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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGFA022R24C3E3V | 32.0000 |  |
3307 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA022R24C3E3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
AGFD023R24C2I1VB | 29.0000 | |
2805 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFD023R24C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
XC7Z030-2FBG484I | 391.3000 | |
3824 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BBGA, FCBGA | XC7Z030 | 484-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 122-1889 | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 125K Logic Cells | |
|
AGFB023R24C2E3V | 16.0000 | |
4254 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFB023R24C2E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
XCVM1402-1MSENSVF1369 | 5.0000 | |
8136 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MSENSVF1369 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||
|
MPFS025TLS-FCSG325I | 116.9500 | |
1193 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 100°C | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025TLS-FCSG325I | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
 |
XCZU48DR-2FFVG1517I | 35.0000 | |
5857 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU48DR-2FFVG1517I | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
|
AGIB027R29A1E2VB | 38.0000 | |
8728 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIB027R29A1E2VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||
 |
TDA3MVRBFABFRQ1 | 36.8550 | |
6728 | 0.00000000 | Texas Instruments | - | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | 367-BFBGA, FCBGA | 367-FCBGA (15x15) | - | Not applicable | 3 (168 Hours) | 296-TDA3MVRBFABFRQ1TR | 3A991A1 | 8542.31.0001 | 750 | DSP, MPU | 126 | ARM® Cortex®-M4, C66x | 212.8MHz, 745MHz | CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB | DMA, PWM, WDT | 512kB | - | - | |||
 |
5ASXFB5H6F40C6NES | - | |
4673 | 0.00000000 | Intel | Arria V SX | Tray | Obsolete | 0°C ~ 85°C (TJ) | 1517-BBGA, FCBGA | 5ASXFB5 | 1517-FBGA, FC (40x40) | download | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 1 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 700MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | |||
 |
XC7Z007S-1CLG400I | 74.9000 | |
7479 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | XC7Z007 | 400-CSPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2012 | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 100 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 23K Logic Cells | |
|
AGFA012R24C2I3E | 46.0000 | |
6522 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA012R24C2I3E | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
 |
1SX065HH2F35I2VG | 7.0000 | |
1759 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | download | 3 (168 Hours) | 544-1SX065HH2F35I2VG | 1 | MCU, FPGA | 392 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 650K Logic Elements | ||||||
 |
XCZU2CG-1UBVA530E | 265.2000 | |
3129 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU2CG-1UBVA530E | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||
 |
M2S025S-1FGG484I | - | |
6343 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 484-BGA | M2S025S | 484-FPBGA (23x23) | download | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | |||
|
XCVC1702-2MSIVSVA2197 | 31.0000 | |
3335 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | - | 4 (72 Hours) | 122-XCVC1702-2MSIVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||
 |
M2S050-VFG400I | 149.1851 | |
9654 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1100-1203 | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | |
|
AGIB022R31B1E1V | 91.0000 | |
8510 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB022R31B1E1V | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
 |
XC7Z035-1FFG676C | 1.0000 | |
6771 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 85°C (TJ) | 676-BBGA, FCBGA | XC7Z035 | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 275K Logic Cells | ||
|
AGFB008R24D2I3V | 21.0000 | |
4956 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB008R24D2I3V | 3 | |||||||||||||||||||
 |
MPFS250T-1FCVG784I | 550.3200 | |
2 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | -40°C ~ 100°C | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-1FCVG784I | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||||
 |
M2S100S-1FC1152I | - | |
2298 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S100S | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 100K Logic Modules | ||
|
M2S050S-1FG484I | - | |
9275 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 484-BGA | M2S050S | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
 |
XCZU2CG-2SBVA484E | 391.3000 | |
6626 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | XCZU2 | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||
|
AGIB022R31B1E2V | 80.0000 | |
1198 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB022R31B1E2V | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
BCM3380DIFSBG | - | |
2008 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | 5A992C | 8542.31.0001 | 1 | |||||||||||||||||
 |
5CSEBA4U23C6N | 199.0237 | |
4932 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 968241 | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 40K Logic Elements | ||
 |
10AS066H4F34I3SG | 3.0000 | |
8165 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965380 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
|
AGIB023R31B2E1V | 75.0000 | |
8453 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB023R31B2E1V | 3 | |||||||||||||||||||
|
M2S060T-FGG484I | 177.2542 | |
2525 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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