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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGFB012R24B2E4X | 33.0000 |  |
5689 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB012R24B2E4X | 1 | MPU, FPGA | 768 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
AGFC023R24C3E3E | 17.0000 | |
3566 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFC023R24C3E3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
|
AGFB027R24C3I3V | 47.0000 | |
9045 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB027R24C3I3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
 |
M2S060-FCS325 | 98.9723 | |
9564 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S060 | 325-FCBGA (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 200 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
M2S005-VF256 | 20.4898 | |
4700 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 256-LFBGA | M2S005 | 256-FPBGA (14x14) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 119 | MCU, FPGA | 161 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | ||
|
A2F200M3F-FGG256 | - | |
7310 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 256-LBGA | A2F200 | 256-FPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | ||
|
AGIB027R29B1E2VR3 | 105.0000 | |
2253 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB027R29B1E2VR3 | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
|
AGFB012R24C2I3V | 14.0000 | |
8770 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB012R24C2I3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
AGFD019R25A2E2V | 43.0000 | |
3749 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD019R25A2E2V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
 |
1SX065HH3F35E3XG | 7.0000 | |
2690 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | download | 3 (168 Hours) | 544-1SX065HH3F35E3XG | 1 | MCU, FPGA | 392 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 650K Logic Elements | ||||||
 |
M2S050T-FGG484 | 150.0400 | |
8703 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S050 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
 |
M2S010TS-1VFG400I | 69.2922 | |
6332 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
|
AGFA023R24C2I2VB | 25.0000 | |
2475 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFA023R24C2I2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
1SX250LH2F55I2VG | 29.0000 | |
6395 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 1160 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | |||
 |
M2S150S-1FC1152I | - | |
4717 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S150S | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
1SX085HN3F43I3XG | 16.0000 | |
6585 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX085HN3F43I3XG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 850K Logic Elements | ||||||
 |
10AS027E2F27E1HG | 1.0000 | |
4038 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA, FC (27x27) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965280 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 270K Logic Elements | ||
|
AGIC035R39A2I2VB | 142.0000 | |
6856 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIC035R39A2I2VB | 3 | |||||||||||||||||||
|
AGID041R29D1E2VB | 57.0000 | |
3324 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGID041R29D1E2VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements | |||||||
 |
XCZU4EG-1SFVC784E | 1.0000 | |
36 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU4 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
AGID019R31B2I2VB | 33.0000 | |
7439 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGID019R31B2I2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
|
AGFB019R25A2E2V | 38.0000 | |
3408 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB019R25A2E2V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
M2S060-FG484 | 131.3023 | |
3283 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
|
AGFB019R31C2E1V | 60.0000 | |
5715 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB019R31C2E1V | 3 | |||||||||||||||||||
|
M2S090T-FG676 | 294.1730 | |
3204 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
1SX250LN3F43I3VG | 21.0000 | |
3660 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA, FC (42.5x42.5) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 688 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | |||
 |
XCZU49DR-2FFVF1760I | 36.0000 | |
9899 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU49DR-2FFVF1760I | 1 | MCU, FPGA | 622 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
 |
XCZU4EG-1FBVB900I | 1.0000 | |
5533 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU4 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
AGFD019R25A2E3V | 37.0000 | |
3038 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD019R25A2E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
M2S005S-1VF400I | 31.5139 | |
2873 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S005 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 90 | MCU, FPGA | 169 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR | 64KB | 128KB | FPGA - 5K Logic Modules |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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