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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
M2S090T-1FGG676 | 330.9650 |  |
5094 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
XCVC1702-1MSENSVG1369 | 16.0000 | |
9888 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVC1702-1MSENSVG1369 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||
 |
M2S010-VFG400 | 44.7600 | |
240 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 400-LFBGA | M2S010 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 195 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
|
AGFA006R16A3I3E | 17.0000 | |
1852 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA006R16A3I3E | 1 | MPU, FPGA | 384 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 573K Logic Elements | ||||||
|
AGFB023R31C2I2VB | 29.0000 | |
8545 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB023R31C2I2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
XCZU3EG-3SFVC784E | - | |
9794 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Obsolete | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | 4 (72 Hours) | REACH Unaffected | OBSOLETE | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 600MHz, 667MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||||
 |
XCVM1402-2LLEVFVC1596 | 9.0000 | |
8618 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2LLEVFVC1596 | 1 | MPU, FPGA | 748 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||
 |
M2S150T-1FCVG484I | 511.5350 | |
9438 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA | M2S150 | 484-FBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | 273 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
5CSEBA4U19I7 | 182.3699 | |
4549 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965987 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 40K Logic Elements | ||
|
AGIB022R31A3I3V | 19.0000 | |
9574 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB022R31A3I3V | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | |||||||
|
AGFB012R24C3E3V | 22.0000 | |
3215 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB012R24C3E3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
AGFA022R25A3I3E | 41.0000 | |
9500 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA022R25A3I3E | 1 | MPU, FPGA | 624 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
M2S050-1FG484I | 175.0598 | |
4300 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S050 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
|
XCZU4EV-2SFVC784I | 1.0000 | |
9718 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | -40°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU4 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
 |
XCZU4CG-1FBVB900I | 1.0000 | |
5589 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU4 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
AGFA019R31C3E3E | 37.0000 | |
8413 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFA019R31C3E3E | 3 | |||||||||||||||||||
 |
10AS066H3F34I2SGES | 3.0000 | |
7380 | 0.00000000 | Intel | Arria 10 SX | Tray | Discontinued at SIC | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 985538 | 3A001A7A | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
|
AGFC019R31C2I3E | 70.0000 | |
5148 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFC019R31C2I3E | 3 | |||||||||||||||||||
 |
10AS016E3F27E1SG | - | |
5066 | 0.00000000 | Intel | Arria 10 SX | Tray | Discontinued at SIC | 0°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA, FC (27x27) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 160K Logic Elements | |||
|
XCZU4EV-L2FBVB900E | 2.0000 | |
6219 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU4 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
XCZU5EG-L1FBVB900I | 3.0000 | |
4914 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU5 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||
|
BCM47452B0KRFBG | - | |
1421 | 0.00000000 | Broadcom Limited | * | Bulk | Active | BCM47452 | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 0000.00.0000 | 1 | |||||||||||||||
 |
10AS022E4F29E3LG | 1.0000 | |
8465 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA, FC (29x29) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965042 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 220K Logic Elements | ||
 |
AMA4B2KP-KXR | 13.8700 | |
5 | 0.00000000 | Ambiq Micro, Inc. | - | Tape & Reel (TR) | Active | -20°C ~ 60°C | 131-VFBGA | 131-BGA (4.7x4.7) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 8542.31.0001 | 5,000 | MCU | 81 | ARM® Cortex®-M0, ARM® Cortex®-M4F | 192MHz | GPIO, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | AES, DMA, I²S, WDT | 2.75MB | 2MB | - | ||||
 |
AMA3B2KK-KBR | 6.6100 | |
5 | 0.00000000 | Ambiq Micro, Inc. | - | Tape & Reel (TR) | Active | -40°C ~ 85°C | 108-BGA | 108-BGA (5.3x4.3) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 8542.31.0001 | 5,000 | MCU | 74 | ARM® Cortex®-M4F | 96MHz | GPIO, I²C, SPI, UART/USART, USB OTG | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | 768KB | 2MB | - | ||||
 |
XCVC1502-1LLINSVG1369 | 24.0000 | |
8296 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1502-1LLINSVG1369 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 80k Logic Cells | |||
|
AGFB022R25A2I3E | 57.0000 | |
4272 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB022R25A2I3E | 1 | MPU, FPGA | 624 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.2M Logic Elements | ||||||
|
A2F060M3E-1CSG288 | - | |
7120 | 0.00000000 | Microsemi Corporation | SmartFusion® | Tray | Obsolete | 0°C ~ 85°C (TJ) | 288-TFBGA, CSPBGA | A2F060M3E | 288-CSP (11x11) | download | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | MCU - 28, FPGA - 68 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, I²C, SPI, UART/USART | DMA, POR, WDT | 16KB | 128KB | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | |||
 |
M2S010S-1TQ144I | - | |
9071 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Obsolete | -40°C ~ 100°C (TJ) | 144-LQFP | 144-TQFP (20x20) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 60 | MCU, FPGA | 84 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 256KB | FPGA - 10K Logic Modules | |||
|
AGIC035R39A1I2VB | 162.0000 | |
5554 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIC035R39A1I2VB | 3 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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