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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGID023R31B2I1V | 110.0000 |  |
6473 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID023R31B2I1V | 3 | |||||||||||||||||||
|
AGIC040R39A1I1VB | 203.0000 | |
6178 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIC040R39A1I1VB | 3 | |||||||||||||||||||
|
AGFC023R31C3E3E | 48.0000 | |
6137 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFC023R31C3E3E | 3 | |||||||||||||||||||
 |
XCVM1402-2LSEVSVD1760 | 8.0000 | |
4260 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2LSEVSVD1760 | 1 | MPU, FPGA | 726 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||
 |
MPFS095TS-FCSG536I | 335.4900 | |
4973 | 0.00000000 | Microchip Technology | PolarFire® | Tray | Active | -40°C ~ 100°C | 536-BGA | 536-LFBGA | download | REACH Unaffected | 150-MPFS095TS-FCSG536I | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128kB | FPGA - 93K Logic Modules | ||||||
|
AGFA019R25A1I1V | 60.0000 | |
7405 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA019R25A1I1V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
 |
XCZU57DR-2FSVE1156I | 21.0000 | |
2537 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC DR | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU57DR-2FSVE1156I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe, WDT | - | - | Zynq® UltraScale+™ RFSoC | |||||
 |
XCZU4EV-1FBVB900I | 2.0000 | |
1954 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU4 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
AGFA022R24C2I3V | 59.0000 | |
2749 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA022R24C2I3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
 |
XC7Z012S-2CLG485E | 150.8000 | |
2149 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 100°C (TJ) | 485-LFBGA, CSPBGA | XC7Z012 | 485-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-2007 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 150 | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 766MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 55K Logic Cells | |
 |
1SX250HN2F43I2VG | 30.0000 | |
3767 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HN2F43I2VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
AGFA022R25A2E2V | 48.0000 | |
2063 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA022R25A2E2V | 1 | MPU, FPGA | 624 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
AGIA040R39A2E3V | 102.0000 | |
5515 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIA040R39A2E3V | 3 | |||||||||||||||||||
|
AGFA014R24C3E3V | 25.0000 | |
2541 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA014R24C3E3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
|
XC7Z100-1FF900I | 3.0000 | |
6867 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XC7Z100 | 900-FCBGA (31x31) | download | RoHS non-compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 444K Logic Cells | ||
 |
XCVM1402-1MLINBVB1024 | 7.0000 | |
1426 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MLINBVB1024 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||
|
AGIB027R31B2I3E | 98.0000 | |
1318 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB027R31B2I3E | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
|
XAZU1EG-L1SBVA484I | 423.8000 | |
3078 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XAZU1EG-L1SBVA484I | 1 | MPU, FPGA | 82 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 82K Logic Cells | |||||
 |
DRA829VMTGBALFR | 85.2566 | |
6233 | 0.00000000 | Texas Instruments | Automotive, AEC-Q100 | Tape & Reel (TR) | Active | -40°C ~ 105°C (TJ) | 827-BFBGA, FCBGA | 827-FCBGA (24x24) | download | Not applicable | 3 (168 Hours) | 296-DRA829VMTGBALFRTR | 5A992C | 8542.31.0001 | 250 | DSP, MCU, MPU | 226 | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | 2GHz, 1GHz, 1.35GHz, 1GHz | MCAN, MMC/SDSD/IOI²C, SPI, UART, USB | DMA, PWM, WDT | 1.5MB | - | - | |||
 |
M2S090TS-FG484I | 333.3912 | |
9353 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S090 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
XCZU47DR-L1FFVG1517I | 25.0000 | |
1649 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU47DR-L1FFVG1517I | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
|
AGIB027R31A2I2VB | 107.0000 | |
1381 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB027R31A2I2VB | 3 | |||||||||||||||||||
|
AGFB008R24D1I2V | 29.0000 | |
2290 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB008R24D1I2V | 3 | |||||||||||||||||||
|
AGIB023R31B1E2VB | 27.0000 | |
5257 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B1E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
|
BCM7405ZKFEB05G | - | |
5878 | 0.00000000 | Broadcom Limited | BCM7405 | Bulk | Obsolete | - | - | - | - | Not Applicable | OBSOLETE | 0000.00.0000 | 23,000 | - | - | MIPS32®/16e | 400MHz | EBI/EMI, Ethernet, UART/USART, USB | DDR2, DMA | - | - | - | |||||
 |
XCVE1752-2LLENSVG1369 | 26.0000 | |
4131 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVE1752-2LLENSVG1369 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||
|
AGFA027R24C2E4X | 86.0000 | |
3196 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA027R24C2E4X | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
 |
M2S010TS-1VF400I | 69.2922 | |
1341 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
|
AGID019R31B2I3V | 72.0000 | |
4155 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID019R31B2I3V | 3 | |||||||||||||||||||
 |
XCZU6CG-1FFVB1156E | 2.0000 | |
9171 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Bulk | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU6 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 328 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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