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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
XCVC1702-1LSINSVG1369 | 24.0000 |  |
4479 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-1LSINSVG1369 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||
 |
XCVM1402-1LLINBVB1024 | 9.0000 | |
7041 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1LLINBVB1024 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | |||||
| XCVC1702-2LSEVSVA1596 | 27.0000 | |
7477 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-2LSEVSVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||
 |
MPFS095TL-FCSG325E | 283.8700 | |
5534 | 0.00000000 | Microchip Technology | - | Bulk | Active | 0°C ~ 100°C | 325-LFBGA | 325-LFBGA (11x14.5) | download | REACH Unaffected | 150-MPFS095TL-FCSG325E | 1 | MPU, FPGA | MCU - 136, FPGA - 276 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6kB | 128KB | FPGA - 93K Logic Modules | ||||||
 |
XCZU2CG-2UBVA530I | 425.1000 | |
2712 | 0.00000000 | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU2CG-2UBVA530I | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | |||||
|
XCZU3CG-1UBVA530I | 530.4000 | |
7261 | 0.00000000 | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | download | ROHS3 Compliant | 3 (168 Hours) | 122-XCZU3CG-1UBVA530I | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |||||
|
AGFB006R24C3I3E | 19.0000 | |
4218 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB006R24C3I3E | 1 | MPU, FPGA | 576 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 573K Logic Elements | ||||||
|
EP7212-CV-D | - | |
4393 | 0.00000000 | Cirrus Logic Inc. | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | 8542.31.0001 | 1 | ||||||||||||||||
|
AGID041R29D1E1VB | 71.0000 | |
4745 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGID041R29D1E1VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements | |||||||
|
BCM3380ZKFEBG | - | |
9877 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | 5A992C | 8542.31.0001 | 1 | |||||||||||||||||
 |
XCZU48DR-1FSVE1156I | 24.0000 | |
7337 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU48DR-1FSVE1156I | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
 |
M2S010TS-FG484 | 64.9800 | |
6979 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 484-BGA | M2S010 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 233 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 10K Logic Modules | ||
 |
XCVC1802-1LLIVSVD1760 | 36.0000 | |
3104 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-1LLIVSVD1760 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 692 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||
|
AGFD019R24C2I3E | 22.0000 | |
1215 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFD019R24C2I3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
 |
XCZU5EV-2SFVC784E | 2.0000 | |
1337 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU5 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ||
|
M2S060T-1FG484I | 196.9488 | |
7038 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | M2S060 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | 267 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
|
XCVC1502-2MSEVSVA2197 | 20.0000 | |
4732 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 110°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | - | 4 (72 Hours) | 122-XCVC1502-2MSEVSVA2197 | 1 | MPU, FPGA | 586 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 800k Logic Cells | ||||||
 |
1SX280HU3F50I2LGAS | 42.0000 | |
1974 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HU3F50I2LGAS | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
 |
M2S025TS-1FCS325 | 95.9301 | |
8593 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S025 | 325-FCBGA (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules | ||
|
XCVM1502-2MLEVFVC1760 | 9.0000 | |
4027 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 110°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | - | 4 (72 Hours) | 122-XCVM1502-2MLEVFVC1760 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||||
 |
5ASXFB3G6F35C6G | 2.0000 | |
6138 | 0.00000000 | Intel | Arria V SX | Tray | Active | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXFB3G6F35C6G | 24 | MCU, FPGA | MCU - 208, FPGA - 385 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 700MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 350K Logic Elements | ||||
 |
1SX250HN3F43I3XG | 34.0000 | |
9899 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HN3F43I3XG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
BCM33843EKFSBG | - | |
1730 | 0.00000000 | Broadcom Limited | - | Tray | Obsolete | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 60 | ||||||||||||||||
|
BCM3384EUKFSBG | - | |
6168 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 5,000 | |||||||||||||||||
 |
M2S060T-FG676I | 186.1795 | |
1529 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 676-BGA | M2S060 | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 387 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
|
M2S060T-1FCS325I | 148.4219 | |
6510 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 325-TFBGA, FCBGA | M2S060 | 325-FCBGA (11x11) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 200 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
1SX280LN3F43I1VG | 33.0000 | |
5374 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA, FC (42.5x42.5) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 688 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | |||
 |
A2F500M3G-1FG256M | - | |
9295 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -55°C ~ 125°C (TJ) | 256-LBGA | A2F500 | 256-FPBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 90 | MCU, FPGA | MCU - 25, FPGA - 66 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
|
AGFA014R24C2E1V | 50.0000 | |
6707 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA014R24C2E1V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
 |
1SX280LH3F55I2VG | 27.0000 | |
1320 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 1160 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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