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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
UPD60802F1-A11-BND-E2-A | 10.9200 |  |
126 | 0.00000000 | Renesas Electronics America Inc | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 2,000 | ||||||||||||||
|
UPD63712AGC-8EU-A | 9.8500 | |
447 | 0.00000000 | Renesas Electronics America Inc | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 0000.00.0000 | 1 | |||||||||||||||
|
PXB4330EV1.1 | - | |
6908 | 0.00000000 | Infineon Technologies | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 1 | ||||||||||||||||
 |
EP7211-CV-D | 11.2000 | |
7 | 0.00000000 | Cirrus Logic Inc. | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 3A991A2 | 8542.31.0001 | 1 | ||||||||||||||
|
PS7111-VC-A | 13.2600 | |
383 | 0.00000000 | Cirrus Logic Inc. | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 8542.39.0001 | 1 | |||||||||||||||
|
TLE92672QXXUMA2 | - | |
3780 | 0.00000000 | Infineon Technologies | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 0000.00.0000 | 1 | |||||||||||||||
|
NHE6300ESB | - | |
5355 | 0.00000000 | Intel | * | Bulk | Active | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 360 | ||||||||||||||||
 |
PLCHIP-P13-51220X5 | 351.3500 | |
3 | 0.00000000 | Divelbiss Corporation | - | Tray | Active | -40°C ~ 85°C (TJ) | 208-LQFP | 208-LQFP (28x28) | download | ROHS3 Compliant | 2 (1 Year) | 2698-PLCHIP-P13-51220X5 | EAR99 | 8537.10.9160 | 1 | MCU | 164 | PLC | 12MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | LCD, PWM, WDT | 32KB | 256KB | - | ||
 |
PLCHIP-P10-51220X10 | 557.8000 | |
3 | 0.00000000 | Divelbiss Corporation | - | Tray | Active | -40°C ~ 85°C (TJ) | 144-LQFP | 144-LQFP (20x20) | download | ROHS3 Compliant | 2 (1 Year) | 2698-PLCHIP-P10-51220X10 | EAR99 | 8537.10.9160 | 1 | MCU | 106 | PLC | 12MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | LCD, PWM, WDT | 32KB | 256KB | - | ||
|
PLCHIP-P10-51220 | 44.6200 | |
120 | 0.00000000 | Divelbiss Corporation | - | Tray | Active | -40°C ~ 85°C (TJ) | 144-LQFP | 144-LQFP (20x20) | download | ROHS3 Compliant | 2 (1 Year) | 2698-PLCHIP-P10-51220 | EAR99 | 8537.10.9160 | 60 | MCU | 106 | PLC | 12MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | LCD, PWM, WDT | 32KB | 256KB | - | ||
|
PLCHIP-P13-51220 | 52.0500 | |
5439 | 0.00000000 | Divelbiss Corporation | - | Tray | Active | -40°C ~ 85°C (TJ) | 208-LQFP | 208-LQFP (28x28) | download | ROHS3 Compliant | 2 (1 Year) | 2698-PLCHIP-P13-51220 | EAR99 | 8537.10.9160 | 36 | MCU | 164 | PLC | 12MHz | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | LCD, PWM, WDT | 32KB | 256KB | - | ||
|
BCM68654IFSBG | - | |
9486 | 0.00000000 | Broadcom Limited | - | Tray | Active | - | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 516-BCM68654IFSBG | 420 | - | - | - | - | - | Ethernet | - | - | - | ||||
|
M2S150TS-1FCV484M | 1.0000 | |
3587 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -55°C ~ 125°C (TJ) | 484-BFBGA | 484-FBGA (19x19) | download | ROHS3 Compliant | REACH Unaffected | 150-M2S150TS-1FCV484M | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||||
|
AGFD019R31C2E2VB | 21.0000 | |
9394 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFD019R31C2E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFB023R24C3E4X | 23.0000 | |
3692 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFB023R24C3E4X | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
AGFC023R24C3E4X | 23.0000 | |
5942 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFC023R24C3E4X | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
AGFC019R24C3E3V | 10.0000 | |
4008 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFC019R24C3E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGIB041R29D1E2VR1 | 52.0000 | |
5186 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIB041R29D1E2VR1 | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements | ||||||
|
AGFD023R24C2E3E | 23.0000 | |
8986 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFD023R24C2E3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
AGIB022R31A2I3V | 31.0000 | |
1090 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB022R31A2I3V | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
AGFA022R24C2E2VB | 20.0000 | |
5153 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA022R24C2E2VB | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
AGFA023R24C2E1VB | 24.0000 | |
5816 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA023R24C2E1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
AGFA019R24C3E3E | 13.0000 | |
2302 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA019R24C3E3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFA019R24C3E4X | 18.0000 | |
7434 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA019R24C3E4X | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFC019R24C2E3E | 20.0000 | |
2106 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFC019R24C2E3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFD019R24C2E3E | 20.0000 | |
4277 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFD019R24C2E3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFD019R24C3E3V | 11.0000 | |
7933 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFD019R24C3E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFD023R31C2I1VB | 33.0000 | |
9351 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFD023R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
AGIB027R31B1E1VB | 42.0000 | |
4257 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB027R31B1E1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
|
AGFA023R31C2I1VB | 30.0000 | |
4599 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFA023R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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