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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
XCZU19EG-2FFVD1760E | 9.0000 |  |
9050 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | XCZU19 | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 308 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||
 |
XCZU4EG-L2SFVC784E | 1.0000 | |
6329 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU4 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
 |
A2F200M3F-FG484I | - | |
1050 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F200 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | A2F200M3F-FG484IX23 | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 94 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
 |
1SX280LN3F43I3VGAS | 23.0000 | |
5772 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280LN3F43I3VGAS | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
 |
10AS066H3F34E2SG | 4.0000 | |
3472 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | |||
|
XCVM1502-2LSENFVB1369 | 9.0000 | |
6695 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 110°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVM1502-2LSENFVB1369 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||||
|
AGIB023R31B1E2VB | 27.0000 | |
5257 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B1E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
|
AGFB008R16A2E3V | 21.0000 | |
2549 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB008R16A2E3V | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | ||||||
 |
XCZU7CG-2FFVC1156I | 4.0000 | |
3186 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU7 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 360 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
|
MPFS025T-1FCSG325T2 | - | |
2318 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-1FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
 |
1SX280HU1F50E2VGS3 | 34.0000 | |
1895 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Discontinued at SIC | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HU1F50E2VGS3 | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
 |
10AS057K4F40E3LG | 4.0000 | |
3402 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 978979 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 696 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 570K Logic Elements | ||
|
AGIB023R18A2E2V | 62.0000 | |
2209 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB023R18A2E2V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
1SX250HN3F43I1VG | 30.0000 | |
4846 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HN3F43I1VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
AGFB023R31C2I1V | 83.0000 | |
8523 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB023R31C2I1V | 3 | |||||||||||||||||||
 |
M2S005-1TQG144 | 20.4052 | |
4358 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 144-LQFP | M2S005 | 144-TQFP (20x20) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 84 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | ||
|
1SX280HN1F43E2LGS3 | 41.0000 | |
4650 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HN1F43E2LGS3 | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
 |
XCVC1802-2MSEVIVA1596 | 24.0000 | |
9082 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2MSEVIVA1596 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||
 |
5ASTFD5K3F40I5NES | - | |
9899 | 0.00000000 | Intel | Arria V ST | Tray | Obsolete | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 5ASTFD5 | 1517-FBGA, FC (40x40) | download | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 1 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | |||
 |
MPFS250TL-FCVG484E | 522.8000 | |
4556 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 150-MPFS250TL-FCVG484E | 5A992C | 8542.31.0001 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||
|
AGIB019R31B2E2V | 57.0000 | |
5565 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB019R31B2E2V | 3 | |||||||||||||||||||
|
AGFB022R24C3E3E | 41.0000 | |
9482 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB022R24C3E3E | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
1SX250HU3F50E1VG | 30.0000 | |
3850 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HU3F50E1VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
AGFB019R31C2I1VB | 26.0000 | |
1063 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB019R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
|
AGFA008R24C2I3E | 33.0000 | |
7027 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA008R24C2I3E | 1 | MPU, FPGA | 576 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | ||||||
|
AGFB014R24C2E3E | 44.0000 | |
9659 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB014R24C2E3E | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
|
XCVE1752-2MLENSVG1369 | 22.0000 | |
7108 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVE1752-2MLENSVG1369 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||
 |
XCZU7EV-L2FBVB900E | 4.0000 | |
8048 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU7 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
 |
XCZU9EG-3FFVB1156E | 6.0000 | |
4691 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 600MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
|
AGFD023R25A2E3V | 42.0000 | |
6946 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD023R25A2E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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