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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
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M2S050-FGG896 | 151.7200 | 8367 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 896-BGA | M2S050 | 896-FBGA (31x31) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 1100-1169 | 3A991D | 8542.39.0001 | 27 | MCU, FPGA | 377 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | |||
M2S060-1VF400 | 156.6584 | 8643 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 400-LFBGA | M2S060 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||||
AGFA008R16A2I1VB | 13.0000 | 4719 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 1546-BFBGA Exposed Pad | 1546-BGA (37.5x34) | - | 544-AGFA008R16A2I1VB | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | |||||||||
EP7211-CV-D | 11.2000 | 7 | 0.00000000 | Cirrus Logic Inc. | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 3A991A2 | 8542.31.0001 | 1 | |||||||||||||||||
M2S060T-FGG484 | 157.5478 | 3162 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||||
M2S060TS-FG676 | 186.1795 | 7832 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 676-BGA | M2S060 | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 387 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||||
1SX165HN3F43E3VG | 13.0000 | 6248 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX165HN3F43E3VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1650K Logic Elements | ||||||||
M2S090T-1FGG484I | 333.3912 | 2155 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S090 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||||
XCZU1CG-L2SFVA625E | 413.4000 | 8674 | 0.00000000 | AMD | Zynq® UltraScale+™ | Tray | Active | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1CG-L2SFVA625E | 1 | MPU, FPGA | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | - | DMA, WDT | 256KB | - | - | |||||||
XCVC1902-1LSIVIVA1596 | 32.0000 | 2064 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-1LSIVIVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | |||||
AGFA022R24C3E3V | 32.0000 | 3307 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA022R24C3E3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||||
XCVM1502-1LLINFVB1369 | 11.0000 | 3854 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 110°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVM1502-1LLINFVB1369 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||||||
AGFD019R25A2E4F | 37.0000 | 6323 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD019R25A2E4F | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||||
AGIB027R31A2I2VB | 107.0000 | 1381 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB027R31A2I2VB | 3 | |||||||||||||||||||||
M2S150T-FCV484I | 460.3819 | 2441 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA | M2S150 | 484-FBGA (19x19) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||||
XCZU19EG-2FFVD1760E | 9.0000 | 9050 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | XCZU19 | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 308 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||||
10AS066H3F34E2SG | 4.0000 | 3472 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | |||||
XCVM1502-2LSENFVB1369 | 9.0000 | 6695 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 110°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVM1502-2LSENFVB1369 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||||||
AGIB023R31B1E2VB | 27.0000 | 5257 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B1E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||||
AGFB008R16A2E3V | 21.0000 | 2549 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB008R16A2E3V | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | ||||||||
MPFS025T-1FCSG325T2 | - | 2318 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-1FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||||
10AS057K4F40E3LG | 4.0000 | 3402 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 978979 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 696 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 570K Logic Elements | ||||
AGFB023R31C2I1V | 83.0000 | 8523 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB023R31C2I1V | 3 | |||||||||||||||||||||
M2S005-1TQG144 | 20.4052 | 4358 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 144-LQFP | M2S005 | 144-TQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 84 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | ||||
XCVC1802-2MSEVIVA1596 | 24.0000 | 9082 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2MSEVIVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||||
5ASTFD5K3F40I5NES | - | 9899 | 0.00000000 | Intel | Arria V ST | Tray | Obsolete | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 5ASTFD5 | 1517-FBGA, FC (40x40) | download | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 1 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | |||||
MPFS250TL-FCVG484E | 522.8000 | 4556 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 150-MPFS250TL-FCVG484E | 5A992C | 8542.31.0001 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||||
AGIB019R31B2E2V | 57.0000 | 5565 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB019R31B2E2V | 3 | |||||||||||||||||||||
AGFB019R31C2I1VB | 26.0000 | 1063 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB019R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||||
AGFB014R24C2E3E | 44.0000 | 9659 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB014R24C2E3E | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements |
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