1152E | 554.9100 | |
2 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-1FCG1152E | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||||
 |
MPFS250TS-1FCSG536I | 670.9400 | |
5449 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 536-LFBGA, CSPBGA | 536-LFBGA | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250TS-1FCSG536I | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||||
|
MPFS160TS-FCVG784I | 434.4000 | |
4278 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | REACH Unaffected | 150-MPFS160TS-FCVG784I | 1 | MPU, FPGA | MCU - 136, FPGA - 312 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128kB | FPGA - 161K Logic Modules | ||||||
|
MPFS160T-FCVG784I | 367.5700 | |
9453 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | REACH Unaffected | 150-MPFS160T-FCVG784I | 1 | MPU, FPGA | MCU - 136, FPGA - 312 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128kB | FPGA - 161K Logic Modules | ||||||
|
MPFS160TL-FCVG784E | 400.9900 | |
4642 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | REACH Unaffected | 150-MPFS160TL-FCVG784E | 1 | MPU, FPGA | MCU - 136, FPGA - 312 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128kB | FPGA - 161K Logic Modules | ||||||
 |
5CSEMA6U23C6N | 368.2493 | |
7723 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | 0°C ~ 85°C (TJ) | 672-FBGA | 5CSEMA6 | 672-UBGA (23x23) | - | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 969122 | 3A001A7B | 8542.39.0001 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | |
|
BCM1122A4KEBG | - | |
2277 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | |||||||||||||||||
 |
A2F500M3G-FG256 | 76.3837 | |
2696 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
|
AGFB023R31C2I1VB | 33.0000 | |
7660 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB023R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
XCVC1902-2MSEVSVA2197 | 29.0000 | |
3057 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-2MSEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | |||
|
AGIB027R31B2E2VB | 29.0000 | |
9355 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB027R31B2E2VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||
 |
M2S050TS-FG484I | 187.5680 | |
2605 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S050 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
|
1SX250HH3F55I3XG | 34.0000 | |
7926 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HH3F55I3XG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
5ASXFB5H4F40C4G | 7.0000 | |
6263 | 0.00000000 | Intel | Arria V SX | Tray | Active | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXFB5H4F40C4G | 21 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | ||||
 |
XCZU47DR-1FFVE1156E | 15.0000 | |
8779 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU47DR-1FFVE1156E | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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