Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE0712-02-35-2I | - | 1677 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||
SOMOMAP3530-11-1782JFIR | - | 5253 | 0.00000000 | Beacon EmbeddedWorks | OMAP35x | Bulk | Obsolete | -40°C ~ 85°C | 1.230" L x 3.010" W (31.20mm x 76.50mm) | download | 1 (Unlimited) | REACH Unaffected | 5A002A1 LOG | 8473.30.1180 | 1 | ARM® Cortex®-A8, OMAP3530 | 600MHz | 256MB | 512MB (NAND), 8MB (NOR) | MPU, DSP Core | TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 240 | ||||||
ME-XU1-6CG-1E-D11E-R4.2 | - | 5247 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Active | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | download | 2879-ME-XU1-6CG-1E-D11E-R4.2 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | FPGA | - | 168 Pin | |||||||||
ME-XU1-9EG-1E-D11E-G1-R5.0 | - | 8705 | 0.00000000 | Enclustra FPGA Solutions | Mercury+ XU1 | Bulk | Active | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | 2879-ME-XU1-9EG-1E-D11E-G1-R5.0 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 2GB | 16GB | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E | 168 Pin | |||||||||
TE0720-03-61Q33ML | - | 7953 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33ML | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||||
TE0820-03-2AI21FA | - | 1029 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-2AI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||||
5962-9162304MXC | 2.0000 | 1 | 0.00000000 | Texas Instruments | * | Bulk | Active | download | RoHS non-compliant | 3 (168 Hours) | REACH Affected | 3A001A2C | 8542.31.0001 | 1 | ||||||||||||||
20-101-1246 | - | 9668 | 0.00000000 | Digi | RabbitCore® | Box | Obsolete | -30°C ~ 75°C | 1.840" L x 2.850" W (47.00mm x 72.00mm) | - | 1 (Unlimited) | REACH Unaffected | 5A002A1 DIG | 8473.30.1180 | 1 | Rabbit 5000 | 73.73MHz | 1MB | 1.5MB | MPU Core | - | IDC Header 2x25, 2x5, 1xAntenna | ||||||
M5475JFEE-B | - | 9567 | 0.00000000 | Beacon EmbeddedWorks | ColdFire® | Tray | Obsolete | 0°C ~ 70°C | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | ColdFire V4e, MCF5475 | 266MHz | 64MB | 16MB | MPU Core | - | - | ||||||||
TE0712-02-82C11-P | - | 4161 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C11-P | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
3354-HX-XX8-RC | 137.0600 | 5309 | 0.00000000 | Critical Link LLC | MitySOM | Bulk | Active | 0°C ~ 70°C | 2.660" L x 1.500" W (67.60mm x 38.10mm) | download | RoHS Compliant | 1 (Unlimited) | 0000.00.0000 | 1 | ARM® Cortex®-A8, AM3354 | 800MHz | 512MB | - | MPU Core | NEON™ SIMD | SO-DIMM-204 | |||||||
DC-EM-02T-GORL-1 | - | 9241 | 0.00000000 | Digi | Digi Connect EM® | Bulk | Obsolete | -40°C ~ 85°C | 1.570" L x 1.940" W (40.00mm x 49.20mm) | - | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ARM7TDMI, NS7520 | 55MHz | 8MB | 4MB | MPU Core | - | Pin Header, RJ45 | ||||||
TE0818-01-6BE21-A | 1.0000 | 9084 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-6BE21-A | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||||
TE0741-04-B2C-1-A | 733.9500 | 1228 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0741-04-B2C-1-A | 1 | ||||||||||||||||
CENGLH7A404-11-504HCR | - | 7494 | 0.00000000 | Beacon EmbeddedWorks | - | Bulk | Obsolete | 0°C ~ 70°C | 2.370" L x 2.670" W (60.20mm x 67.80mm) | download | 1 (Unlimited) | REACH Unaffected | 4A994B | 8473.30.1180 | 1 | ARM922T, LH7A404 | 200MHz | 64MB | 32MB | MPU Core | - | SO-DIMM-144 | ||||||
CENGLH7A400-10-504HCR | - | 1321 | 0.00000000 | Beacon EmbeddedWorks | - | Bulk | Obsolete | 0°C ~ 70°C | 2.370" L x 2.670" W (60.20mm x 67.80mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 4A994B | 8473.30.1180 | 1 | ARM922T, LH7A400 | 200MHz | 64MB | 32MB | MPU Core | - | SO-DIMM-144 | |||||
TE0720-03-61Q33FA | - | 7695 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||||
ME-XU7-9EG-2I-D12E-R5.0 | - | 9182 | 0.00000000 | Enclustra FPGA Solutions | Mercury+ XU7 | Bulk | Active | -40°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | 2879-ME-XU7-9EG-2I-D12E-R5.0 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 4GB | 16GB | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I | 168 Pin | |||||||||
TE0803-04-5DI21-A | 1.0000 | 7358 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DI21-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 4GB | 128MB | MPU Core | - | B2B | |||||||
TE0841-02-41C21-A | 1.0000 | 5218 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0841-02-41C21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | ||||
TE0723-02 | - | 7918 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Bulk | Discontinued at SIC | 0°C ~ 70°C | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 128MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | Arduino | |||||||
CC-WMX-ET7D-NN | 227.3550 | 1434 | 0.00000000 | Digi | ConnectCore® 8M Mini | Box | Active | -40°C ~ 85°C | 1.770" L x 1.570" W (45.00mm x 40.00mm) | CC-WMX | - | 1 (Unlimited) | REACH Unaffected | 602-CC-WMX-ET7D-NN | 5A992C | 8471.50.0150 | 50 | ARM® Cortex®-A53, ARM® Cortex®-M4, i.MX8 | 1.6GHz | 1GB | - | MPU Core | - | USB | ||||
M5475BFE | - | 3928 | 0.00000000 | NXP USA Inc. | ColdFire® | Bulk | Obsolete | 0°C ~ 70°C | 3.700" L x 4.500" W (93.40mm x 114.30mm) | M5475 | - | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 | 8471.50.0150 | 1 | ColdFire V4e, MCF5475 | 266MHz | 64MB | 16MB | MPU Core | - | - | ||||
EDM1-IMX6Q-MSD-BW | 148.5120 | 1280 | 0.00000000 | Wandboard.Org | - | Box | Active | - | 2.360" L x 3.230" W (60.00mm x 82.00mm) | EDM1-IMX6 | - | ROHS3 Compliant | 1 (Unlimited) | 5A002A1 | 8471.50.0150 | 10 | ARM® Cortex®-A9, i.MX6Quad | - | 2GB | - | MPU Core | - | EDM Connector | |||||
101-0518 | - | 1829 | 0.00000000 | Digi | RabbitCore® | Obsolete | -40°C ~ 85°C | 1.850" L x 1.650" W (47.00mm x 42.00mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 5A002A1 DIG | 8471.41.0150 | 50 | Rabbit 3000 | 29.4MHz | 128KB | 256KB | MPU Core | - | 2 IDC Headers 2x17 | ||||||
XPP1004000-02R | 58.4800 | 1 | 0.00000000 | Lantronix, Inc. | XPort® Pro | Tray | Not For New Designs | -40°C ~ 85°C | 0.630" L x 1.330" W (16.00mm x 33.90mm) | XPP1004000 | download | ROHS3 Compliant | Not Applicable | 5A002A1 LAN | 8517.62.0090 | 50 | IPv6 | - | 16MB | 16MB | MPU Core | XPort® Pro Lx6 | RJ45 | |||||
TE0712-02-82C36-P | - | 2843 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-P | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
EC-V-H264-10B-60-1080-MXC-LL | - | 5983 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.700" L x 2.000" W (68.00mm x 51.00mm) | download | RoHS Compliant | 0000.00.0000 | 1 | Artix-7 A200T | - | 256KB | 32MB | FPGA Core | - | SO-DIMM-204 | ||||||||
AM0010-02-3BE21MA | 572.0000 | 3177 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-3BE21MA | 1 | Zynq™ UltraScale+™ ZU3EG-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||||
DC-EM-02T-JT | - | 3258 | 0.00000000 | Digi | Digi Connect EM® | Box | Obsolete | -40°C ~ 85°C | 1.940" L x 1.580" W (49.20mm x 40.00mm) | download | 1 (Unlimited) | REACH Unaffected | 5A002A1 | 8473.30.1180 | 1 | ARM7TDMI, NS7520 | 55MHz | 8MB | 4MB | MPU Core | - | Pin Header |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse